KR880014670A - 저응력화 변성제 제조방법 및 본 병성제를 함유한 반도체 봉지용 에폭시 수지 조성물 - Google Patents

저응력화 변성제 제조방법 및 본 병성제를 함유한 반도체 봉지용 에폭시 수지 조성물 Download PDF

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KR880014670A
KR880014670A KR870005449A KR870005449A KR880014670A KR 880014670 A KR880014670 A KR 880014670A KR 870005449 A KR870005449 A KR 870005449A KR 870005449 A KR870005449 A KR 870005449A KR 880014670 A KR880014670 A KR 880014670A
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South Korea
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weight
epoxy resin
hydroxyl
mixture
type
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KR870005449A
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English (en)
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KR900006033B1 (ko
Inventor
이정대
유창준
김범성
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정상영
고려화학 주식회사
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Priority to KR1019870005449A priority Critical patent/KR900006033B1/ko
Publication of KR880014670A publication Critical patent/KR880014670A/ko
Priority to US07/394,156 priority patent/US5109067A/en
Application granted granted Critical
Publication of KR900006033B1 publication Critical patent/KR900006033B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/02—Copolymers with acrylonitrile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

내용 없음

Description

저응력화 변성제 제조방법 및 본 병성제를 함유한 반도체 봉지용 에폭시 수지 조성물
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의하여 제조된 구상입자의 확대사진이다.

Claims (8)

  1. 에폭시 수지 1종 또는 2종 이상 혼합한 화합물, 카르복실기, 아미노기를 분자 양말단에 갖고 있는 합성 고무 화합물을 1종 또는 2종 이상 혼합한 혼합물을 1차 반응시킨 후, 이 반응 혼합물에 분자내에 적어도 1개 이상의 히드록시기를 지니는 수산기 변성폴리실록산을 2차 반응시켜 불용불응의 구상입자를 10-50중량% 함유한 변성제를 제조하는 방법.
  2. 제1항에 있어서, 에폭시 수지는 분자내에 에폭시기를 2개 이상 함유한 비스페놀 A형, 페놀노블락형, 크레졸 노블락형 또는 이들의 혼합물인 방법.
  3. 제1항에 있어서, 합성고무 화합물은 분자 양말단에 히드록시기 카르복실기, 아미노기를 갖고 있는 부라디엔계 고무, 아크릴로 니트릴계고무, 이소프렌계고무, 소수첨가된 부타딘엔계고무 혹은 이들의 혼합물인 방법.
  4. 제1항에 있어서, 수산기 변성 폴리실록산은 분자내 알콕시기(탄소수 1-3), 알킬기(탄소수 1-6)을 갖고 있는 분자량 300-6,000이고, 수산기(-OH)가 2개 이상 함유한 것으로서 오일형, 레진형, 중간체형(intermediate)인 방법.
  5. 제1항에 있어서, 에폭시 수지의 1종 또는 2종 이상의 혼합물이 30-80중량%, 합성고무화합물의 1종 또는 2종 이상의 혼합물이 10-30중량%, 히드록시기를 갖고 있는 수산기 변성 폴리실록산이 10-60중량%인 방법.
  6. 제1항에 있어서, 1차 반응을 100°-200℃에서 1-10시간 반응시킨 후 2차 반응을 80-180℃로 2-6시간 반응시키는 방법.
  7. 제1항에 있어서, 불용불융의 구상입자는 크기가 0.1-100㎛인 방법.
  8. 에폭시 수지, 경화제, 경화촉매, 충진제 및 첨가제로 조정되는 반도체 봉지용 에폭시 수지 조성물 100중량%에 대하여 제1항의 방법에 따른 변성제를 0.1-10중량% 배합함을 특징으로 하는 반도체 봉지용 에폭시 수지 조성물.
    ※ 참고사항:최초출원 내용에 의하여 공개하는 것임.
KR1019870005449A 1987-05-30 1987-05-30 저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물 KR900006033B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1019870005449A KR900006033B1 (ko) 1987-05-30 1987-05-30 저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물
US07/394,156 US5109067A (en) 1987-05-30 1989-08-14 Process for the preparation of the modified resin and epoxy resin composition containing the modified resin for use in semiconductor encapsulation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019870005449A KR900006033B1 (ko) 1987-05-30 1987-05-30 저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물

Publications (2)

Publication Number Publication Date
KR880014670A true KR880014670A (ko) 1988-12-24
KR900006033B1 KR900006033B1 (ko) 1990-08-20

Family

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Application Number Title Priority Date Filing Date
KR1019870005449A KR900006033B1 (ko) 1987-05-30 1987-05-30 저응력화 변성제 제조방법 및 본 변성제를 함유한 반도체 봉지용 에폭시수지 조성물

Country Status (2)

Country Link
US (1) US5109067A (ko)
KR (1) KR900006033B1 (ko)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL101664A (en) * 1991-05-01 1996-01-31 Rohm & Haas Epoxy printing preparations for use in surface assembly
US5356993A (en) * 1993-07-12 1994-10-18 Shell Oil Company Coreactive conjugated diene polymer compositions which phase separate when cured
US5385984A (en) * 1993-10-21 1995-01-31 General Electric Company Polyarylene ether-organopolysiloxane copolymers
US5654081A (en) * 1995-07-05 1997-08-05 Ford Motor Company Integrated circuit assembly with polymeric underfill body
US6639025B2 (en) 2002-02-01 2003-10-28 Ameron International Corporation Elastomer-modified epoxy siloxane compositions
CN101903440B (zh) * 2007-12-18 2014-09-03 陶氏环球技术公司 包含硅氧烷聚醚的热固性组合物、它们的制造和用途

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3179143A (en) * 1960-02-29 1965-04-20 Minnesota Mining & Mfg Adhesive locked fastening devices
US3926904A (en) * 1974-09-30 1975-12-16 United Technologies Corp Curable crack-resistant epoxy resin
US3959533A (en) * 1975-03-25 1976-05-25 Owens-Illinois, Inc. Method of improving adhesion of rubbery copolymers to glass
JPS54139649A (en) * 1978-04-21 1979-10-30 Toray Silicone Co Ltd Compunded rubber composition
US4275190A (en) * 1980-01-08 1981-06-23 General Electric Company Latent heat-curable iodonium/copper salt-catalyzed epoxy resin compositions
JPS594657A (ja) * 1982-06-30 1984-01-11 Nitto Electric Ind Co Ltd ガス配管用エポキシ樹脂系ライニング材
JPS59113021A (ja) * 1982-12-21 1984-06-29 Toshiba Corp 半導体封止用エポキシ樹脂組成物
JPS6183628A (ja) * 1984-09-28 1986-04-28 Denki Kagaku Kogyo Kk Ｎｂ含有金属酸化物微粉末の製法
CA1235245A (en) * 1984-12-26 1988-04-12 Toshifumi Hirose Curable resinous composition comprising epoxy resin and silicon-containing elastomeric polymer
JPH0610240B2 (ja) * 1985-06-07 1994-02-09 宇部興産株式会社 ゴム変性エポキシ樹脂の製造方法

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Publication number Publication date
US5109067A (en) 1992-04-28
KR900006033B1 (ko) 1990-08-20

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