TW202512289A - 基板處理方法及基板處理系統 - Google Patents

基板處理方法及基板處理系統 Download PDF

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Publication number
TW202512289A
TW202512289A TW113116259A TW113116259A TW202512289A TW 202512289 A TW202512289 A TW 202512289A TW 113116259 A TW113116259 A TW 113116259A TW 113116259 A TW113116259 A TW 113116259A TW 202512289 A TW202512289 A TW 202512289A
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TW
Taiwan
Prior art keywords
peripheral
substrate
peripheral modified
wafer
zone
Prior art date
Application number
TW113116259A
Other languages
English (en)
Chinese (zh)
Inventor
山下陽平
溝本康隆
中尾淳一
Original Assignee
日商東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商東京威力科創股份有限公司 filed Critical 日商東京威力科創股份有限公司
Publication of TW202512289A publication Critical patent/TW202512289A/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H10P54/30—Cutting or separating of wafers, substrates or parts of devices by forming weakened zones for subsequent cutting or separating, e.g. by laser treatment or by ion implantation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Photovoltaic Devices (AREA)
TW113116259A 2023-05-23 2024-05-01 基板處理方法及基板處理系統 TW202512289A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-084865 2023-05-23
JP2023084865 2023-05-23

Publications (1)

Publication Number Publication Date
TW202512289A true TW202512289A (zh) 2025-03-16

Family

ID=93590080

Family Applications (1)

Application Number Title Priority Date Filing Date
TW113116259A TW202512289A (zh) 2023-05-23 2024-05-01 基板處理方法及基板處理系統

Country Status (5)

Country Link
JP (1) JPWO2024241699A1 (https=)
KR (1) KR20260014587A (https=)
CN (1) CN121100394A (https=)
TW (1) TW202512289A (https=)
WO (1) WO2024241699A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN118263105A (zh) 2018-03-14 2024-06-28 东京毅力科创株式会社 基板处理系统、基板处理方法以及计算机存储介质
KR102760744B1 (ko) 2018-04-27 2025-02-03 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
KR102903523B1 (ko) 2018-04-27 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
JP7221076B2 (ja) * 2019-02-18 2023-02-13 東京エレクトロン株式会社 レーザー加工装置の設定方法、レーザー加工方法、レーザー加工装置、薄化システム、および基板処理方法
CN115398599A (zh) * 2020-04-20 2022-11-25 东京毅力科创株式会社 基板处理装置和基板处理方法
JP7549551B2 (ja) * 2021-03-08 2024-09-11 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JP7724137B2 (ja) * 2021-11-04 2025-08-15 浜松ホトニクス株式会社 レーザ加工装置、及び、レーザ加工方法

Also Published As

Publication number Publication date
JPWO2024241699A1 (https=) 2024-11-28
WO2024241699A1 (ja) 2024-11-28
KR20260014587A (ko) 2026-01-30
CN121100394A (zh) 2025-12-09

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