KR880004571A - 프로그램 가능 반도체 메모리 장치 - Google Patents

프로그램 가능 반도체 메모리 장치

Info

Publication number
KR880004571A
KR880004571A KR1019860007531A KR860007531A KR880004571A KR 880004571 A KR880004571 A KR 880004571A KR 1019860007531 A KR1019860007531 A KR 1019860007531A KR 860007531 A KR860007531 A KR 860007531A KR 880004571 A KR880004571 A KR 880004571A
Authority
KR
South Korea
Prior art keywords
memory device
semiconductor memory
programmable semiconductor
programmable
semiconductor
Prior art date
Application number
KR1019860007531A
Other languages
English (en)
Other versions
KR900008019B1 (ko
Inventor
도시다까 후꾸시마
Original Assignee
후지쓰 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 후지쓰 가부시끼가이샤 filed Critical 후지쓰 가부시끼가이샤
Publication of KR880004571A publication Critical patent/KR880004571A/ko
Application granted granted Critical
Publication of KR900008019B1 publication Critical patent/KR900008019B1/ko

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/04Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
    • G11C16/0483Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells having several storage transistors connected in series
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C17/00Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
    • G11C17/14Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
    • G11C17/16Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using electrically-fusible links
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/101Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L28/00Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
    • H01L28/40Capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B20/00Read-only memory [ROM] devices
    • H10B20/20Programmable ROM [PROM] devices comprising field-effect components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B69/00Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Memories (AREA)
  • Read Only Memory (AREA)
KR1019860007531A 1985-09-09 1986-09-09 프로그램 가능 반도체 메모리 장치 KR900008019B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60-198760 1985-09-09
JP60198760A JPS6258673A (ja) 1985-09-09 1985-09-09 半導体記憶装置

Publications (2)

Publication Number Publication Date
KR880004571A true KR880004571A (ko) 1988-06-07
KR900008019B1 KR900008019B1 (ko) 1990-10-29

Family

ID=16396493

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019860007531A KR900008019B1 (ko) 1985-09-09 1986-09-09 프로그램 가능 반도체 메모리 장치

Country Status (4)

Country Link
US (1) US4922319A (ko)
EP (1) EP0216246A1 (ko)
JP (1) JPS6258673A (ko)
KR (1) KR900008019B1 (ko)

