KR20250119666A - 기판 처리 장치 및 기판 처리 방법 - Google Patents

기판 처리 장치 및 기판 처리 방법

Info

Publication number
KR20250119666A
KR20250119666A KR1020257025640A KR20257025640A KR20250119666A KR 20250119666 A KR20250119666 A KR 20250119666A KR 1020257025640 A KR1020257025640 A KR 1020257025640A KR 20257025640 A KR20257025640 A KR 20257025640A KR 20250119666 A KR20250119666 A KR 20250119666A
Authority
KR
South Korea
Prior art keywords
wafer
substrate
insertion member
height position
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257025640A
Other languages
English (en)
Korean (ko)
Inventor
요헤이 야마와키
세이지 나카노
토쿠타로 하야시
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20250119666A publication Critical patent/KR20250119666A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H01L21/67092—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H01L21/67259—
    • H01L21/68—
    • H01L21/6838—
    • H01L21/78—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020257025640A 2020-04-20 2021-03-16 기판 처리 장치 및 기판 처리 방법 Pending KR20250119666A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2020074921 2020-04-20
JPJP-P-2020-074921 2020-04-20
KR1020227040132A KR102842163B1 (ko) 2020-04-20 2021-03-16 기판 처리 장치 및 기판 처리 방법
PCT/JP2021/010662 WO2021215145A1 (ja) 2020-04-20 2021-03-16 基板処理装置及び基板処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020227040132A Division KR102842163B1 (ko) 2020-04-20 2021-03-16 기판 처리 장치 및 기판 처리 방법

Publications (1)

Publication Number Publication Date
KR20250119666A true KR20250119666A (ko) 2025-08-07

Family

ID=78270699

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020257025640A Pending KR20250119666A (ko) 2020-04-20 2021-03-16 기판 처리 장치 및 기판 처리 방법
KR1020227040132A Active KR102842163B1 (ko) 2020-04-20 2021-03-16 기판 처리 장치 및 기판 처리 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020227040132A Active KR102842163B1 (ko) 2020-04-20 2021-03-16 기판 처리 장치 및 기판 처리 방법

Country Status (5)

Country Link
US (2) US12543525B2 (https=)
JP (2) JP7398554B2 (https=)
KR (2) KR20250119666A (https=)
CN (1) CN115398599A (https=)
WO (1) WO2021215145A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI855139B (zh) * 2019-10-28 2024-09-11 日商東京威力科創股份有限公司 基板處理方法及基板處理系統
JP2024030643A (ja) * 2022-08-24 2024-03-07 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JPWO2024241699A1 (https=) * 2023-05-23 2024-11-28
WO2025079432A1 (ja) * 2023-10-10 2025-04-17 東京エレクトロン株式会社 処理方法、処理システム及び検査装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019176589A1 (ja) 2018-03-14 2019-09-19 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093333A (ja) * 2004-09-22 2006-04-06 Disco Abrasive Syst Ltd 切削方法
EP1872392B1 (en) 2005-04-19 2012-02-22 Ebara Corporation Substrate processing apparatus
JP5988765B2 (ja) 2012-08-13 2016-09-07 ダイトエレクトロン株式会社 ウェーハの面取り加工方法、ウェーハの面取り加工装置および砥石角度調整用治具
JP5909453B2 (ja) * 2013-03-07 2016-04-26 東京エレクトロン株式会社 剥離装置、剥離システムおよび剥離方法
JP6182476B2 (ja) * 2014-02-17 2017-08-16 東京エレクトロン株式会社 気泡除去装置、気泡除去方法および接合システム
KR102305505B1 (ko) * 2014-09-29 2021-09-24 삼성전자주식회사 웨이퍼 서포팅 시스템 디본딩 이니시에이터 및 웨이퍼 서포팅 시스템 디본딩 방법
JP6475071B2 (ja) 2015-04-24 2019-02-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6537992B2 (ja) * 2016-03-30 2019-07-03 東京エレクトロン株式会社 基板処理装置、基板処理装置の制御方法、及び基板処理システム
JP6882033B2 (ja) 2017-03-29 2021-06-02 株式会社東京精密 ウェーハの位置決め装置及びそれを用いた面取り装置
KR102760744B1 (ko) * 2018-04-27 2025-02-03 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
KR102903523B1 (ko) * 2018-04-27 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
JP3225828U (ja) * 2020-01-28 2020-04-09 東京エレクトロン株式会社 回収ボックス

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019176589A1 (ja) 2018-03-14 2019-09-19 東京エレクトロン株式会社 基板処理システム、基板処理方法及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
JP7398554B2 (ja) 2023-12-14
CN115398599A (zh) 2022-11-25
US20260123330A1 (en) 2026-04-30
WO2021215145A1 (ja) 2021-10-28
US20230207344A1 (en) 2023-06-29
US12543525B2 (en) 2026-02-03
KR102842163B1 (ko) 2025-08-04
KR20230004673A (ko) 2023-01-06
JPWO2021215145A1 (https=) 2021-10-28
JP7611350B2 (ja) 2025-01-09
JP2024019282A (ja) 2024-02-08

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