IT8120742A0 - Procedimento e dispositivo per migliorare la planarita' di fette sottili lucidate. - Google Patents
Procedimento e dispositivo per migliorare la planarita' di fette sottili lucidate.Info
- Publication number
- IT8120742A0 IT8120742A0 IT8120742A IT2074281A IT8120742A0 IT 8120742 A0 IT8120742 A0 IT 8120742A0 IT 8120742 A IT8120742 A IT 8120742A IT 2074281 A IT2074281 A IT 2074281A IT 8120742 A0 IT8120742 A0 IT 8120742A0
- Authority
- IT
- Italy
- Prior art keywords
- flatranity
- improving
- procedure
- thin slices
- polished thin
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/015—Temperature control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/134,714 US4313284A (en) | 1980-03-27 | 1980-03-27 | Apparatus for improving flatness of polished wafers |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8120742A0 true IT8120742A0 (it) | 1981-03-26 |
IT1137514B IT1137514B (it) | 1986-09-10 |
Family
ID=22464634
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT20742/81A IT1137514B (it) | 1980-03-27 | 1981-03-26 | Procedimento e dispositivo per migliorare la planarita' di fette sottili lucidate |
Country Status (6)
Country | Link |
---|---|
US (1) | US4313284A (it) |
JP (1) | JPS5720436A (it) |
KR (1) | KR840002114B1 (it) |
DE (1) | DE3112019A1 (it) |
GB (1) | GB2072550B (it) |
IT (1) | IT1137514B (it) |
Families Citing this family (65)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4450652A (en) * | 1981-09-04 | 1984-05-29 | Monsanto Company | Temperature control for wafer polishing |
US4680893A (en) * | 1985-09-23 | 1987-07-21 | Motorola, Inc. | Apparatus for polishing semiconductor wafers |
US4918870A (en) * | 1986-05-16 | 1990-04-24 | Siltec Corporation | Floating subcarriers for wafer polishing apparatus |
US4811522A (en) * | 1987-03-23 | 1989-03-14 | Gill Jr Gerald L | Counterbalanced polishing apparatus |
JP2628308B2 (ja) * | 1987-08-26 | 1997-07-09 | スピ−ドファム株式会社 | 平面研磨装置用加圧ヘッド |
JP2612012B2 (ja) * | 1987-11-16 | 1997-05-21 | 三菱マテリアル株式会社 | 研磨装置 |
JPH01159171A (ja) * | 1987-12-15 | 1989-06-22 | Toshiba Corp | 研磨定盤 |
US5357716A (en) * | 1988-10-20 | 1994-10-25 | Olympus Optical Company Limited | Holding device for holding optical element to be ground |
US5399528A (en) * | 1989-06-01 | 1995-03-21 | Leibovitz; Jacques | Multi-layer fabrication in integrated circuit systems |
US5291692A (en) * | 1989-09-14 | 1994-03-08 | Olympus Optical Company Limited | Polishing work holder |
US5127196A (en) * | 1990-03-01 | 1992-07-07 | Intel Corporation | Apparatus for planarizing a dielectric formed over a semiconductor substrate |
US5104828A (en) * | 1990-03-01 | 1992-04-14 | Intel Corporation | Method of planarizing a dielectric formed over a semiconductor substrate |
US5036630A (en) * | 1990-04-13 | 1991-08-06 | International Business Machines Corporation | Radial uniformity control of semiconductor wafer polishing |
GB9008531D0 (en) * | 1990-04-17 | 1990-06-13 | Logitech Ltd | Monitoring and control of surface curvature |
USRE36890E (en) * | 1990-07-31 | 2000-10-03 | Motorola, Inc. | Gradient chuck method for wafer bonding employing a convex pressure |
FR2677293A1 (fr) * | 1991-06-06 | 1992-12-11 | Commissariat Energie Atomique | Machine de polissage a tete support de plaquettes perfectionnee. |
US5267418A (en) * | 1992-05-27 | 1993-12-07 | International Business Machines Corporation | Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
EP0579298B1 (en) * | 1992-06-15 | 1997-09-03 | Koninklijke Philips Electronics N.V. | Method of manufacturing a plate having a plane main surface, method of manufacturing a plate having parallel main surfaces, and device suitable for implementing said methods |
