KR870007561A - 피검사물의 표면 검사 장치 - Google Patents

피검사물의 표면 검사 장치 Download PDF

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Publication number
KR870007561A
KR870007561A KR870000643A KR870000643A KR870007561A KR 870007561 A KR870007561 A KR 870007561A KR 870000643 A KR870000643 A KR 870000643A KR 870000643 A KR870000643 A KR 870000643A KR 870007561 A KR870007561 A KR 870007561A
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South Korea
Prior art keywords
inspection
inspection means
inspection apparatus
inspects
inspecting
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KR870000643A
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English (en)
Inventor
고우 오톰베
마사미츠 니시가와
Original Assignee
와타리 스기이치로
가부시키가이샤 도시바
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Application filed by 와타리 스기이치로, 가부시키가이샤 도시바 filed Critical 와타리 스기이치로
Publication of KR870007561A publication Critical patent/KR870007561A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Quality & Reliability (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

내용 없음

Description

피검사물의 표면 검사 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 일실시예를 나타내는 구성도,
제 2 도는 위에패 화상의 평면도,
제 3 도는 본 발명의 다른 실시예를 나타내는 구성도이다.

Claims (9)

  1. 피검사물(1)의 표면을 검사하는 장치에 있어서,
    상기 피검사물(1)의 넓은 표면을 어떤 한 해성도로 검사하는 제 1 의 검사수단(A)과,
    상기 피검사물(1)의 표면 중 특정점의 상태를 상기 제 1 의 검사수단(A)보다도 높은 해상도로 검사하는 제 2 의 검사수단(B) 및,
    상기 제 1 의 검사수단(A)에 의해 이상 위치가 발견된 다음에는 이 위치를 검사하기 위해 상기 제 2 의 검사수단(B)의 검사 위치를 제어하는 제어수단(6)을 구비하여서 된 것을 특징으로 하는 피검사물의 표면 검사 장치.
  2. 제 1 항에 있어서, 상기 제 2 의 검사수단(B)은 상기 제 1 의 검사수단(A)에 의한 검사 다음에 검사를 진행하도록 배치된 것을 특징으로 하는 피검사물의 표면 검사 장치.
  3. 제 1 항에 있어서, 상기 제 2 의 검사수단(B)은 상기 제 1 의 검사수단(A)에 의해 이상점을 발견할 수 없을 경우 특정점을 찾아서 검사하도록 된 것을 특징으로 하는 피검사물의 표면 검사 장치.
  4. 제 1 항에 있어서, 상기 제 1 의 검사수단(A)은 상기 피검사물(1)의 표면 전체의 상태를 검사하는 것을 특징으로 하는 피검사물의 표면 검사 장치.
  5. 제 1 항에 있어서, 상기 제 1 의 검사수단(A)은 상기 피검사물(1) 표면으로부터 반사되는 반사광을 검출해서 이상점들을 검사하는 것을 특징으로 하는 피검사물의 표면 검사 장치.
  6. 제 1 항에 있어서, 상기 제 1 의 검사수단(A)은 100㎛보다 더 큰 크기의 이상점을 검사하고, 상기 제 2 의 검사수단(B)은 1㎛보다 더 큰 크기의 이상점을 검사하는 것을 특징으로 하는 피검사물의 표면 검사 장치.
  7. 제 1 항에 있어서, 상기 피검사물(1)은 반도체 웨이퍼인 것을 특징으로 하는 피검사물의 표면 검사 장치.
  8. 제 7 항에 있어서, 상기 피검사물(1)은 다수의 마스크된 패턴 영역을 갖춘 반도체 웨이퍼인 것을 특징으로 하는 피검사물의 표면 검사 장치.
  9. 제 8 항에 있어서, 상기 제 2 의 검사수단(B)은 이상점이 상기 마스크된 패턴 영역 또는 그 이외의 부분에 존재할 경우 검사하게 됨을 특징으로 하는 피검사물의 표면 검사 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870000643A 1986-01-28 1987-01-27 피검사물의 표면 검사 장치 KR870007561A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14701 1986-01-28
JP61014701A JPS62173731A (ja) 1986-01-28 1986-01-28 被検査物の表面検査装置

Publications (1)

Publication Number Publication Date
KR870007561A true KR870007561A (ko) 1987-08-20

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ID=11868481

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870000643A KR870007561A (ko) 1986-01-28 1987-01-27 피검사물의 표면 검사 장치

Country Status (3)

Country Link
US (1) US4764969A (ko)
JP (1) JPS62173731A (ko)
KR (1) KR870007561A (ko)

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Also Published As

Publication number Publication date
JPS62173731A (ja) 1987-07-30
US4764969A (en) 1988-08-16

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