Families Citing this family (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5210598A (en) * 1988-08-23 1993-05-11 Seiko Epson Corporation Semiconductor element having a resistance state transition region of two-layer structure
US5466961A (en) * 1991-04-23 1995-11-14 Canon Kabushiki Kaisha Semiconductor device and method of manufacturing the same
US5557136A (en) * 1991-04-26 1996-09-17 Quicklogic Corporation Programmable interconnect structures and programmable integrated circuits
US5701027A (en) * 1991-04-26 1997-12-23 Quicklogic Corporation Programmable interconnect structures and programmable integrated circuits
US5196724A (en) * 1991-04-26 1993-03-23 Quicklogic Corporation Programmable interconnect structures and programmable integrated circuits
WO1992021154A1 (en) * 1991-05-10 1992-11-26 Quicklogic Corporation Amorphous silicon antifuses and methods for fabrication thereof
TW225044B (ko) * 1992-11-20 1994-06-11 Philips Electronics Nv
EP0599388B1 (en) * 1992-11-20 2000-08-02 Koninklijke Philips Electronics N.V. Semiconductor device provided with a programmable element
DE4336562A1 (de) * 1993-10-27 1995-05-04 Itt Ind Gmbh Deutsche Kurzschlußstruktur für CMOS-Schaltungen
JPH07263647A (ja) * 1994-02-04 1995-10-13 Canon Inc 電子回路装置
US5429972A (en) * 1994-05-09 1995-07-04 Advanced Micro Devices, Inc. Method of fabricating a capacitor with a textured polysilicon interface and an enhanced dielectric
US5610084A (en) * 1995-04-21 1997-03-11 U.S. Phillips Corporation Method of manufacturing an antifuse utilizing nitrogen implantation
US5545574A (en) * 1995-05-19 1996-08-13 Motorola, Inc. Process for forming a semiconductor device having a metal-semiconductor compound
AU2136197A (en) 1996-03-01 1997-09-16 Micron Technology, Inc. Novel vertical diode structures with low series resistance
US6750091B1 (en) * 1996-03-01 2004-06-15 Micron Technology Diode formation method
US5937310A (en) * 1996-04-29 1999-08-10 Advanced Micro Devices, Inc. Reduced bird's beak field oxidation process using nitrogen implanted into active region
US5882993A (en) 1996-08-19 1999-03-16 Advanced Micro Devices, Inc. Integrated circuit with differing gate oxide thickness and process for making same
US6033943A (en) * 1996-08-23 2000-03-07 Advanced Micro Devices, Inc. Dual gate oxide thickness integrated circuit and process for making same
US5872376A (en) * 1997-03-06 1999-02-16 Advanced Micro Devices, Inc. Oxide formation technique using thin film silicon deposition
US5962914A (en) * 1998-01-14 1999-10-05 Advanced Micro Devices, Inc. Reduced bird's beak field oxidation process using nitrogen implanted into active region
US6531364B1 (en) 1998-08-05 2003-03-11 Advanced Micro Devices, Inc. Advanced fabrication technique to form ultra thin gate dielectric using a sacrificial polysilicon seed layer
US6228696B1 (en) * 1998-11-05 2001-05-08 Vantis Corporation Semiconductor-oxide-semiconductor capacitor formed in integrated circuit
US7157314B2 (en) * 1998-11-16 2007-01-02 Sandisk Corporation Vertically stacked field programmable nonvolatile memory and method of fabrication
US6385074B1 (en) 1998-11-16 2002-05-07 Matrix Semiconductor, Inc. Integrated circuit structure including three-dimensional memory array
US6034882A (en) * 1998-11-16 2000-03-07 Matrix Semiconductor, Inc. Vertically stacked field programmable nonvolatile memory and method of fabrication
US6351406B1 (en) 1998-11-16 2002-02-26 Matrix Semiconductor, Inc. Vertically stacked field programmable nonvolatile memory and method of fabrication
US6888750B2 (en) * 2000-04-28 2005-05-03 Matrix Semiconductor, Inc. Nonvolatile memory on SOI and compound semiconductor substrates and method of fabrication
US8575719B2 (en) 2000-04-28 2013-11-05 Sandisk 3D Llc Silicon nitride antifuse for use in diode-antifuse memory arrays
US6631085B2 (en) 2000-04-28 2003-10-07 Matrix Semiconductor, Inc. Three-dimensional memory array incorporating serial chain diode stack
JP5792918B2 (ja) 2000-08-14 2015-10-14 サンディスク・スリー・ディ・リミテッド・ライアビリティ・カンパニーSandisk 3D Llc 高集積メモリデバイス
US6624011B1 (en) * 2000-08-14 2003-09-23 Matrix Semiconductor, Inc. Thermal processing for three dimensional circuits
US6580124B1 (en) 2000-08-14 2003-06-17 Matrix Semiconductor Inc. Multigate semiconductor device with vertical channel current and method of fabrication
US6627530B2 (en) 2000-12-22 2003-09-30 Matrix Semiconductor, Inc. Patterning three dimensional structures
US6661730B1 (en) 2000-12-22 2003-12-09 Matrix Semiconductor, Inc. Partial selection of passive element memory cell sub-arrays for write operation
US6817531B2 (en) * 2001-03-07 2004-11-16 Hewlett-Packard Development Company, L.P. Apparatus and methods for marking content of memory storage devices
US6545898B1 (en) 2001-03-21 2003-04-08 Silicon Valley Bank Method and apparatus for writing memory arrays using external source of high programming voltage
US6897514B2 (en) * 2001-03-28 2005-05-24 Matrix Semiconductor, Inc. Two mask floating gate EEPROM and method of making
US6646912B2 (en) * 2001-06-05 2003-11-11 Hewlett-Packard Development Company, Lp. Non-volatile memory
US6593624B2 (en) 2001-09-25 2003-07-15 Matrix Semiconductor, Inc. Thin film transistors with vertically offset drain regions
US6525953B1 (en) 2001-08-13 2003-02-25 Matrix Semiconductor, Inc. Vertically-stacked, field-programmable, nonvolatile memory and method of fabrication
US6841813B2 (en) * 2001-08-13 2005-01-11 Matrix Semiconductor, Inc. TFT mask ROM and method for making same
US7067850B2 (en) * 2001-10-16 2006-06-27 Midwest Research Institute Stacked switchable element and diode combination
US6700151B2 (en) * 2001-10-17 2004-03-02 Kilopass Technologies, Inc. Reprogrammable non-volatile memory using a breakdown phenomena in an ultra-thin dielectric
US6624485B2 (en) 2001-11-05 2003-09-23 Matrix Semiconductor, Inc. Three-dimensional, mask-programmed read only memory
US6853049B2 (en) 2002-03-13 2005-02-08 Matrix Semiconductor, Inc. Silicide-silicon oxide-semiconductor antifuse device and method of making
US20030183868A1 (en) * 2002-04-02 2003-10-02 Peter Fricke Memory structures
US6737675B2 (en) 2002-06-27 2004-05-18 Matrix Semiconductor, Inc. High density 3D rail stack arrays
US6807079B2 (en) * 2002-11-01 2004-10-19 Hewlett-Packard Development Company, L.P. Device having a state dependent upon the state of particles dispersed in a carrier
US20060249753A1 (en) * 2005-05-09 2006-11-09 Matrix Semiconductor, Inc. High-density nonvolatile memory array fabricated at low temperature comprising semiconductor diodes
US7177183B2 (en) 2003-09-30 2007-02-13 Sandisk 3D Llc Multiple twin cell non-volatile memory array and logic block structure and method therefor
US7699232B2 (en) * 2004-02-06 2010-04-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7663473B2 (en) * 2004-02-12 2010-02-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, IC card, IC tag, RFID, transponder, bills, securities, passport, electronic apparatus, bag, and clothes
EP1787242B1 (en) * 2004-09-10 2012-08-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7638855B2 (en) 2005-05-06 2009-12-29 Macronix International Co., Ltd. Anti-fuse one-time-programmable nonvolatile memory
US7539044B1 (en) * 2007-12-20 2009-05-26 Texas Instruments Incorporated Memory device with capacitor and diode
US20100283053A1 (en) * 2009-05-11 2010-11-11 Sandisk 3D Llc Nonvolatile memory array comprising silicon-based diodes fabricated at low temperature
KR101243837B1 (ko) * 2009-10-23 2013-03-20 한국전자통신연구원 다층 배선 연결 구조 및 그의 제조 방법
KR101067412B1 (ko) * 2009-10-27 2011-09-27 서울대학교산학협력단 일회 프로그램 가능한 비휘발성 메모리 어레이와 그 동작 및 제조방법
US9627395B2 (en) 2015-02-11 2017-04-18 Sandisk Technologies Llc Enhanced channel mobility three-dimensional memory structure and method of making thereof
US9478495B1 (en) 2015-10-26 2016-10-25 Sandisk Technologies Llc Three dimensional memory device containing aluminum source contact via structure and method of making thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3717852A (en) * 1971-09-17 1973-02-20 Ibm Electronically rewritable read-only memory using via connections
JPS53132281A (en) * 1977-04-22 1978-11-17 Nec Corp Semiconductor memory device
US4322822A (en) * 1979-01-02 1982-03-30 Mcpherson Roger K High density VMOS electrically programmable ROM
DE3036869C2 (de) * 1979-10-01 1985-09-05 Hitachi, Ltd., Tokio/Tokyo Integrierte Halbleiterschaltung und Schaltkreisaktivierverfahren
US4409608A (en) * 1981-04-28 1983-10-11 The United States Of America As Represented By The Secretary Of The Navy Recessed interdigitated integrated capacitor
DE3175263D1 (en) * 1981-06-25 1986-10-09 Ibm Electrically programmable read-only memory
US4419812A (en) * 1982-08-23 1983-12-13 Ncr Corporation Method of fabricating an integrated circuit voltage multiplier containing a parallel plate capacitor
US4649406A (en) * 1982-12-20 1987-03-10 Fujitsu Limited Semiconductor memory device having stacked capacitor-type memory cells
KR900001267B1 (ko) * 1983-11-30 1990-03-05 후지쓰 가부시끼가이샤 Soi형 반도체 장치의 제조방법
US4665295A (en) * 1984-08-02 1987-05-12 Texas Instruments Incorporated Laser make-link programming of semiconductor devices
US4701780A (en) * 1985-03-14 1987-10-20 Harris Corporation Integrated verticle NPN and vertical oxide fuse programmable memory cell

