KR890004819B1 - 수지봉합형 반도체장치의 제조방법 - Google Patents

수지봉합형 반도체장치의 제조방법 Download PDF

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Publication number
KR890004819B1
KR890004819B1 KR1019840007744A KR840007744A KR890004819B1 KR 890004819 B1 KR890004819 B1 KR 890004819B1 KR 1019840007744 A KR1019840007744 A KR 1019840007744A KR 840007744 A KR840007744 A KR 840007744A KR 890004819 B1 KR890004819 B1 KR 890004819B1
Authority
KR
South Korea
Prior art keywords
resin
lead
semiconductor device
outer lead
sealed semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
KR1019840007744A
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English (en)
Korean (ko)
Other versions
KR850006259A (ko
Inventor
이에 도시가즈 데
Original Assignee
가부시끼 가이샤 도오시바
사바 쇼오이찌
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼 가이샤 도오시바, 사바 쇼오이찌 filed Critical 가부시끼 가이샤 도오시바
Publication of KR850006259A publication Critical patent/KR850006259A/ko
Application granted granted Critical
Publication of KR890004819B1 publication Critical patent/KR890004819B1/ko
Expired legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/02—Deburring or deflashing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S83/00—Cutting
    • Y10S83/914—Flash trimming
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermal Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1019840007744A 1984-02-22 1984-12-07 수지봉합형 반도체장치의 제조방법 Expired KR890004819B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP59-32069 1984-02-22
JP59032069A JPS60176259A (ja) 1984-02-22 1984-02-22 樹脂封止形半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR850006259A KR850006259A (ko) 1985-10-02
KR890004819B1 true KR890004819B1 (ko) 1989-11-27

Family

ID=12348585

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019840007744A Expired KR890004819B1 (ko) 1984-02-22 1984-12-07 수지봉합형 반도체장치의 제조방법

Country Status (4)

Country Link
US (1) US4592131A (enExample)
JP (1) JPS60176259A (enExample)
KR (1) KR890004819B1 (enExample)
DE (1) DE3446647A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4862586A (en) * 1985-02-28 1989-09-05 Michio Osada Lead frame for enclosing semiconductor chips with resin
US4885837A (en) * 1988-01-13 1989-12-12 Mitsubishi Denki Kabushiki Kaisha Apparatus for forming leads of semiconductor devices
MX9205128A (es) * 1991-09-30 1993-04-01 Motorola Inc Metodo para procesar un bloque de circuito integrado semiconductor.
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
JP2590747B2 (ja) * 1994-07-29 1997-03-12 日本電気株式会社 半導体装置の製造方法
JPH10163237A (ja) * 1996-11-22 1998-06-19 Texas Instr Inc <Ti> 改良した集積回路チップ・パッケージング方法
JP3627846B2 (ja) * 1999-12-09 2005-03-09 矢崎総業株式会社 被覆電線端末接続部の防水処理装置
NL1018511C2 (nl) * 2001-07-11 2003-01-14 Fico Bv Werkwijze en inrichting voor het met een enkele bewerking uit een drager verwijderen van een dragerdeel, en een uit een drager verwijderd product.

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3539675A (en) * 1965-10-22 1970-11-10 Motorola Inc Method for encapsulating semiconductor devices
NL6605674A (enExample) * 1966-04-28 1967-10-30
IT1162038B (it) * 1978-10-05 1987-03-18 Necchi Spa Attuatore elettromeccanico applicato su macchine per cucire a comando elettronico
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
KR840003533A (ko) * 1982-01-07 1984-09-08 리챠드 에이취. 스케르벤 반도체용 플라스틱 패키지 리이드(package leads)위의 수지번짐을 화학적으로 제거하는 방법

Also Published As

Publication number Publication date
JPH0145228B2 (enExample) 1989-10-03
JPS60176259A (ja) 1985-09-10
US4592131A (en) 1986-06-03
DE3446647A1 (de) 1985-08-29
KR850006259A (ko) 1985-10-02
DE3446647C2 (enExample) 1990-02-01

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