CN115398599A - 基板处理装置和基板处理方法 - Google Patents

基板处理装置和基板处理方法 Download PDF

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Publication number
CN115398599A
CN115398599A CN202180028326.3A CN202180028326A CN115398599A CN 115398599 A CN115398599 A CN 115398599A CN 202180028326 A CN202180028326 A CN 202180028326A CN 115398599 A CN115398599 A CN 115398599A
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CN
China
Prior art keywords
substrate
wafer
height position
height
peripheral portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202180028326.3A
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English (en)
Chinese (zh)
Inventor
山胁阳平
中野征二
林德太郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN115398599A publication Critical patent/CN115398599A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
CN202180028326.3A 2020-04-20 2021-03-16 基板处理装置和基板处理方法 Pending CN115398599A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-074921 2020-04-20
JP2020074921 2020-04-20
PCT/JP2021/010662 WO2021215145A1 (ja) 2020-04-20 2021-03-16 基板処理装置及び基板処理方法

Publications (1)

Publication Number Publication Date
CN115398599A true CN115398599A (zh) 2022-11-25

Family

ID=78270699

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180028326.3A Pending CN115398599A (zh) 2020-04-20 2021-03-16 基板处理装置和基板处理方法

Country Status (5)

Country Link
US (2) US12543525B2 (https=)
JP (2) JP7398554B2 (https=)
KR (2) KR20250119666A (https=)
CN (1) CN115398599A (https=)
WO (1) WO2021215145A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI855139B (zh) * 2019-10-28 2024-09-11 日商東京威力科創股份有限公司 基板處理方法及基板處理系統
JP2024030643A (ja) * 2022-08-24 2024-03-07 キオクシア株式会社 半導体製造装置および半導体装置の製造方法
JPWO2024241699A1 (https=) * 2023-05-23 2024-11-28
WO2025079432A1 (ja) * 2023-10-10 2025-04-17 東京エレクトロン株式会社 処理方法、処理システム及び検査装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080200100A1 (en) * 2005-04-19 2008-08-21 Ebara Corporation Substrate Processing Apparatus
US20140251546A1 (en) * 2013-03-07 2014-09-11 Tokyo Electron Limited Peeling device, peeling system and peeling method
JP2015153954A (ja) * 2014-02-17 2015-08-24 東京エレクトロン株式会社 気泡除去装置、気泡除去方法および接合システム
US20160093518A1 (en) * 2014-09-29 2016-03-31 Samsung Electronics Co., Ltd. Initiator and method for debonding wafer supporting system
CN107275254A (zh) * 2016-03-30 2017-10-20 东京毅力科创株式会社 基板处理装置、基板处理装置的控制方法和基板处理系统
JP3225828U (ja) * 2020-01-28 2020-04-09 東京エレクトロン株式会社 回収ボックス

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006093333A (ja) * 2004-09-22 2006-04-06 Disco Abrasive Syst Ltd 切削方法
JP5988765B2 (ja) 2012-08-13 2016-09-07 ダイトエレクトロン株式会社 ウェーハの面取り加工方法、ウェーハの面取り加工装置および砥石角度調整用治具
JP6475071B2 (ja) 2015-04-24 2019-02-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6882033B2 (ja) 2017-03-29 2021-06-02 株式会社東京精密 ウェーハの位置決め装置及びそれを用いた面取り装置
CN118263105A (zh) 2018-03-14 2024-06-28 东京毅力科创株式会社 基板处理系统、基板处理方法以及计算机存储介质
KR102760744B1 (ko) * 2018-04-27 2025-02-03 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법
KR102903523B1 (ko) * 2018-04-27 2025-12-23 도쿄엘렉트론가부시키가이샤 기판 처리 시스템 및 기판 처리 방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080200100A1 (en) * 2005-04-19 2008-08-21 Ebara Corporation Substrate Processing Apparatus
US20140251546A1 (en) * 2013-03-07 2014-09-11 Tokyo Electron Limited Peeling device, peeling system and peeling method
JP2015153954A (ja) * 2014-02-17 2015-08-24 東京エレクトロン株式会社 気泡除去装置、気泡除去方法および接合システム
US20160093518A1 (en) * 2014-09-29 2016-03-31 Samsung Electronics Co., Ltd. Initiator and method for debonding wafer supporting system
CN107275254A (zh) * 2016-03-30 2017-10-20 东京毅力科创株式会社 基板处理装置、基板处理装置的控制方法和基板处理系统
JP3225828U (ja) * 2020-01-28 2020-04-09 東京エレクトロン株式会社 回収ボックス

Also Published As

Publication number Publication date
JP7398554B2 (ja) 2023-12-14
US20260123330A1 (en) 2026-04-30
WO2021215145A1 (ja) 2021-10-28
US20230207344A1 (en) 2023-06-29
US12543525B2 (en) 2026-02-03
KR102842163B1 (ko) 2025-08-04
KR20230004673A (ko) 2023-01-06
KR20250119666A (ko) 2025-08-07
JPWO2021215145A1 (https=) 2021-10-28
JP7611350B2 (ja) 2025-01-09
JP2024019282A (ja) 2024-02-08

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