KR860009605A - 다층 세라믹 배선 회로 기판 및 그 제조방법 - Google Patents

다층 세라믹 배선 회로 기판 및 그 제조방법 Download PDF

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KR860009605A
KR860009605A KR1019860003946A KR860003946A KR860009605A KR 860009605 A KR860009605 A KR 860009605A KR 1019860003946 A KR1019860003946 A KR 1019860003946A KR 860003946 A KR860003946 A KR 860003946A KR 860009605 A KR860009605 A KR 860009605A
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wiring circuit
circuit board
multilayer ceramic
ceramic wiring
insulating substrate
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KR920000968B1 (ko
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노부유끼 우시푸사
사토루 오기하라
사토루 메기하라
코우세이 나가야마
히로이찌 시노하라
교죠 토다
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가부시기가이샤 히다찌세이사꾸쇼
미다 가쓰시게
가부시기 가이샤 히다찌세이사꾸쇼
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    • HELECTRICITY
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    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
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    • H01L2924/151Die mounting substrate
    • H01L2924/153Connection portion
    • H01L2924/1531Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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    • H05K3/4676Single layer compositions
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

내용 없음

Description

다층 세라믹 배선 회로 기판 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 1 도는 본 발명의 다층 세라믹 배선 회로 기판 및 이를 사용한 기능 모듈의 단면도.

Claims (11)

  1. 일체로 적층되는 다수의 세라믹 절연 기판층, 각 세라믹 절연기판 층상에 형성되는 소정 패턴을 가지는 도체층과 소정 패턴을 가진 각 도체층을 상호 연결하여 소정의 배선회로를 형성하도록 각 세라믹 기판층의 소정 위치에 형성한 관통공 도체들을 구비하며, 도체층과 관통공도체가 텅스텐이나 몰리브덴중의 어느 하나로 제조되게 한 다층 세라믹 배선 회로기판에 있어서, 멀라이트 결정과 알루미늄 산화물 및 이산화규소의 복합 산화물의 몰비를 1 : 0.7∼1로 조성하여 이루어진 세라믹 절연 기판층과, 결정 사이의 간극을 메꾸는 비정질 이산화규소와, 고용체의 결정 내에 용해된 알카리금속 산화물과 알카리 토류 금속 산화물로 이루어진 그룹으로부터 선택된 적어도 한 가지 이상의 물질들로 구성되게 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판.
  2. 제 1 항에 있어서, 복합 산화물이 실리마나이트, 안달러지트와 키아나이트로 이루어진 그룹으로부터 선택된 적어도 한 가지 이상의 물질로 되게 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판.
  3. 제 1 항에 있어서, 멀라이트 중의 알루미늄 산화물과 이산화규소의 몰비가 3∼4 : 2로 되게한 것을 특징으로 하는 다층 세라믹 배선 회로 기판.
  4. 내용 없음
  5. 제 1 항에 있어서, 세라믹 절연기판층의 유전율이 6.7 이하로 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판.
  6. 일체로 적층되는 다수의 세라믹 절연 기판층, 각 세라믹 절연기판 층상에 형성되는 소정 패턴을 가지는 도체층과, 소정 패턴을 가진 각 도체층을 상호 연결하여 소정의 배선회로를 형성하도록 각 세라믹 기판층의 소정 위치에 형성한 관통공 도체들을 구비하며, 도체층과 관통공도체가 텅스텐이나 몰리브덴중의 어느 하나로 제조되게 한 다층 세라믹 배선 회로기판을 제조하는 방법에 있어서, 평균 입자 크기가 5㎛인 70중량%의 멀라이트 분말, 평균입자 크기가 2㎛ 이하인 10∼30 중량%의 이산화규소 분말, 평균입자 크기가 1㎛ 이하인 15 중량% 이하의 알루미늄 산화물 분말과, 알카리금속 산화물과 알카리 토류 금속 산화물로 이루어진 그룹으로부터 선택된 적어도 한 가지 이상의 1중량% 이하의 금속 산화물 분말을 혼합하고, 소성 수축율이 도체층과 관통공 도체와 함께 동시에 일정하게 되는 온도 이상에서 가압 성형된 혼합물을 소성하며,그에 따라 제조된 세라믹 절연 기판층이 멀라이트,실리마나이트, 안다러지트와 키나이트의 결정, 결정들 사이의 간극을 메꾸는 비정질 이산화규소와 고용체의 결정 중에 실지로 용해된 알카리 금속 산화물 및 알카리 토류 금속 산화물로 이루어진 그룹으로부터 선택된 적어도 한 가지 이상의 물질로 이루어져서 열팽창계수가 40∼60×10-7/℃이고 유점율이 6.7 이하로 되게 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판을 제조하는 방법.
  7. 제 6 항에 있어서, 혼합물이 70-80 중량%의 멀라이트, 15-30 중량%의 이산화규소, 5중량% 이하의 산화 알루미늄과 1 중량% 이하의 산화 마그네슘들로 이루어지게 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판을 제조하는 방법.
  8. 제 7 항에 있어서, 혼합물이 72 중량%의 멀라이트, 25-27 중량%의 이산화규소, 1.0∼2.0 중량%의 이산화 알루미늄과 0.4∼0.8 중량%의 산화 마그네슘들로 이루어지게 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판을 제조하는 방법.
  9. 제 6 항에 있어서, 혼합물에서 멀라이트 중의 산화 알루미늄과 이산화 규소의 몰비가 3∼4 : 2로 되게 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판을 제조하는 방법.
  10. 제 6 항에 있어서, 소성온도가 1,550∼1,680℃로 되게 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판을 제조하는 방법.
  11. 제 610항에 있어서, 소성온도가 1,580∼1,620℃로 되게 한 것을 특징으로 하는 다층 세라믹 배선 회로 기판을 제조하는 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019860003946A 1985-05-21 1986-05-21 다층 세라믹 배선회로기판 및 그 제조방법 KR920000968B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP85-109112 1985-05-21
JP60109112A JPS61266350A (ja) 1985-05-21 1985-05-21 配線回路用セラミック基板
JP109112 1985-05-21

