KR880006766A - 기판의 양면 세정장치 - Google Patents

기판의 양면 세정장치 Download PDF

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Publication number
KR880006766A
KR880006766A KR870012701A KR870012701A KR880006766A KR 880006766 A KR880006766 A KR 880006766A KR 870012701 A KR870012701 A KR 870012701A KR 870012701 A KR870012701 A KR 870012701A KR 880006766 A KR880006766 A KR 880006766A
Authority
KR
South Korea
Prior art keywords
cleaning
substrate
cleaning member
cleaning device
double side
Prior art date
Application number
KR870012701A
Other languages
English (en)
Other versions
KR910005735B1 (ko
Inventor
히사오 니시사와
Original Assignee
이시다 도쿠지로오
다이닛뽕스쿠링세이소오가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이시다 도쿠지로오, 다이닛뽕스쿠링세이소오가부시키가이샤 filed Critical 이시다 도쿠지로오
Publication of KR880006766A publication Critical patent/KR880006766A/ko
Application granted granted Critical
Publication of KR910005735B1 publication Critical patent/KR910005735B1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B11/00—Cleaning flexible or delicate articles by methods or apparatus specially adapted thereto
    • B08B11/02—Devices for holding articles during cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

내용 없음

Description

기판의 양면세정장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 기판의 양면세정장치의 하나의 실시예를 표시하는 요부 종단 개요도.
* 도면의 주요부분에 대한 부호의 설명
1 : 기판 2 : 세정반
3 : 불식부재 10 : 구동모터
12 : 세정액 공급장치 13 : 세정액공급원
14 : 전자(電磁)절환밸브 15 : 감압장치
16 : 부(負)압원

Claims (2)

  1. 다공성 탄성재료로서 형성한 원판상 불식부재를 근접대면시켜서 상대회전 가능하게 설치한 한쌍의 세정반과, 불식부재의 대향면 사이에 장착한 기판의 표리 각면에 세정액을 번갈아서 선택적으로 공급하는 세정액 공급수단이 구비되고, 상기 불식부재는 세정액이 공급되지 않는 하나의 불식부재로 기판을 지지하는 동안 기판의 양면을 번갈아서 세정하도록 배치하여서 구성됨을 특징으로 하는 기판의 양면 세정장치.
  2. 기판의 양면에 선택적으로 부(負)압력을 인가하는 감압수단을 세정액 공급수단에 병설하여 세정액을 공급하지 않는 쪽의 불식부재에 의한 기판을 흡착지지하도록 구성됨을 특징으로 하는 특허청구의 범위 제1항 기재의 기판의 양면세정장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019870012701A 1986-11-28 1987-11-11 기판의 양면세정장치 KR910005735B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61285395A JPH0695508B2 (ja) 1986-11-28 1986-11-28 基板の両面洗浄装置
JP285395 1986-11-28
JP86-285395 1986-11-28

Publications (2)

Publication Number Publication Date
KR880006766A true KR880006766A (ko) 1988-07-25
KR910005735B1 KR910005735B1 (ko) 1991-08-02

Family

ID=17690978

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019870012701A KR910005735B1 (ko) 1986-11-28 1987-11-11 기판의 양면세정장치

Country Status (4)

