KR960030386A - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR960030386A KR960030386A KR1019960000776A KR19960000776A KR960030386A KR 960030386 A KR960030386 A KR 960030386A KR 1019960000776 A KR1019960000776 A KR 1019960000776A KR 19960000776 A KR19960000776 A KR 19960000776A KR 960030386 A KR960030386 A KR 960030386A
- Authority
- KR
- South Korea
- Prior art keywords
- semiconductor device
- oxide
- range
- weight ratio
- substrate
- Prior art date
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract 14
- 239000000919 ceramic Substances 0.000 claims abstract 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract 7
- 229910052802 copper Inorganic materials 0.000 claims abstract 7
- 239000010949 copper Substances 0.000 claims abstract 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract 5
- 230000017525 heat dissipation Effects 0.000 claims abstract 4
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract 4
- 229910001928 zirconium oxide Inorganic materials 0.000 claims abstract 4
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000000292 calcium oxide Substances 0.000 claims abstract 3
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract 3
- 229910000420 cerium oxide Inorganic materials 0.000 claims abstract 3
- 239000000395 magnesium oxide Substances 0.000 claims abstract 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 claims abstract 3
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000000843 powder Substances 0.000 claims abstract 3
- 239000002994 raw material Substances 0.000 claims abstract 3
- 239000000654 additive Substances 0.000 claims 7
- 230000000996 additive effect Effects 0.000 claims 6
- 239000002245 particle Substances 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
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- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
- C04B35/111—Fine ceramics
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- C04B35/119—Composites with zirconium oxide
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Abstract
본 발명은 원료비가 염가인 산화 알루미늄 분말체를 주재료로 하여, 기계적 강도를 높이며, 응력 완화의 특수한 구조를 채용하지 않고서 기판 자체의 박형화에 의해서 방열성의 개선이 도모될 수 있도록 한 반도체 장치를 제공하는 것을 목적으로 하며, 그 구성은 파워 트랜지스터·모듈에 이용하는 CBC(Ceramic Bonding Cupper)기판(2)은 세라믹스 기판(2a)의 내면 및 외면에 박형의 동판(2b,2c)을 예컨대 다이렉트 본드·컷퍼법에 의해 직접 접합한 것으로서, 상면측의 동판(2c)에 회로 패턴이 형성되어 있다. 세라믹스 기판(2a)은 산화 알루미늄을 주성분으로 하여 이것에 산화지르코늄을 첨가하고, 또 참가제로서 산화이트륨, 산화칼슘, 산화마그네슘, 산화세륨중 어느 하나를 각각 0.1~2wt%, 0.02~0.5wt%, 0.02~0.4wt%, 0.02~0.5wt% 첨가한 고온 소성체이다. 산화 알루미늄 단일체의 세라믹스 기판과 비교하여 특히 휨 강도가 대폭 높아지고, 열전도율이 한층 더 향상된다. 기판 자체의 박형화가 가능하고 방열성에 뛰어난 반도체 장치를 얻을 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제3도 (a)는 본 발명의 실시예에 관한 반도체 장치를 도시하는 부분 평면도이고, (b)는 제3도 (a)의 A-A' 선에 따라서 절단한 상태를 도시하는 부분 단면도.
Claims (14)
- 리드 프레임을 갖는 절열수지제의 케이스 틀과, 상기 케이스 틀의 한쪽의 개구를 폐쇄하는 금속제의 방열 베이스와, 상기 방열 베이스의 내면에 고착되어 상기 리드 프레임의 내부 리드 선단에 접속되는 반도체 소자가 실장된 절열기판과, 상기 케이스 틀의 내부 공간에 충전되어 상기 절열 기판 및 상기 내부 리드를 침지하는 겔형 수지 말봉재와, 상기 케이스 틀의 다른쪽의 개구를 뚜껑으로 폐쇄하는 절열수지제의 뚜껑을 가지며, 상기 절열 기판이 절연성 세라믹 기판의 외면과 내면에 접합하여 맞붙인 박(箔)형의 동판으로 이루어진 반도체 장치에 있어서, 상기 절연성 세라믹 기판은 산화 알루미늄을 주성분으로 하여 산화지르코늄을 첨가하고, 이것에 산화이트륨, 산화칼슘, 산화마그네슘, 산화세륨으로 이루어지는 군(群)에서 선택된 1종류 이상의 첨가제를 첨가하여 제작된 세라믹 소성체로 이루어지는 것을 특징으로 하는 반도체 장치.
