NL8603277A - Werkwijze voor het evalueren van bewerkingsparameters bij de vervaardiging van halfgeleiderinrichtingen. - Google Patents

Werkwijze voor het evalueren van bewerkingsparameters bij de vervaardiging van halfgeleiderinrichtingen. Download PDF

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Publication number
NL8603277A
NL8603277A NL8603277A NL8603277A NL8603277A NL 8603277 A NL8603277 A NL 8603277A NL 8603277 A NL8603277 A NL 8603277A NL 8603277 A NL8603277 A NL 8603277A NL 8603277 A NL8603277 A NL 8603277A
Authority
NL
Netherlands
Prior art keywords
resistive
arms
width
layer
test
Prior art date
Application number
NL8603277A
Other languages
English (en)
Dutch (nl)
Original Assignee
Sgs Microelettronica Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sgs Microelettronica Spa filed Critical Sgs Microelettronica Spa
Publication of NL8603277A publication Critical patent/NL8603277A/nl

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R17/00—Measuring arrangements involving comparison with a reference value, e.g. bridge
    • G01R17/02—Arrangements in which the value to be measured is automatically compared with a reference value

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
NL8603277A 1985-12-31 1986-12-23 Werkwijze voor het evalueren van bewerkingsparameters bij de vervaardiging van halfgeleiderinrichtingen. NL8603277A (nl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IT23417/85A IT1186523B (it) 1985-12-31 1985-12-31 Procedimento per la valutazione dei parametri di processo nella fabbricazione di dispositivi a semiconduttore
IT2341785 1985-12-31

Publications (1)

Publication Number Publication Date
NL8603277A true NL8603277A (nl) 1987-07-16

Family

ID=11206905

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8603277A NL8603277A (nl) 1985-12-31 1986-12-23 Werkwijze voor het evalueren van bewerkingsparameters bij de vervaardiging van halfgeleiderinrichtingen.

Country Status (4)

Country Link
US (1) US4782288A (it)
DE (1) DE3644458C2 (it)
IT (1) IT1186523B (it)
NL (1) NL8603277A (it)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5043988A (en) * 1989-08-25 1991-08-27 Mcnc Method and apparatus for high precision weighted random pattern generation
US6005406A (en) * 1995-12-07 1999-12-21 International Business Machines Corporation Test device and method facilitating aggressive circuit design
JP3363082B2 (ja) * 1997-12-05 2003-01-07 株式会社東芝 パターンの合わせずれの電気的測定方法
US6429667B1 (en) * 2000-06-19 2002-08-06 International Business Machines Corporation Electrically testable process window monitor for lithographic processing
US6462818B1 (en) 2000-06-22 2002-10-08 Kla-Tencor Corporation Overlay alignment mark design
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US7068833B1 (en) 2000-08-30 2006-06-27 Kla-Tencor Corporation Overlay marks, methods of overlay mark design and methods of overlay measurements
US6486954B1 (en) 2000-09-01 2002-11-26 Kla-Tencor Technologies Corporation Overlay alignment measurement mark
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
US7075639B2 (en) 2003-04-25 2006-07-11 Kla-Tencor Technologies Corporation Method and mark for metrology of phase errors on phase shift masks
US7608468B1 (en) * 2003-07-02 2009-10-27 Kla-Tencor Technologies, Corp. Apparatus and methods for determining overlay and uses of same
US7346878B1 (en) 2003-07-02 2008-03-18 Kla-Tencor Technologies Corporation Apparatus and methods for providing in-chip microtargets for metrology or inspection
US7557921B1 (en) 2005-01-14 2009-07-07 Kla-Tencor Technologies Corporation Apparatus and methods for optically monitoring the fidelity of patterns produced by photolitographic tools
WO2008020402A2 (en) * 2006-08-17 2008-02-21 Nxp B.V. Testing for correct undercutting of an electrode during an etching step
US9927718B2 (en) 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems
US10890436B2 (en) 2011-07-19 2021-01-12 Kla Corporation Overlay targets with orthogonal underlayer dummyfill
US10078107B2 (en) * 2015-10-27 2018-09-18 Globalfoundries Inc. Wafer level electrical test for optical proximity correction and/or etch bias
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2473789A1 (fr) * 1980-01-09 1981-07-17 Ibm France Procedes et structures de test pour circuits integres a semi-conducteurs permettant la determination electrique de certaines tolerances lors des etapes photolithographiques.
JPS5789220A (en) * 1980-11-25 1982-06-03 Hitachi Ltd Positioning method and marking for positioning
US4399205A (en) * 1981-11-30 1983-08-16 International Business Machines Corporation Method and apparatus for determining photomask alignment
US4538105A (en) * 1981-12-07 1985-08-27 The Perkin-Elmer Corporation Overlay test wafer
US4516071A (en) * 1982-07-26 1985-05-07 The United States Of America As Represented By The Administration Of The United States National Aeronautics And Space Administration Split-cross-bridge resistor for testing for proper fabrication of integrated circuits
JPS5948924A (ja) * 1982-09-14 1984-03-21 Nec Corp 電子線露光用位置合せマ−ク
US4475811A (en) * 1983-04-28 1984-10-09 The Perkin-Elmer Corporation Overlay test measurement systems
JPS59232416A (ja) * 1983-06-16 1984-12-27 Oki Electric Ind Co Ltd アライメントマ−ク

Also Published As

Publication number Publication date
DE3644458A1 (de) 1987-07-02
US4782288A (en) 1988-11-01
DE3644458C2 (de) 1996-05-30
IT8523417A0 (it) 1985-12-31
IT1186523B (it) 1987-11-26

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