Country Link
US (1) US4811443A (ko)
JP (1) JPH0695508B2 (ko)
KR (1) KR910005735B1 (ko)
DE (1) DE3738957A1 (ko)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0612784B2 (ja) * 1989-09-08 1994-02-16 株式会社東芝 半導体製造装置クリーニング用基体
US5144711A (en) * 1991-03-25 1992-09-08 Westech Systems, Inc. Cleaning brush for semiconductor wafer
JPH05121385A (ja) * 1991-10-28 1993-05-18 Sharp Corp 洗浄装置
JP2571487B2 (ja) * 1991-12-27 1997-01-16 信越半導体株式会社 薄円板状ワークのスクラバー洗浄装置
DE4203913C2 (de) * 1992-02-11 1996-09-19 Fairchild Convac Gmbh Geraete Verfahren und Vorrichtung zum Aufbringen und/oder zum partiellen Entfernen einer dünnen Schicht auf ein bzw. von einem Substrat
US5311634A (en) * 1993-02-03 1994-05-17 Nicholas Andros Sponge cleaning pad
JP3427111B2 (ja) * 1994-05-13 2003-07-14 株式会社ニコン 半導体製造装置、および、液晶表示素子製造用装置
US5746234A (en) 1994-11-18 1998-05-05 Advanced Chemill Systems Method and apparatus for cleaning thin substrates
TW285721B (ko) * 1994-12-27 1996-09-11 Siemens Ag
US5624501A (en) * 1995-09-26 1997-04-29 Gill, Jr.; Gerald L. Apparatus for cleaning semiconductor wafers
DE69631258T2 (de) * 1995-10-13 2004-11-18 Lam Research Corp., Fremont Verfahren zum Entfernen von Verunreinigungen durch Bürsten
US5899799A (en) * 1996-01-19 1999-05-04 Micron Display Technology, Inc. Method and system to increase delivery of slurry to the surface of large substrates during polishing operations
US6135856A (en) * 1996-01-19 2000-10-24 Micron Technology, Inc. Apparatus and method for semiconductor planarization
US5778481A (en) * 1996-02-15 1998-07-14 International Business Machines Corporation Silicon wafer cleaning and polishing pads
US5675856A (en) * 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device
US5966766A (en) * 1997-10-06 1999-10-19 Advanced Micro Devices, Inc. Apparatus and method for cleaning semiconductor wafer
JP3654779B2 (ja) * 1998-01-06 2005-06-02 東京エレクトロン株式会社 基板洗浄具及び基板洗浄方法
US6308361B1 (en) * 1998-07-28 2001-10-30 Ebara Corporation Cleaning apparatus
US6093254A (en) * 1998-10-30 2000-07-25 Lam Research Corporation Method of HF-HF Cleaning
JP2000260740A (ja) * 1999-03-12 2000-09-22 Disco Abrasive Syst Ltd スピンナー洗浄装置
US6620257B1 (en) * 1999-06-30 2003-09-16 Hoya Corporation Scrub cleaning method for substrate and manufacturing method for information recording medium
KR100613919B1 (ko) 1999-07-26 2006-08-18 동경 엘렉트론 주식회사 기판세정구, 기판세정장치 및 기판세정방법
WO2004053952A1 (ja) * 2002-12-10 2004-06-24 Nikon Corporation 露光装置及びデバイス製造方法
US20050129977A1 (en) * 2003-12-12 2005-06-16 General Electric Company Method and apparatus for forming patterned coated films
JP6113960B2 (ja) 2012-02-21 2017-04-12 株式会社荏原製作所 基板処理装置および基板処理方法
US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
CN106964574A (zh) * 2017-04-28 2017-07-21 国网河南邓州市供电公司 一种电力保护屏清洗装置及使用方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4109337A (en) * 1977-12-08 1978-08-29 Machine Technology, Inc. Automated two-sided cleaning apparatus
JPS598352Y2 (ja) * 1979-05-28 1984-03-15 富士通株式会社 ガラスマスクの洗浄装置
JPS5632728A (en) * 1979-08-27 1981-04-02 Fujitsu Ltd Mask washing apparatus
JPS5779619A (en) * 1980-11-06 1982-05-18 Fujitsu Ltd Mask cleansing device
JPS583234A (ja) * 1981-06-29 1983-01-10 Seiko Epson Corp ガラスマスク洗浄装置
DE3135184A1 (de) * 1981-09-05 1983-03-17 Bayer Ag, 5090 Leverkusen Beschichtungen fuer thermoplaste
JPS598352A (ja) * 1982-07-05 1984-01-17 Nippon Gakki Seizo Kk 半導体装置の製法
JPS59170852U (ja) * 1983-04-28 1984-11-15 シャープ株式会社 フオトマスク洗浄装置

Also Published As

Publication number Publication date
JPH0695508B2 (ja) 1994-11-24
DE3738957C2 (ko) 1989-09-28
DE3738957A1 (de) 1988-06-09
JPS63137429A (ja) 1988-06-09
US4811443A (en) 1989-03-14
KR910005735B1 (ko) 1991-08-02

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Payment date: 19980728

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