- 제1항에 있어서, 상기 산화 알루미늄의 중량비가 70% 이상 100% 미만의 범위에, 상기 산화지르코늄의 중량비가 0%를 초과하여 30%까지의 범위에, 상기 선택된 첨가제의 총량의 중량비가 0.02% 이상 2% 이하의 범위에 있는 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 상기 선택된 첨가제는 산화이트륨으로서, 그 중량비는 0.1% 이상 2% 이하의 범위인 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 상기 선택된 첨가제는 산화칼슘으로서, 그 중량비는 0.02% 이상 0.5% 이하의 범위인 것을 특징으로 하는 반도체 장치.
- 제2항에 있어서, 상기 선택된 첨가제는 산화마그네슘으로서, 그 중량비는 0.02% 이상 0.4% 이하의 범위인 것을 특징으로 하는 반도체 장치
- 제2항에 있어서, 상기 선택된 첨가제는 산화세륨으로서, 그 중량비는 0.02% 이상 0.5% 이하의 범위인 것을 특징으로 하는 반도체 장치
- 제2항에 있어서, 적어도 상기 첨가제의 2종류가 첨가되어 있고, 그 총점가량의 mol%가 0.05% 이상 1.0% 이하의 범위에 있는 것을 특징으로 하는 반도체 장치
- 제3항 내지 제7항 중 어느 한 항에 있어서, 상기 산화 알루미늄의 중량비가 82% 이상 97% 이하의 범위이고, 상기 산화지르코늄의 중량비가 2.5% 이상 17.5% 이하의 범위인 것을 특징으로 하는 반도체 장치.
- 제1항 내지 제7항중 어느 한 항에 있어서, 상기 세라믹스 원료 분말체의 입자 직경은 0.5㎛ 이상 3㎛ 이하인 것을 특징으로 하는 반도체 장치.
- 제8항에 있어서, 상기 세라믹스 원료 분말체의 입자 직경은 0.5㎛ 이상 3㎛ 이하인 것을 특징으로 하는 반도체 장치.
- 제1항 내지 제7항중 어느 한 항에 있어서, 절연성 세라믹 기판의 외면과 내면에 박형의 동판을 접합하여 이루어지는 것을 특징으로 하는 반도체 장치.
- 제8항에 있어서, 절연성 세라믹 기판의 외면과 내면에 박형의 동판을 접합하여 이루어지는 것을 특징으로 하는 반도체 장치.
- 제9항에 있어서, 절연성 세라믹 기판의 외면과 내면에 박형의 동판을 접합하여 이루어지는 것을 특징으로 하는 반도체 장치.
- 제10항에 있어서, 절연성 세라믹 기판의 외면과 내면에 박형의 동판을 접합하여 이루어지는 것을 특징으로 하는 반도체 장치.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP95-006104 | 1995-01-19 | ||
JP07006104A JP3127754B2 (ja) | 1995-01-19 | 1995-01-19 | 半導体装置 |
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KR960030386A true KR960030386A (ko) | 1996-08-17 |
KR100363054B1 KR100363054B1 (ko) | 2003-02-05 |
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US (1) | US5869890A (ko) |
EP (1) | EP0723292A3 (ko) |
JP (1) | JP3127754B2 (ko) |
KR (1) | KR100363054B1 (ko) |
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DE19649798A1 (de) * | 1996-12-02 | 1998-06-04 | Abb Research Ltd | Leistungshalbleitermodul |
DE10062108B4 (de) * | 2000-12-13 | 2010-04-15 | Infineon Technologies Ag | Leistungsmodul mit verbessertem transienten Wärmewiderstand |
US6522859B1 (en) * | 2001-10-16 | 2003-02-18 | Xerox Corporation | Fiber removal device |
US6885562B2 (en) * | 2001-12-28 | 2005-04-26 | Medtronic Physio-Control Manufacturing Corporation | Circuit package and method for making the same |
US7754976B2 (en) | 2002-04-15 | 2010-07-13 | Hamilton Sundstrand Corporation | Compact circuit carrier package |
JP4057407B2 (ja) * | 2002-12-12 | 2008-03-05 | 三菱電機株式会社 | 半導体パワーモジュール |
JP4756165B2 (ja) * | 2004-08-26 | 2011-08-24 | Dowaメタルテック株式会社 | アルミニウム−セラミックス接合基板 |
US8120153B1 (en) | 2005-09-16 | 2012-02-21 | University Of Central Florida Research Foundation, Inc. | High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module |
JP2007165588A (ja) * | 2005-12-14 | 2007-06-28 | Omron Corp | パワーモジュール構造及びこれを用いたソリッドステートリレー |
