KR840005924A - 모듀울형 반도체 장치 - Google Patents

모듀울형 반도체 장치 Download PDF

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Publication number
KR840005924A
KR840005924A KR1019830004654A KR830004654A KR840005924A KR 840005924 A KR840005924 A KR 840005924A KR 1019830004654 A KR1019830004654 A KR 1019830004654A KR 830004654 A KR830004654 A KR 830004654A KR 840005924 A KR840005924 A KR 840005924A
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KR
South Korea
Prior art keywords
chip
chips
circuit board
printed circuit
substrate
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KR1019830004654A
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English (en)
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KR870002065B1 (ko
Inventor
히데히꼬(외1) 아까사끼
Original Assignee
야마모도 다까마사
후지쓰 가부시끼 가이샤
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Publication of KR840005924A publication Critical patent/KR840005924A/ko
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Publication of KR870002065B1 publication Critical patent/KR870002065B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10522—Adjacent components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/165—Stabilizing, e.g. temperature stabilization

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

내용 없음

Description

모듀울형 반도체 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본발명의 한 실시예에 따른 모듀울형 반도체 장치에 대한 개략도.
제2도는 제1도 실시예의 배선도.
제3도는 본 발명의 다른 실시예에 따른 모듀울형 반도체 장치에 대한 정면도.

Claims (5)

  1. 인쇄회로기판상에 장착된 복수개의 IC칩으로 구성되는 모듀울형 반도체장치에 있어서, 상기 IC칩이 선택적으로 동작되는 최소한 두개의 그룹으로 나뉘어지고, 상기 한 그룹의 IC칩이 상기 IC칩의 동작으로 인한 상기 기판에서의 열상승에 대해 상기 인쇄회로 기판상에 실질적으로 균등한 온도분포를 제공하도록 상기 다른 그룹의 IC칩과 번갈아 배치되는 것을 특징으로 하는 모듀울형 반도체 장치.
  2. 제 1항에 있어서, 상기 한 그룹의 IC 칩은 상기 인쇄회로 기판의 공통 선택신호단자에 접속되는 반면상기 다른 그룹의 IC 칩은 상기 기판의 또 다른 공통선택 신호단자에 접속되며, 상기 두 그룹으로부터 상기 IC 칩의 쌍이 선택적인 동작을 위해 상기 기판의 공통데이타 출력단자에 접속되는 것을 특징으로 하는 모듀울형 반도체 장치.
  3. 제2항에 있어서, 상기 IC 칩이 상기 인쇄회로 기판의 한측면상에 장착되는 것은 특징으로 하는 모듀울형 반도체 장치.
  4. 제2항에 있어서, 상기 IC칩이 상기 인쇄회로기판의 양측면상에 장착되고 상기 각 그룹의 IC칩이 상기기판에 대해 엇갈린 관계로 배치되는 것을 특징으로 하는 모듀울형 반도체 장치.
  5. 제 2항에 있어서, 상기 IC칩이 상기 인쇄회로기판의 양측변상에 장착되고 IC칩의 상기 그룹이 상기기판상에 번갈아 배치된 부그룹으로 세분되는 것을 특징으로 하는 모듀울형 반도체 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019830004654A 1982-09-30 1983-09-30 모듀울형 반도체 장치 KR870002065B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP171260 1982-09-30
JP???57-171260 1982-09-30
JP57171260A JPS5961152A (ja) 1982-09-30 1982-09-30 半導体装置

Publications (2)

Publication Number Publication Date
KR840005924A true KR840005924A (ko) 1984-11-19
KR870002065B1 KR870002065B1 (ko) 1987-12-03

Family

ID=15920023

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019830004654A KR870002065B1 (ko) 1982-09-30 1983-09-30 모듀울형 반도체 장치

Country Status (6)

Country Link
US (1) US4689658A (ko)
EP (1) EP0110512B1 (ko)
JP (1) JPS5961152A (ko)
KR (1) KR870002065B1 (ko)
CA (1) CA1200321A (ko)
DE (1) DE3377686D1 (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4802099A (en) * 1986-01-03 1989-01-31 International Business Machines Corporation Physical parameter balancing of circuit islands in integrated circuit wafers
JP2960560B2 (ja) * 1991-02-28 1999-10-06 株式会社日立製作所 超小型電子機器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3459999A (en) * 1967-07-03 1969-08-05 Trw Inc Circuit module and assembly
US3815106A (en) * 1972-05-11 1974-06-04 S Wiedmann Flip-flop memory cell arrangement
DE2107549A1 (de) * 1970-02-19 1971-09-02 Texas Instruments Inc Trager einer elektronischen Schaltung mit einem Sammelsystem mit Warmeleitungs eigenschaften fur alle Richtungen
US3697831A (en) * 1970-12-28 1972-10-10 Us Navy Series electrical, parallel thermal gunn devices
DE2121865C3 (de) * 1971-05-04 1983-12-22 Ibm Deutschland Gmbh, 7000 Stuttgart Speicher-Adressierschaltung
JPS5229133A (en) * 1975-09-01 1977-03-04 Hitachi Ltd Wiring common-ownership type double xy memory array system
JPS5352322A (en) * 1976-10-25 1978-05-12 Toshiba Corp Memory unit
US4344156A (en) * 1980-10-10 1982-08-10 Inmos Corporation High speed data transfer for a semiconductor memory
JPS6059677B2 (ja) * 1981-08-19 1985-12-26 富士通株式会社 半導体記憶装置

Also Published As

Publication number Publication date
CA1200321A (en) 1986-02-04
KR870002065B1 (ko) 1987-12-03
DE3377686D1 (en) 1988-09-15
EP0110512B1 (en) 1988-08-10
EP0110512A2 (en) 1984-06-13
US4689658A (en) 1987-08-25
JPS5961152A (ja) 1984-04-07
EP0110512A3 (en) 1985-07-31

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