KR890003076A - 전자기기 장치 - Google Patents

전자기기 장치 Download PDF

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Publication number
KR890003076A
KR890003076A KR1019880009778A KR880009778A KR890003076A KR 890003076 A KR890003076 A KR 890003076A KR 1019880009778 A KR1019880009778 A KR 1019880009778A KR 880009778 A KR880009778 A KR 880009778A KR 890003076 A KR890003076 A KR 890003076A
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Prior art keywords
electronic device
ceramic substrate
metallization layer
semiconductor element
aluminum
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KR1019880009778A
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KR910000336B1 (ko
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사또히데끼
노부유끼 미즈노야
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아오이 죠이찌
가부시끼가이샤 도시바
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Publication of KR890003076A publication Critical patent/KR890003076A/ko
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Publication of KR910000336B1 publication Critical patent/KR910000336B1/ko

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    • HELECTRICITY
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    • H01TSPARK GAPS; OVERVOLTAGE ARRESTERS USING SPARK GAPS; SPARKING PLUGS; CORONA DEVICES; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES
    • H01T13/00Sparking plugs
    • H01T13/20Sparking plugs characterised by features of the electrodes or insulation
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    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/838Bonding techniques
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  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ignition Installations For Internal Combustion Engines (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

내용 없음

Description

전자기기 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1도는 본 발명의 전자기기 장치의 점화장치의 주요부를 나타내는 단면도. 제 2도는 종래의 점화장치의 주요부를 나타내는 단면도. 제 3도는 각종소재의 온도와 열팽창률 관계를 나타내는 그래프.

Claims (7)

  1. 질화 알루미늄 소결체로 된 세리믹 기판과, 이 세라믹 기판상의 필요한 위치에 형성된 금속화층과 이 금속화층위에 탑재된 반도체소자와, 반도체 소자가 탑재된 세라믹기판을 수용하여 세라믹기판의 반도체소자 탑재면과 반대쪽면에 내열성 접착제로 접합되어 있는 금속재 수용용기를 구비하고, 이 금속제 수용용기내가 수지로 봉해져 있는 것을 특징으로 하는 전자기기 장치.
  2. 제 1항에 있어서, 내열성 접착제가 실리콘계 접착제인 것을 특징으로 하는 전자기기 장치.
  3. 제 2항에 있어서, 금속제 수용용기가 알루미늄제인 것을 특징으로 하는 전자기기 장치.
  4. 제 1항에 있어서, 질화알루미늄 소결체로 된 세라믹 기판은 20중량%이하의 소결조제 성분을 함유하고 있는 것을 특징으로 하는 전자기기 장치.
  5. 제 4항에 있어서, 소결조제는 희토류원소의 화합물, 알칼리토류원소의 화합물 및 산화알루미늄에서 선택된 적어도 한종류인 것을 특징으로 하는 전자기기 장치.
  6. 제 1항에 있어서, 금속화층은 MO, W 및 Ta에서 선택된 적어도 한종류와 주기율표의 제Ⅲ족 원소 및 제 Ⅳa원소에서 선택된 적어도 한종류를 구성원소로서 함유하는 층인것을 특징으로 하는 전자기기 장치.
  7. 제 1항에 있어서, 전자기기장치는 반도체 소자로서 점화시기제어 부품이 점화장치인 것을 특징으로 하는 전자기기 장치.
    ※참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880009778A 1987-07-30 1988-07-29 전자기기 장치 KR910000336B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP87-190801 1987-07-30
JP62190801A JPH0676790B2 (ja) 1987-07-30 1987-07-30 イグナイタ
JP?62-190801 1987-07-30

Publications (2)

Publication Number Publication Date
KR890003076A true KR890003076A (ko) 1989-04-12
KR910000336B1 KR910000336B1 (ko) 1991-01-24

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ID=16263969

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Application Number Title Priority Date Filing Date
KR1019880009778A KR910000336B1 (ko) 1987-07-30 1988-07-29 전자기기 장치

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US (1) US4901137A (ko)
EP (1) EP0301892A1 (ko)
JP (1) JPH0676790B2 (ko)
KR (1) KR910000336B1 (ko)

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US6081028A (en) * 1994-03-29 2000-06-27 Sun Microsystems, Inc. Thermal management enhancements for cavity packages
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US6624522B2 (en) * 2000-04-04 2003-09-23 International Rectifier Corporation Chip scale surface mounted device and process of manufacture
JP4756200B2 (ja) * 2000-09-04 2011-08-24 Dowaメタルテック株式会社 金属セラミックス回路基板
JP2003021647A (ja) * 2001-07-06 2003-01-24 Denso Corp 電子装置
US20030165667A1 (en) * 2002-02-22 2003-09-04 Didier Decker Tougher, softer nonwoven sheet product
JP4337570B2 (ja) 2004-02-10 2009-09-30 株式会社デンソー センサ装置およびその製造方法
JP4393312B2 (ja) * 2004-08-27 2010-01-06 富士通株式会社 半導体装置
US8573128B2 (en) * 2006-06-19 2013-11-05 Materials & Electrochemical Research Corp. Multi component reactive metal penetrators, and their method of manufacture
ES2612560T3 (es) * 2007-07-13 2017-05-17 Senju Metal Industry Co., Ltd Circuito electrónico montado en vehículo
JP4962570B2 (ja) * 2007-07-18 2012-06-27 千住金属工業株式会社 車載電子回路用In入り鉛フリーはんだ
JP4881971B2 (ja) * 2009-03-26 2012-02-22 株式会社豊田自動織機 半導体装置
CN104486901B (zh) * 2014-11-19 2016-03-23 株洲南车时代电气股份有限公司 散热绝缘衬板,包括该衬板的封装模块及其制作方法
DE102017214267A1 (de) * 2017-08-16 2019-02-21 Mahle International Gmbh Kühlvorrichtung und Verfahren zum Herstellen der Kühlvorrichtung

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Also Published As

Publication number Publication date
JPH0676790B2 (ja) 1994-09-28
KR910000336B1 (ko) 1991-01-24
JPS6435082A (en) 1989-02-06
EP0301892A1 (en) 1989-02-01
US4901137A (en) 1990-02-13

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