JPWO2024241699A1 - - Google Patents
Info
- Publication number
- JPWO2024241699A1 JPWO2024241699A1 JP2025521834A JP2025521834A JPWO2024241699A1 JP WO2024241699 A1 JPWO2024241699 A1 JP WO2024241699A1 JP 2025521834 A JP2025521834 A JP 2025521834A JP 2025521834 A JP2025521834 A JP 2025521834A JP WO2024241699 A1 JPWO2024241699 A1 JP WO2024241699A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P54/00—Cutting or separating of wafers, substrates or parts of devices
- H10P54/30—Cutting or separating of wafers, substrates or parts of devices by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023084865 | 2023-05-23 | ||
| PCT/JP2024/012409 WO2024241699A1 (ja) | 2023-05-23 | 2024-03-27 | 基板処理方法及び基板処理システム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024241699A1 true JPWO2024241699A1 (https=) | 2024-11-28 |
| JPWO2024241699A5 JPWO2024241699A5 (https=) | 2026-02-06 |
Family
ID=93590080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025521834A Pending JPWO2024241699A1 (https=) | 2023-05-23 | 2024-03-27 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024241699A1 (https=) |
| KR (1) | KR20260014587A (https=) |
| CN (1) | CN121100394A (https=) |
| TW (1) | TW202512289A (https=) |
| WO (1) | WO2024241699A1 (https=) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118263105A (zh) | 2018-03-14 | 2024-06-28 | 东京毅力科创株式会社 | 基板处理系统、基板处理方法以及计算机存储介质 |
| KR102760744B1 (ko) | 2018-04-27 | 2025-02-03 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 및 기판 처리 방법 |
| KR102903523B1 (ko) | 2018-04-27 | 2025-12-23 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 및 기판 처리 방법 |
| JP7221076B2 (ja) * | 2019-02-18 | 2023-02-13 | 東京エレクトロン株式会社 | レーザー加工装置の設定方法、レーザー加工方法、レーザー加工装置、薄化システム、および基板処理方法 |
| CN115398599A (zh) * | 2020-04-20 | 2022-11-25 | 东京毅力科创株式会社 | 基板处理装置和基板处理方法 |
| JP7549551B2 (ja) * | 2021-03-08 | 2024-09-11 | キオクシア株式会社 | 半導体製造装置および半導体装置の製造方法 |
| JP7724137B2 (ja) * | 2021-11-04 | 2025-08-15 | 浜松ホトニクス株式会社 | レーザ加工装置、及び、レーザ加工方法 |
-
2024
- 2024-03-27 JP JP2025521834A patent/JPWO2024241699A1/ja active Pending
- 2024-03-27 CN CN202480031470.6A patent/CN121100394A/zh active Pending
- 2024-03-27 WO PCT/JP2024/012409 patent/WO2024241699A1/ja not_active Ceased
- 2024-03-27 KR KR1020257042001A patent/KR20260014587A/ko active Pending
- 2024-05-01 TW TW113116259A patent/TW202512289A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024241699A1 (ja) | 2024-11-28 |
| KR20260014587A (ko) | 2026-01-30 |
| CN121100394A (zh) | 2025-12-09 |
| TW202512289A (zh) | 2025-03-16 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251110 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251110 |