IT8523417A0 - Procedimento per la valutazione dei parametri di processo nella fabbricazione di dispositivi a semiconduttore. - Google Patents
Procedimento per la valutazione dei parametri di processo nella fabbricazione di dispositivi a semiconduttore.Info
- Publication number
- IT8523417A0 IT8523417A0 IT8523417A IT2341785A IT8523417A0 IT 8523417 A0 IT8523417 A0 IT 8523417A0 IT 8523417 A IT8523417 A IT 8523417A IT 2341785 A IT2341785 A IT 2341785A IT 8523417 A0 IT8523417 A0 IT 8523417A0
- Authority
- IT
- Italy
- Prior art keywords
- evaluation
- procedure
- manufacture
- semiconductor devices
- process parameters
- Prior art date
Links
- 238000000034 method Methods 0.000 title 2
- 238000011156 evaluation Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R17/00—Measuring arrangements involving comparison with a reference value, e.g. bridge
- G01R17/02—Arrangements in which the value to be measured is automatically compared with a reference value
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT23417/85A IT1186523B (it) | 1985-12-31 | 1985-12-31 | Procedimento per la valutazione dei parametri di processo nella fabbricazione di dispositivi a semiconduttore |
NL8603277A NL8603277A (nl) | 1985-12-31 | 1986-12-23 | Werkwijze voor het evalueren van bewerkingsparameters bij de vervaardiging van halfgeleiderinrichtingen. |
DE3644458A DE3644458C2 (de) | 1985-12-31 | 1986-12-24 | Verfahren zum Auswerten der Prozeßparameter bei der Herstellung von Halbleiteranordnungen sowie Anordnungen dafür |
US06/946,239 US4782288A (en) | 1985-12-31 | 1986-12-24 | Method for evaluating processing parameters in the manufacture of semiconductor devices |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IT23417/85A IT1186523B (it) | 1985-12-31 | 1985-12-31 | Procedimento per la valutazione dei parametri di processo nella fabbricazione di dispositivi a semiconduttore |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8523417A0 true IT8523417A0 (it) | 1985-12-31 |
IT1186523B IT1186523B (it) | 1987-11-26 |
Family
ID=11206905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT23417/85A IT1186523B (it) | 1985-12-31 | 1985-12-31 | Procedimento per la valutazione dei parametri di processo nella fabbricazione di dispositivi a semiconduttore |
Country Status (4)
Country | Link |
---|---|
US (1) | US4782288A (it) |
DE (1) | DE3644458C2 (it) |
IT (1) | IT1186523B (it) |
NL (1) | NL8603277A (it) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5043988A (en) * | 1989-08-25 | 1991-08-27 | Mcnc | Method and apparatus for high precision weighted random pattern generation |
US6005406A (en) * | 1995-12-07 | 1999-12-21 | International Business Machines Corporation | Test device and method facilitating aggressive circuit design |
JP3363082B2 (ja) * | 1997-12-05 | 2003-01-07 | 株式会社東芝 | パターンの合わせずれの電気的測定方法 |
US6429667B1 (en) * | 2000-06-19 | 2002-08-06 | International Business Machines Corporation | Electrically testable process window monitor for lithographic processing |
US6462818B1 (en) | 2000-06-22 | 2002-10-08 | Kla-Tencor Corporation | Overlay alignment mark design |
US7068833B1 (en) * | 2000-08-30 | 2006-06-27 | Kla-Tencor Corporation | Overlay marks, methods of overlay mark design and methods of overlay measurements |
US7541201B2 (en) | 2000-08-30 | 2009-06-02 | Kla-Tencor Technologies Corporation | Apparatus and methods for determining overlay of structures having rotational or mirror symmetry |
US6486954B1 (en) | 2000-09-01 | 2002-11-26 | Kla-Tencor Technologies Corporation | Overlay alignment measurement mark |
US7804994B2 (en) * | 2002-02-15 | 2010-09-28 | Kla-Tencor Technologies Corporation | Overlay metrology and control method |
US7075639B2 (en) | 2003-04-25 | 2006-07-11 | Kla-Tencor Technologies Corporation | Method and mark for metrology of phase errors on phase shift masks |
US7346878B1 (en) | 2003-07-02 | 2008-03-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for providing in-chip microtargets for metrology or inspection |
US7608468B1 (en) * | 2003-07-02 | 2009-10-27 | Kla-Tencor Technologies, Corp. | Apparatus and methods for determining overlay and uses of same |
US7557921B1 (en) | 2005-01-14 | 2009-07-07 | Kla-Tencor Technologies Corporation | Apparatus and methods for optically monitoring the fidelity of patterns produced by photolitographic tools |
WO2008020402A2 (en) * | 2006-08-17 | 2008-02-21 | Nxp B.V. | Testing for correct undercutting of an electrode during an etching step |
US9927718B2 (en) | 2010-08-03 | 2018-03-27 | Kla-Tencor Corporation | Multi-layer overlay metrology target and complimentary overlay metrology measurement systems |
US10890436B2 (en) | 2011-07-19 | 2021-01-12 | Kla Corporation | Overlay targets with orthogonal underlayer dummyfill |
US10078107B2 (en) * | 2015-10-27 | 2018-09-18 | Globalfoundries Inc. | Wafer level electrical test for optical proximity correction and/or etch bias |
US10451412B2 (en) | 2016-04-22 | 2019-10-22 | Kla-Tencor Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2473789A1 (fr) * | 1980-01-09 | 1981-07-17 | Ibm France | Procedes et structures de test pour circuits integres a semi-conducteurs permettant la determination electrique de certaines tolerances lors des etapes photolithographiques. |
JPS5789220A (en) * | 1980-11-25 | 1982-06-03 | Hitachi Ltd | Positioning method and marking for positioning |
US4399205A (en) * | 1981-11-30 | 1983-08-16 | International Business Machines Corporation | Method and apparatus for determining photomask alignment |
US4538105A (en) * | 1981-12-07 | 1985-08-27 | The Perkin-Elmer Corporation | Overlay test wafer |
US4516071A (en) * | 1982-07-26 | 1985-05-07 | The United States Of America As Represented By The Administration Of The United States National Aeronautics And Space Administration | Split-cross-bridge resistor for testing for proper fabrication of integrated circuits |
JPS5948924A (ja) * | 1982-09-14 | 1984-03-21 | Nec Corp | 電子線露光用位置合せマ−ク |
US4475811A (en) * | 1983-04-28 | 1984-10-09 | The Perkin-Elmer Corporation | Overlay test measurement systems |
JPS59232416A (ja) * | 1983-06-16 | 1984-12-27 | Oki Electric Ind Co Ltd | アライメントマ−ク |
-
1985
- 1985-12-31 IT IT23417/85A patent/IT1186523B/it active
-
1986
- 1986-12-23 NL NL8603277A patent/NL8603277A/nl not_active Application Discontinuation
- 1986-12-24 US US06/946,239 patent/US4782288A/en not_active Expired - Lifetime
- 1986-12-24 DE DE3644458A patent/DE3644458C2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
IT1186523B (it) | 1987-11-26 |
DE3644458A1 (de) | 1987-07-02 |
NL8603277A (nl) | 1987-07-16 |
DE3644458C2 (de) | 1996-05-30 |
US4782288A (en) | 1988-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19961227 |