Also Published As

Publication number Publication date
KR900008019B1 (ko) 1990-10-29
EP0216246A1 (en) 1987-04-01
US4922319A (en) 1990-05-01
JPS6258673A (ja) 1987-03-14

Similar Documents

Publication Publication Date Title
KR880004571A (ko) 프로그램 가능 반도체 메모리 장치
KR860009491A (ko) 반도체 메모리 장치
KR860006106A (ko) 반도체 메모리
DE68926811D1 (de) Halbleiterspeicheranordnung
EP0202873A3 (en) Semiconductor memory device
EP0198590A3 (en) Semiconductor memory device
DE3855735D1 (de) Nichtflüchtige Halbleiterspeicheranordnung
KR870001664A (ko) 반도체 기억 장치
KR860005441A (ko) 반도체기억장치
KR860004478A (ko) 반도체 메모리 장치
DE69029013D1 (de) Programmierbare Halbleiterspeicheranordnung
KR860007755A (ko) 반도체 장치
KR860003606A (ko) 반도체 메모리 장치
DE68926124D1 (de) Halbleiterspeicheranordnung
EP0197505A3 (en) Semiconductor memory device
EP0209069A3 (en) Semiconductor memory device
DE3686933D1 (de) Programmierbares halbleiterspeichergeraet.
DE3486418D1 (de) Halbleiterspeicheranordnung
KR860007747A (ko) 다이내믹형 반도체기억장치
KR850008756A (ko) 반도체 메모리 장치
KR940008144B1 (en) Semiconductor memory device
KR860007744A (ko) 반도체 메모리장치
EP0197639A3 (en) Semiconductor memory device
EP0213835A3 (en) Semiconductor memory device
EP0193209A3 (en) Semiconductor memory device

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
G160 Decision to publish patent application
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 19970830

Year of fee payment: 8

LAPS Lapse due to unpaid annual fee