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KR860009605A true KR860009605A (ko) 1986-12-23
KR920000968B1 KR920000968B1 (ko) 1992-01-31

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KR1019860003946A KR920000968B1 (ko) 1985-05-21 1986-05-21 다층 세라믹 배선회로기판 및 그 제조방법

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US (1) US4736276A (ko)
EP (1) EP0202858B1 (ko)
JP (1) JPS61266350A (ko)
KR (1) KR920000968B1 (ko)
DE (1) DE3682824D1 (ko)

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JP2760541B2 (ja) * 1988-03-02 1998-06-04 新光電気工業株式会社 セラミック組成物
DE3814863A1 (de) * 1988-05-02 1989-11-16 Siemens Ag Verfahren zum herstellen von vielschichtenkeramik auf silikatbasis
US4914813A (en) * 1988-11-25 1990-04-10 Innovative Packing Technology Refurbishing of prior used laminated ceramic packages
USRE34291E (en) * 1989-09-27 1993-06-22 Gec-Marconi Electronic Systems Corp. Hybrid module electronics package
US4996630A (en) * 1989-09-27 1991-02-26 Plessey Electronic Systems Corp. Hybrid module electronics package
CA2036771A1 (en) * 1990-02-22 1991-09-30 Jun Inasaka Multilayer ceramic wiring substrate and pin connecting structure
JPH0829993B2 (ja) * 1991-09-23 1996-03-27 インターナショナル・ビジネス・マシーンズ・コーポレイション セラミツク複合構造及びその製造方法
JPH06169174A (ja) * 1992-08-17 1994-06-14 Praxair Technol Inc 多層セラミック構造物からのバインダー除去
US5673478A (en) * 1995-04-28 1997-10-07 Texas Instruments Incorporated Method of forming an electronic device having I/O reroute
US6081026A (en) * 1998-11-13 2000-06-27 Fujitsu Limited High density signal interposer with power and ground wrap
US6239485B1 (en) 1998-11-13 2001-05-29 Fujitsu Limited Reduced cross-talk noise high density signal interposer with power and ground wrap
US6762367B2 (en) * 2002-09-17 2004-07-13 International Business Machines Corporation Electronic package having high density signal wires with low resistance
CN100352319C (zh) * 2002-09-20 2007-11-28 日本特殊陶业株式会社 由树脂制成的带有插脚的电路板
JP4566866B2 (ja) * 2005-09-07 2010-10-20 新光電気工業株式会社 半導体パッケージ、半導体パッケージの実装構造、半導体パッケージの製造方法
CN108530021A (zh) * 2018-04-16 2018-09-14 广东金意陶陶瓷集团有限公司 一种高导热的电热瓷砖及制作方法
CN113646883A (zh) * 2019-03-29 2021-11-12 京瓷株式会社 布线基板、电子装置用封装件以及电子装置

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Also Published As

Publication number Publication date
US4736276A (en) 1988-04-05
EP0202858A3 (en) 1987-08-05
KR920000968B1 (ko) 1992-01-31
DE3682824D1 (de) 1992-01-23
EP0202858B1 (en) 1991-12-11
JPH0524107B2 (ko) 1993-04-06
EP0202858A2 (en) 1986-11-26
JPS61266350A (ja) 1986-11-26

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