US8253233B2 (en) * | 2008-02-14 | 2012-08-28 | Infineon Technologies Ag | Module including a sintered joint bonding a semiconductor chip to a copper surface |
HUE035758T2 (en) | 2009-04-03 | 2018-05-28 | Sumitomo Metal Smi Electronics Devices Inc | Sintered ceramic and substrate containing semiconductor material |
JP4766162B2 (ja) * | 2009-08-06 | 2011-09-07 | オムロン株式会社 | パワーモジュール |
US8776551B2 (en) * | 2011-05-23 | 2014-07-15 | Johns Manville | Transverse row bushings having ceramic supports |
JP2013032265A (ja) * | 2011-07-01 | 2013-02-14 | Maruwa Co Ltd | 半導体装置用アルミナジルコニア焼結基板及びその製造方法 |
CN102956576B (zh) * | 2011-08-29 | 2015-12-02 | 奇鋐科技股份有限公司 | 散热装置及其制造方法 |
TWI541488B (zh) * | 2011-08-29 | 2016-07-11 | 奇鋐科技股份有限公司 | 散熱裝置及其製造方法 |
JP6009295B2 (ja) * | 2012-09-21 | 2016-10-19 | 京セラクリスタルデバイス株式会社 | 水晶デバイス |
JP2015224151A (ja) * | 2014-05-27 | 2015-12-14 | Ngkエレクトロデバイス株式会社 | Cu/セラミック基板 |
US10037928B2 (en) * | 2015-01-29 | 2018-07-31 | Kyocera Corporation | Circuit board and electronic device |
JP6519305B2 (ja) * | 2015-05-11 | 2019-05-29 | 富士電機株式会社 | 封止材用シリコーン樹脂組成物及び該組成物を用いたパワー半導体モジュール |
JP7052426B2 (ja) * | 2018-03-02 | 2022-04-12 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
KR102098829B1 (ko) * | 2018-04-20 | 2020-04-09 | 나노팀 주식회사 | 고방열 탄소시트 및 이의 제조방법 |
EP3648156A1 (en) * | 2018-11-02 | 2020-05-06 | Infineon Technologies AG | Semiconductor substrate |
JP6602450B2 (ja) * | 2018-12-11 | 2019-11-06 | Ngkエレクトロデバイス株式会社 | Cu/セラミック基板 |
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JP2872273B2 (ja) * | 1989-06-26 | 1999-03-17 | 三菱電機株式会社 | セラミツク基板材料 |
DE4029066A1 (de) * | 1990-09-13 | 1992-03-19 | Friedrichsfeld Ag | Keramischer formkoerper |
JPH0590444A (ja) * | 1991-09-26 | 1993-04-09 | Toshiba Corp | セラミツクス回路基板 |
JPH05166969A (ja) * | 1991-10-14 | 1993-07-02 | Fuji Electric Co Ltd | 半導体装置 |
WO2004074210A1 (ja) * | 1992-07-03 | 2004-09-02 | Masanori Hirano | セラミックス-金属複合体およびその製造方法 |
JP2883787B2 (ja) * | 1993-07-20 | 1999-04-19 | 富士電機株式会社 | パワー半導体装置用基板 |
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- 1995-01-19 JP JP07006104A patent/JP3127754B2/ja not_active Expired - Lifetime
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1996
- 1996-01-17 KR KR1019960000776A patent/KR100363054B1/ko not_active IP Right Cessation
- 1996-01-19 EP EP96100790A patent/EP0723292A3/en not_active Withdrawn
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KR100363054B1 (ko) | 2003-02-05 |
EP0723292A3 (en) | 1997-07-30 |
JP3127754B2 (ja) | 2001-01-29 |
JPH08195458A (ja) | 1996-07-30 |
US5869890A (en) | 1999-02-09 |
EP0723292A2 (en) | 1996-07-24 |
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