TW227540B (it) * | 1992-06-15 | 1994-08-01 | Philips Electronics Nv | |
JP2655975B2 (ja) * | 1992-09-18 | 1997-09-24 | 三菱マテリアル株式会社 | ウェーハ研磨装置 |
US5377451A (en) * | 1993-02-23 | 1995-01-03 | Memc Electronic Materials, Inc. | Wafer polishing apparatus and method |
US5435772A (en) * | 1993-04-30 | 1995-07-25 | Motorola, Inc. | Method of polishing a semiconductor substrate |
US5329734A (en) * | 1993-04-30 | 1994-07-19 | Motorola, Inc. | Polishing pads used to chemical-mechanical polish a semiconductor substrate |
JP3311116B2 (ja) * | 1993-10-28 | 2002-08-05 | 株式会社東芝 | 半導体製造装置 |
US5733175A (en) * | 1994-04-25 | 1998-03-31 | Leach; Michael A. | Polishing a workpiece using equal velocity at all points overlapping a polisher |
US5605487A (en) * | 1994-05-13 | 1997-02-25 | Memc Electric Materials, Inc. | Semiconductor wafer polishing appartus and method |
US5607341A (en) * | 1994-08-08 | 1997-03-04 | Leach; Michael A. | Method and structure for polishing a wafer during manufacture of integrated circuits |
US5651724A (en) * | 1994-09-08 | 1997-07-29 | Ebara Corporation | Method and apparatus for polishing workpiece |
US5908530A (en) * | 1995-05-18 | 1999-06-01 | Obsidian, Inc. | Apparatus for chemical mechanical polishing |
US5658185A (en) * | 1995-10-25 | 1997-08-19 | International Business Machines Corporation | Chemical-mechanical polishing apparatus with slurry removal system and method |
US5851140A (en) * | 1997-02-13 | 1998-12-22 | Integrated Process Equipment Corp. | Semiconductor wafer polishing apparatus with a flexible carrier plate |
US6056632A (en) * | 1997-02-13 | 2000-05-02 | Speedfam-Ipec Corp. | Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head |
JPH10235552A (ja) * | 1997-02-24 | 1998-09-08 | Ebara Corp | ポリッシング装置 |
US6425812B1 (en) | 1997-04-08 | 2002-07-30 | Lam Research Corporation | Polishing head for chemical mechanical polishing using linear planarization technology |
US6244946B1 (en) | 1997-04-08 | 2001-06-12 | Lam Research Corporation | Polishing head with removable subcarrier |
US5885135A (en) * | 1997-04-23 | 1999-03-23 | International Business Machines Corporation | CMP wafer carrier for preferential polishing of a wafer |
US6110025A (en) * | 1997-05-07 | 2000-08-29 | Obsidian, Inc. | Containment ring for substrate carrier apparatus |
US6116990A (en) * | 1997-07-25 | 2000-09-12 | Applied Materials, Inc. | Adjustable low profile gimbal system for chemical mechanical polishing |
US6113479A (en) * | 1997-07-25 | 2000-09-05 | Obsidian, Inc. | Wafer carrier for chemical mechanical planarization polishing |
US5931719A (en) * | 1997-08-25 | 1999-08-03 | Lsi Logic Corporation | Method and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishing |
US5975998A (en) * | 1997-09-26 | 1999-11-02 | Memc Electronic Materials , Inc. | Wafer processing apparatus |
US5948699A (en) * | 1997-11-21 | 1999-09-07 | Sibond, L.L.C. | Wafer backing insert for free mount semiconductor polishing apparatus and process |
US6531397B1 (en) | 1998-01-09 | 2003-03-11 | Lsi Logic Corporation | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
US6106379A (en) * | 1998-05-12 | 2000-08-22 | Speedfam-Ipec Corporation | Semiconductor wafer carrier with automatic ring extension |
US5985094A (en) * | 1998-05-12 | 1999-11-16 | Speedfam-Ipec Corporation | Semiconductor wafer carrier |
US6129610A (en) * | 1998-08-14 | 2000-10-10 | International Business Machines Corporation | Polish pressure modulation in CMP to preferentially polish raised features |
US6187681B1 (en) * | 1998-10-14 | 2001-02-13 | Micron Technology, Inc. | Method and apparatus for planarization of a substrate |
