KR830005718A - 마무리 된 웨이퍼들의 평탄성을 개량하는 방법 및 장치 - Google Patents

마무리 된 웨이퍼들의 평탄성을 개량하는 방법 및 장치 Download PDF

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Publication number
KR830005718A
KR830005718A KR1019810001005A KR810001005A KR830005718A KR 830005718 A KR830005718 A KR 830005718A KR 1019810001005 A KR1019810001005 A KR 1019810001005A KR 810001005 A KR810001005 A KR 810001005A KR 830005718 A KR830005718 A KR 830005718A
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carrier
wafers
turntable
wafer
flatness
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KR840002114B1 (ko
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제롬 왈쉬 로버트
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존 엘머 마우리
몬산토 캄파니
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F99/00—Subject matter not provided for in other groups of this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/015—Temperature control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

내용 없음

Description

연마된 웨이퍼의 평탄성을 개량 하는방법 및 장치
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 캐리어(carrier)에 장착된 웨이퍼(wafer)를 연마하는 방법을 수행하는 장치와 턴 테이블(Turn-table)치 마무리헤드(Head)에 대한 압력판 조합을 개략적으로 도시하는 대표적인 종래기술의 횡단면도.
제2도는 제1도의 선 2-2를 따라 취한 웨이퍼가 장착된 캐리어의 수직단면도.
제3도는 마무리패드(pad)를 지지하는 수냉된 굽어진 턴테이블과 웨이퍼와의 횡단 비평면 접촉을 도시하는 제1도에 도시된 장치의 확대단면도.
제4도는 본 발명에 따른 장치의 제 3도와 유사한 단면도.

Claims (14)

  1. 마무리된 웨이퍼 평탄성을 개량하는 방법에 있어서, 변형가능한 얇은 디스크 웨이퍼 캐리어 첫번째 표면을 회전가능한 탄성 패드 압력판 표면위에 진공장치하며, 상기 캐리어 두번째 표면은 그곳에 장치된 적어도 하나의 얇은 웨이퍼를 가지고, 탄성 패드 압력판 표면을 향해 안쪽으로 블록형태로 웨이퍼 캐리어를 변형하며, 오목캐리어 두번째 표면은 웨이퍼를 이송하고, 웨이퍼에 장치된 상기 오목캐리어 표면을 턴테이블에 장치된 회전가능한 마무리 표면과 접촉시키고, 턴 테이블은 가장자리 표면굽힘에 축으로 나타나며, 굽힘은 웨이퍼들의 접촉표면으로부터 멀어지고 회전가능하게 웨이퍼를 마무리하는 것을 포함하는 것으로 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  2. 1항에 따른 방법에 있어서, 마무리가 턴 테이블의 회전과 회전 가능한 압력판과 오목 캐리어 장치된 웨이퍼들의 마찰구동회전을 통해 이뤄지는 것을 특징으로 하는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  3. 1항에 따른 방법에 있어서, 턴테이블과 압력판 모두가 독립적으로 회전가능하게 구동되는 것으로 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  4. 1항에 따른 방법에 있어서, 변형 가능한 얇은 디스크 웨이퍼 캐리어가 캐리어 디스크 첫번째 표면과 압력판 사이에 놓이며 캐리어 디스크의 변형 제어를 증진시키는 진공실을 정의하는 탄성량과의 접촉을 통해 압력판에 진공장치되는 것으로 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  5. 4항에 따른 방법에 있어서, 압력판, 캐리어 및 웨이퍼들이 턴테이블 마무리 표면위에 위치되며 캐리어판이 회전의 축으로부터 가장자리까지 아래쪽으로 굽어지는 턴테이블을 향해 두번째 표면 오목으로 변형되는 것을 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  6. 1항에 따른 방법에 있어서, 웨이퍼들이 약 200에서 약 750㎛의 두께를 갖는 반도체 물질로 구성되는 것을 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  7. 6항에 따른 방법에 있어서, 물질이 실리콘인 것으로 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  8. 7항에 따른 방법에 있어서, 마무리된 웨이퍼가 약 2.5㎛보다 작은 방사상 경사를 갖는 것으로 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  9. 8항에 따른 방법에 있어서, 웨이퍼 평탄성 평균이 약 1.5㎛보다 작은 것으로 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  10. 마무리된 웨이퍼 평탄성을 개량하는 장치에 있어서, 회전가능한 압력판에 장치된 탄성링에 장치된 얇은 변형 가능한 캐리어 디스크, 실을 형성하는 상기 압력판과 탄성링과 첫번째 캐리어 표면, 캐리어 디스크를 실을 향해 안쪽으로 블록형태로 변형하기 위한 진공장치와 연결된 상기실, 오목한 두번째 표면에 장치된 웨이퍼들을 갖는 상기 변형된 캐리어, 턴테이블의 첫번째 표면과 마무리용 패드로부터 열을 뺏는 내부 냉각장치를 갖는 마무리용 패드 장치된 턴테이블과 회전할 수 있게 접촉할 수 있는 상기 웨이퍼들, 두번째 표면을 향해 턴테이블의 열적굽힘의 결과로 마무리중에 첫번째 표면보다 더 냉각된 턴테이블 두번째 표면을 포함하는 것으로 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  11. 10항에 따른 장치에 있어서, 웨이퍼들이 캐리어의 오목표면 왁스장치되는 것으로 특징된 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  12. 10항에 따른 장치에 있어서, 회전가능한 턴테이블이 웨이퍼 장치된 캐리어, 압력판의 마찰구동회전을 제공하는 것으로 특징되는 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  13. 10항에 따른 장치에 있어서, 웨이퍼들이 독립된 압력판 회전구동장치를 통해 회전되는 것으로 특징된 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
  14. 10항에 따른 장치에 있어서, 복수개의 압력판, 캐리어장치는 턴테이블과 접촉할 수 있으며, 다수의 장치는 턴테이블의 각각의 반경 크기에서 턴테이블과 접촉할 수 있는 것으로 특징된 마무리된 웨이퍼들의 평탄성을 개량하는 방법 및 장치.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019810001005A 1980-03-27 1981-03-27 연마된 웨이퍼의 평탄성 개량 장치 Expired KR840002114B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US134.714 1980-03-27
US06/134,714 US4313284A (en) 1980-03-27 1980-03-27 Apparatus for improving flatness of polished wafers
US134714 2002-04-29

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KR830005718A true KR830005718A (ko) 1983-09-09
KR840002114B1 KR840002114B1 (ko) 1984-11-15

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US (1) US4313284A (ko)
JP (1) JPS5720436A (ko)
KR (1) KR840002114B1 (ko)
DE (1) DE3112019A1 (ko)
GB (1) GB2072550B (ko)
IT (1) IT1137514B (ko)

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CN114346788A (zh) * 2020-09-28 2022-04-15 莱玛特·沃尔特斯有限公司 双面或单面加工机

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US4313284A (en) 1982-02-02
DE3112019C2 (ko) 1992-06-11
IT8120742A0 (it) 1981-03-26
IT1137514B (it) 1986-09-10
KR840002114B1 (ko) 1984-11-15
GB2072550A (en) 1981-10-07
JPH0112631B2 (ko) 1989-03-01
JPS5720436A (en) 1982-02-02
GB2072550B (en) 1983-07-27
DE3112019A1 (de) 1982-01-28

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