KR20250072555A - 화합물, 상기 화합물의 제조 방법, 경화성 재료, 경화성 조성물, 경화물의 제조 방법 및 경화물 - Google Patents

화합물, 상기 화합물의 제조 방법, 경화성 재료, 경화성 조성물, 경화물의 제조 방법 및 경화물 Download PDF

Info

Publication number
KR20250072555A
KR20250072555A KR1020247031219A KR20247031219A KR20250072555A KR 20250072555 A KR20250072555 A KR 20250072555A KR 1020247031219 A KR1020247031219 A KR 1020247031219A KR 20247031219 A KR20247031219 A KR 20247031219A KR 20250072555 A KR20250072555 A KR 20250072555A
Authority
KR
South Korea
Prior art keywords
group
carbon atoms
compound
alkyl group
hydrogen atom
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247031219A
Other languages
English (en)
Korean (ko)
Inventor
유이 하세가와
쇼타 코바야시
켄이치 타마소
Original Assignee
가부시키가이샤 아데카
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 아데카 filed Critical 가부시키가이샤 아데카
Publication of KR20250072555A publication Critical patent/KR20250072555A/ko
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D407/00Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00
    • C07D407/02Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings
    • C07D407/12Heterocyclic compounds containing two or more hetero rings, at least one ring having oxygen atoms as the only ring hetero atoms, not provided for by group C07D405/00 containing two hetero rings linked by a chain containing hetero atoms as chain links
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10Esters
    • C08F20/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F20/32Esters containing oxygen in addition to the carboxy oxygen containing epoxy radicals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Compounds (AREA)
  • Plural Heterocyclic Compounds (AREA)
KR1020247031219A 2022-09-27 2023-09-21 화합물, 상기 화합물의 제조 방법, 경화성 재료, 경화성 조성물, 경화물의 제조 방법 및 경화물 Pending KR20250072555A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022153856 2022-09-27
JPJP-P-2022-153856 2022-09-27
PCT/JP2023/034362 WO2024070902A1 (ja) 2022-09-27 2023-09-21 化合物、該化合物の製造方法、硬化性材料、硬化性組成物、硬化物の製造方法及び硬化物

Publications (1)

Publication Number Publication Date
KR20250072555A true KR20250072555A (ko) 2025-05-23

Family

ID=90477694

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247031219A Pending KR20250072555A (ko) 2022-09-27 2023-09-21 화합물, 상기 화합물의 제조 방법, 경화성 재료, 경화성 조성물, 경화물의 제조 방법 및 경화물

Country Status (5)

Country Link
JP (1) JPWO2024070902A1 (enrdf_load_stackoverflow)
KR (1) KR20250072555A (enrdf_load_stackoverflow)
CN (1) CN118984828A (enrdf_load_stackoverflow)
TW (1) TW202423919A (enrdf_load_stackoverflow)
WO (1) WO2024070902A1 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025062839A1 (ja) * 2023-09-21 2025-03-27 株式会社Adeka 化合物、エポキシ樹脂、硬化性組成物、リサイクル用材料、硬化物、硬化物の製造方法、分解物の製造方法及び分解方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
WO2018181421A1 (ja) 2017-03-29 2018-10-04 味の素株式会社 硬化性組成物および構造物
US20200048301A1 (en) 2018-08-13 2020-02-13 Rowan University Epoxy-(meth)acrylate monomers and polymers and methods of making and using the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6099181A (ja) * 1983-11-02 1985-06-03 Toagosei Chem Ind Co Ltd 硬化性組成物
KR100943421B1 (ko) * 2007-12-24 2010-02-19 연세대학교 산학협력단 에폭시기와 불포화이중결합을 갖는 광중합성 단량체 및이를 함유한 광중합 조성물
JP5360359B2 (ja) * 2008-07-01 2013-12-04 株式会社スリーボンド エポキシ樹脂組成物
CN111704711B (zh) * 2019-03-18 2022-04-08 中国科学院宁波材料技术与工程研究所 一种基于缩醛结构的环氧单体及其制备方法与应用
JP2023110567A (ja) * 2022-01-28 2023-08-09 株式会社Adeka 化合物、硬化性組成物、化合物の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
WO2018181421A1 (ja) 2017-03-29 2018-10-04 味の素株式会社 硬化性組成物および構造物
US20200048301A1 (en) 2018-08-13 2020-02-13 Rowan University Epoxy-(meth)acrylate monomers and polymers and methods of making and using the same

Also Published As

Publication number Publication date
CN118984828A (zh) 2024-11-19
TW202423919A (zh) 2024-06-16
WO2024070902A1 (ja) 2024-04-04
JPWO2024070902A1 (enrdf_load_stackoverflow) 2024-04-04

Similar Documents

Publication Publication Date Title
US12269917B2 (en) Curable resin composition
JPWO2012002028A1 (ja) 硬化性樹脂組成物
CN112189007A (zh) 氨基甲酰肟化合物以及含有该化合物的聚合引发剂及聚合性组合物
KR20250072555A (ko) 화합물, 상기 화합물의 제조 방법, 경화성 재료, 경화성 조성물, 경화물의 제조 방법 및 경화물
JP6058890B2 (ja) 硬化性樹脂組成物
KR101158316B1 (ko) 경화성 조성물
TWI871474B (zh) 組合物、硬化物及硬化物之製造方法
JP7325207B2 (ja) 樹脂組成物
JP7657200B2 (ja) 化合物、化合物の製造方法及び硬化性組成物
CN113631537A (zh) 氨基甲酰肟化合物及含有该化合物的聚合引发剂及聚合性组合物
JP2023146684A (ja) 化合物、該化合物の製造方法、及び該化合物を含有する硬化性組成物
US12202932B2 (en) Formulation and processing of degradable high Tg epoxy composite that can be degradable at extremely low temperature
JP2023110567A (ja) 化合物、硬化性組成物、化合物の製造方法
TWI894142B (zh) 硬化性樹脂組合物
JP7282595B2 (ja) 組成物、これを含む接着剤、その硬化物およびその製造方法
JP6491490B2 (ja) 液晶滴下工法用シール剤
CN113631540A (zh) 氨基甲酰肟化合物以及含有该化合物的聚合引发剂及聚合性组合物
CN113302180A (zh) 氨基甲酰肟化合物以及含有该化合物的聚合引发剂及聚合性组合物
WO2021220922A1 (ja) 酸基含有(メタ)アクリレート樹脂、硬化性樹脂組成物、絶縁材料、ソルダーレジスト用樹脂材料及びレジスト部材
CN113646297A (zh) 氨基甲酰肟化合物及含有该化合物的聚合引发剂及聚合性组合物
WO2023176703A1 (ja) 化合物、硬化性樹脂組成物及び硬化物
KR20250006921A (ko) 경화제 및 그 용도
EP4361193A1 (en) Epoxy resin composition
JP2024171844A (ja) 樹脂組成物
TW201900836A (zh) 用於滴下式密封劑應用之可固化組合物

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20240919

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application