JP3537688B2 (ja) * | 1998-11-24 | 2004-06-14 | 富士通株式会社 | 磁気ヘッドの加工方法 |
EP1614505B1 (en) * | 2000-01-31 | 2008-11-26 | Shin-Etsu Handotai Company Limited | Polishing method |
US6446948B1 (en) | 2000-03-27 | 2002-09-10 | International Business Machines Corporation | Vacuum chuck for reducing distortion of semiconductor and GMR head wafers during processing |
US6666756B1 (en) | 2000-03-31 | 2003-12-23 | Lam Research Corporation | Wafer carrier head assembly |
US6488565B1 (en) | 2000-08-29 | 2002-12-03 | Applied Materials, Inc. | Apparatus for chemical mechanical planarization having nested load cups |
US6755723B1 (en) | 2000-09-29 | 2004-06-29 | Lam Research Corporation | Polishing head assembly |
DE10054159A1 (de) * | 2000-11-02 | 2002-05-16 | Wacker Siltronic Halbleitermat | Verfahren zur Montage von Halbleiterscheiben |
US6394886B1 (en) * | 2001-10-10 | 2002-05-28 | Taiwan Semiconductor Manufacturing Company, Ltd | Conformal disk holder for CMP pad conditioner |
US7214548B2 (en) * | 2004-08-30 | 2007-05-08 | International Business Machines Corporation | Apparatus and method for flattening a warped substrate |
JP4902433B2 (ja) * | 2007-06-13 | 2012-03-21 | 株式会社荏原製作所 | 研磨装置の研磨面加熱、冷却装置 |
JP5038259B2 (ja) * | 2008-08-26 | 2012-10-03 | 株式会社日立ハイテクノロジーズ | クリーニング装置およびクリーニング方法 |
US20100112905A1 (en) * | 2008-10-30 | 2010-05-06 | Leonard Borucki | Wafer head template for chemical mechanical polishing and a method for its use |
JP5266507B2 (ja) * | 2011-02-28 | 2013-08-21 | アキム株式会社 | 部品搬送装置 |
JP6161999B2 (ja) * | 2013-08-27 | 2017-07-12 | 株式会社荏原製作所 | 研磨方法および研磨装置 |
CN105437076A (zh) * | 2014-08-27 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | 晶片轮廓实时控制方法和系统 |
JP6592355B2 (ja) * | 2015-01-30 | 2019-10-16 | 株式会社荏原製作所 | 連結機構および基板研磨装置 |
JP6376085B2 (ja) * | 2015-09-03 | 2018-08-22 | 信越半導体株式会社 | 研磨方法及び研磨装置 |
JP6312229B1 (ja) * | 2017-06-12 | 2018-04-18 | 信越半導体株式会社 | 研磨方法及び研磨装置 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2241478A (en) * | 1940-04-17 | 1941-05-13 | Joseph F Remington | Skiving machine |
US2405417A (en) * | 1943-07-09 | 1946-08-06 | Galvin Mfg Corp | Apparatus for grinding the surfaces of small objects |
US2869294A (en) * | 1957-07-02 | 1959-01-20 | Abrading Systems Company | Lapping machine |
US3170273A (en) * | 1963-01-10 | 1965-02-23 | Monsanto Co | Process for polishing semiconductor materials |
US3475867A (en) * | 1966-12-20 | 1969-11-04 | Monsanto Co | Processing of semiconductor wafers |
US3611654A (en) * | 1969-09-30 | 1971-10-12 | Alliance Tool & Die Corp | Polishing machine or similar abrading apparatus |
FR2097216A5 (it) * | 1970-05-27 | 1972-03-03 | Anvar | |
US3747282A (en) * | 1971-11-29 | 1973-07-24 | E Katzke | Apparatus for polishing wafers |
US3977130A (en) * | 1975-05-12 | 1976-08-31 | Semimetals, Inc. | Removal-compensating polishing apparatus |
-
1980
- 1980-03-27 US US06/134,714 patent/US4313284A/en not_active Expired - Lifetime
-
1981
- 1981-03-26 DE DE19813112019 patent/DE3112019A1/de active Granted
- 1981-03-26 GB GB8109447A patent/GB2072550B/en not_active Expired
- 1981-03-26 IT IT20742/81A patent/IT1137514B/it active
- 1981-03-26 JP JP4468681A patent/JPS5720436A/ja active Granted
- 1981-03-27 KR KR1019810001005A patent/KR840002114B1/ko active
Also Published As
Publication number | Publication date |
---|---|
DE3112019C2 (it) | 1992-06-11 |
IT1137514B (it) | 1986-09-10 |
KR830005718A (ko) | 1983-09-09 |
JPH0112631B2 (it) | 1989-03-01 |
GB2072550A (en) | 1981-10-07 |
US4313284A (en) | 1982-02-02 |
JPS5720436A (en) | 1982-02-02 |
DE3112019A1 (de) | 1982-01-28 |
GB2072550B (en) | 1983-07-27 |
KR840002114B1 (ko) | 1984-11-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970329 |