KR830006829A - 얇은 판형택로 구성된 휴대용 확인소자 - Google Patents

얇은 판형택로 구성된 휴대용 확인소자 Download PDF

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Publication number
KR830006829A
KR830006829A KR1019810002458A KR810002458A KR830006829A KR 830006829 A KR830006829 A KR 830006829A KR 1019810002458 A KR1019810002458 A KR 1019810002458A KR 810002458 A KR810002458 A KR 810002458A KR 830006829 A KR830006829 A KR 830006829A
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KR
South Korea
Prior art keywords
plate
portable
portable device
thin plate
identification device
Prior art date
Application number
KR1019810002458A
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English (en)
Other versions
KR860000738B1 (ko
Inventor
장 끌로드 몬니에르 미셀
아르망 몬네르아에 마르끄
포세 끌로드
르 마르샹 피에르
Original Assignee
디. 제이, 삭커스
엔. 브이. 필립스 글로 아이람펜파브리켄
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디. 제이, 삭커스, 엔. 브이. 필립스 글로 아이람펜파브리켄 filed Critical 디. 제이, 삭커스
Publication of KR830006829A publication Critical patent/KR830006829A/ko
Application granted granted Critical
Publication of KR860000738B1 publication Critical patent/KR860000738B1/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

내용 없음

Description

얇은 판 형태로 구성된 휴대용 확인소자
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 따른 플라스틱 카드의 단면도.
제2도는 플라스틱카드의 전면도.
제2도는 플라스틱카드의 평면도.
제3도는 얇은 금속판의 측면도.

Claims (10)

  1. 본문에서 설명되고 도면에서 예시된 바와 같이,
  2. 캡슈울과 디지탈데이타를 처리하기 위한 적어도 1개의 집적된 반도체 전자회로(3)를 포함하여 외부와의 접속을 위한 데이타단자를 갖는 휴대용 확인소자에 있어서, 상기 캡슈울이 얇은 판형태로 만들어지며 상기 얇은 판형태는 플리비닐크로라이드로된 앞판, 적어도 1개의 상기 전자회로를 수용하기 위한 구멍(2)이 제공된 중심판(1), 폴리비닐크로라이드로된 뒷판(6′)과 전자회로가 작동하는 동안 적어도 1개의 상기 전자회로 내에서 발산된 열을 받아 제거하기 위하여 금속으로된 또다른 판(7)이 적어도 1개의 상기 전자회로와 병렬로 배치되도록 상기 앞판과 뒷판 사이에 배치된 또다른 판(7)을 특징으로 하는 얇은 판형태로 구성된 휴대용 확인소자.
  3. 청구범위 1항에 청구된 바와같은 휴대용소자에 있어서, 플리비닐로된 중심판으로부터 돌출한 돌출부들을 수용하기 위한 다수의 구멍들이 또다른 판에 제공되는 것을 특징으로하는 얇은 판형태로 구성된 휴대용 확인소자.
  4. 청구범위 1항 또는 2항에 청구된 바와같은 휴대용 소자에 있어서, 적어도 1개의 상기 전자회로가 구멍이 뚫어져 양면이 금속화된 제5플리마이드 판상에 배열되며 플리 비닐로된 상기 중심판으로부터 돌출한 돌출부들을 수용하기 위한 다수의 제2구멍들이 제5플리마이드판에 제공되는 것을 특징으로 하는 얇은 판형태로구성된 휴대용 확인소자.
  5. 청구범위 1항, 2항 또는 3항에 청구된 바와같은 휴대용소자에 있어서, 상기 또다른 판이 금속으로 만들어지며 10내지 100마이크론의 두께를 갖는 것을 특징으로하는 얇은 판형태로 구성된 휴대용 확인소자.
  6. 청구범위 1항 내지 4항의 어떤 곳에서도 청구된 바와같은 휴대용소자에 있어서, 상기 홈이 캡슈울수지(2)로 채워지는 것을 특징으로하는 얇은 판형태로 구성된 휴대용 확인소자.
  7. 청구범위 1항 내지 5항의 어떤 곳에서도 청구된 바와같은 휴대용 소자에 있어서, 상기 또다른 판이 3보다 큰 길이/폭 비율을 가지며 상기 중심판과 뒷판 사이에 병렬로 배치되는 것을 특징으로 하는 얇은 판형태로 구성된 휴대용 확인소자.
  8. 청구범위 1항 내지 6항의 어떤 곳에서도 청구된 바와같은 휴대용소자에 있어서, 상기 중심판을 향하는 흐름을 제한하는 제한기로서 차단링이 상기 홈내에 제공되는 것을 특징으로하는 얇은 판형태로 구성된 휴대용 확인소자.
  9. 청구범위 1항 내지 7항의 어떤 곳에서도 청구된 바와같은 휴대용소자에 있어서, 전자지불카드로 사용하기 위한 얇은 판형태로 구성된 휴대용확인소자.
  10. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019810002458A 1980-07-09 1981-07-07 얇은 판 형태로 구성된 휴대용 확인소자 KR860000738B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8015303 1980-07-09
FR8015303A FR2486685B1 (fr) 1980-07-09 1980-07-09 Carte de paiement electronique et procede de realisation

Publications (2)

Publication Number Publication Date
KR830006829A true KR830006829A (ko) 1983-10-06
KR860000738B1 KR860000738B1 (ko) 1986-06-14

Family

ID=9244041

Family Applications (1)

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KR1019810002458A KR860000738B1 (ko) 1980-07-09 1981-07-07 얇은 판 형태로 구성된 휴대용 확인소자

Country Status (12)

Country Link
US (1) US4380699A (ko)
JP (1) JPS5748175A (ko)
KR (1) KR860000738B1 (ko)
CA (1) CA1161558A (ko)
CH (1) CH656471A5 (ko)
DE (1) DE3124332C2 (ko)
FR (1) FR2486685B1 (ko)
GB (1) GB2081950B (ko)
HK (1) HK98584A (ko)
IT (1) IT1200021B (ko)
SE (1) SE458314B (ko)
SG (1) SG77484G (ko)

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FR2337381A1 (fr) * 1975-12-31 1977-07-29 Honeywell Bull Soc Ind Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte
US4092697A (en) * 1976-12-06 1978-05-30 International Business Machines Corporation Heat transfer mechanism for integrated circuit package
DE2703714C2 (de) * 1977-01-29 1984-04-05 Hopt + Schuler, 7210 Rottweil Maschinell lesbarer Datenträger
FR2382101A1 (fr) * 1977-02-28 1978-09-22 Labo Electronique Physique Dispositif a semi-conducteur, comportant des pattes metalliques isolees
JPS5521257A (en) * 1978-08-02 1980-02-15 Tanto Kk Adiabatic precast material

Also Published As

Publication number Publication date
FR2486685B1 (fr) 1985-10-31
KR860000738B1 (ko) 1986-06-14
HK98584A (en) 1984-12-28
FR2486685A1 (fr) 1982-01-15
JPS5748175A (en) 1982-03-19
CA1161558A (en) 1984-01-31
DE3124332C2 (de) 1989-12-14
GB2081950B (en) 1984-08-15
SG77484G (en) 1985-04-26
SE458314B (sv) 1989-03-13
JPS6161440B2 (ko) 1986-12-25
GB2081950A (en) 1982-02-24
SE8104182L (sv) 1982-01-10
IT1200021B (it) 1989-01-05
DE3124332A1 (de) 1982-06-03
CH656471A5 (de) 1986-06-30
US4380699A (en) 1983-04-19
IT8122770A0 (it) 1981-07-06

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