KR20240044519A - 에폭시 수지 조성물, 경화물, 밀봉재 및 접착제 - Google Patents

에폭시 수지 조성물, 경화물, 밀봉재 및 접착제 Download PDF

Info

Publication number
KR20240044519A
KR20240044519A KR1020247009291A KR20247009291A KR20240044519A KR 20240044519 A KR20240044519 A KR 20240044519A KR 1020247009291 A KR1020247009291 A KR 1020247009291A KR 20247009291 A KR20247009291 A KR 20247009291A KR 20240044519 A KR20240044519 A KR 20240044519A
Authority
KR
South Korea
Prior art keywords
epoxy resin
compound
resin composition
group
curing agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247009291A
Other languages
English (en)
Korean (ko)
Inventor
료스케 오카모토
나오야 가미무라
겐조 오니즈카
Original Assignee
아사히 가세이 가부시키가이샤
아사히 가세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아사히 가세이 가부시키가이샤, 아사히 가세이 가부시키가이샤 filed Critical 아사히 가세이 가부시키가이샤
Publication of KR20240044519A publication Critical patent/KR20240044519A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4035—Hydrazines; Hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H01L23/295—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
KR1020247009291A 2021-12-28 2022-12-26 에폭시 수지 조성물, 경화물, 밀봉재 및 접착제 Pending KR20240044519A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-213746 2021-12-28
JP2021213746 2021-12-28
PCT/JP2022/047933 WO2023127800A1 (ja) 2021-12-28 2022-12-26 エポキシ樹脂組成物、硬化物、封止材及び接着剤

Publications (1)

Publication Number Publication Date
KR20240044519A true KR20240044519A (ko) 2024-04-04

Family

ID=86998985

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247009291A Pending KR20240044519A (ko) 2021-12-28 2022-12-26 에폭시 수지 조성물, 경화물, 밀봉재 및 접착제

Country Status (6)

Country Link
US (1) US20250034319A1 (https=)
JP (1) JPWO2023127800A1 (https=)
KR (1) KR20240044519A (https=)
CN (1) CN118302470A (https=)
TW (3) TW202544172A (https=)
WO (1) WO2023127800A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024116693A1 (ja) * 2022-11-30 2024-06-06 ナミックス株式会社 樹脂組成物、接着剤、封止材、ダイアタッチ剤、硬化物及び電子デバイス
WO2025028598A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2025028605A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2025028611A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2026018767A1 (ja) * 2024-07-18 2026-01-22 旭化成株式会社 樹脂組成物、硬化物、構造体、硬化剤、封止材、接着剤、半導体パッケージ、及び半導体パッケージの製造方法
CN119463115B (zh) * 2024-12-09 2026-03-10 中国科学院宁波材料技术与工程研究所 一种可降解环氧树脂组合物、固化物及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6282515U (https=) 1985-11-12 1987-05-26
JP2019172738A (ja) 2018-03-27 2019-10-10 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6440515A (en) * 1987-08-07 1989-02-10 Hitachi Chemical Co Ltd Epoxy polymer composition for sealing semiconductor
JP2594341B2 (ja) * 1988-11-28 1997-03-26 ユニチカ株式会社 ホツトメルト接着剤組成物
JP2000229927A (ja) * 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
KR100566792B1 (ko) * 2000-12-27 2006-04-03 히다치 가세고교 가부시끼가이샤 광염기발생제 및 이것을 이용한 경화성 조성물 및 경화방법
JP2003026772A (ja) * 2001-07-23 2003-01-29 Hitachi Chem Co Ltd 硬化性組成物及びそれを用いた硬化方法
JP2003055638A (ja) * 2001-08-21 2003-02-26 Three Bond Co Ltd フィルム状接着剤
JP2003096061A (ja) * 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤
JP5057016B2 (ja) * 2006-06-26 2012-10-24 株式会社スリーボンド 活性エネルギー線の照射により活性化するアミンイミド化合物、それを用いた組成物およびその硬化方法
JP4973868B2 (ja) * 2007-11-13 2012-07-11 株式会社スリーボンド 硬化性樹脂組成物および硬化方法
JP5486927B2 (ja) * 2007-12-28 2014-05-07 三井化学株式会社 潜在性硬化剤、それを含むエポキシ樹脂組成物、シール剤および有機ｅｌディスプレイ
CN102803205B (zh) * 2009-06-17 2015-12-16 三键精密化学有限公司 碱和自由基产生剂、使用其的组合物及固化所述组合物的方法
JP2021038314A (ja) * 2019-09-03 2021-03-11 旭化成株式会社 エポキシ樹脂組成物
CN120698950A (zh) * 2020-07-15 2025-09-26 旭化成株式会社 胺酰亚胺化合物、胺酰亚胺组合物、固化剂、环氧树脂组合物、胺酰亚胺化合物的制造方法、密封材料和粘接剂

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6282515U (https=) 1985-11-12 1987-05-26
JP2019172738A (ja) 2018-03-27 2019-10-10 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置

Also Published As

Publication number Publication date
US20250034319A1 (en) 2025-01-30
TWI890251B (zh) 2025-07-11
JPWO2023127800A1 (https=) 2023-07-06
TW202428763A (zh) 2024-07-16
TW202544172A (zh) 2025-11-16
TWI850924B (zh) 2024-08-01
CN118302470A (zh) 2024-07-05
TW202334313A (zh) 2023-09-01
WO2023127800A1 (ja) 2023-07-06

Similar Documents

Publication Publication Date Title
KR20240044519A (ko) 에폭시 수지 조성물, 경화물, 밀봉재 및 접착제
JP6366590B2 (ja) エポキシ樹脂混合物、エポキシ樹脂組成物、硬化物および半導体装置
JP7606802B2 (ja) アミンイミド化合物、アミンイミド組成物、硬化剤、エポキシ樹脂組成物、アミンイミド化合物の製造方法、封止材、及び接着剤
TWI438216B (zh) 變性液性環氧樹脂、以及使用該樹脂的環氧樹脂組成物及其硬化物
JP2017071706A (ja) エポキシ樹脂組成物、硬化性樹脂組成物およびその硬化物
KR102376061B1 (ko) 에폭시 수지 혼합물, 에폭시 수지 조성물, 경화물 및 반도체 장치
JP6476527B2 (ja) 液状多価ヒドロキシ樹脂、その製造方法、エポキシ樹脂用硬化剤、エポキシ樹脂組成物、その硬化物およびエポキシ樹脂
JP5135951B2 (ja) エポキシ樹脂組成物、その硬化物、及び新規エポキシ樹脂
WO2007083715A1 (ja) 液状エポキシ樹脂、エポキシ樹脂組成物、および硬化物
KR20140118800A (ko) 폴리하이드록시폴리에테르 수지의 제조 방법, 폴리하이드록시폴리에테르 수지, 그 수지 조성물 및 그 경화물
KR20170014277A (ko) 변성 에폭시 수지 및 그 제조방법
JPWO2015060307A1 (ja) フェノール樹脂、エポキシ樹脂、エポキシ樹脂組成物、プリプレグ、およびその硬化物
JP2024074518A (ja) エポキシ樹脂組成物
JP7515316B2 (ja) エポキシ樹脂組成物及びその硬化物
WO2018164042A1 (ja) 硬化性樹脂組成物、その硬化物及び硬化性樹脂組成物の製造方法
TWI910751B (zh) 硬化劑、環氧樹脂組合物、硬化物、密封材料及接著劑
JP2015067615A (ja) エポキシ樹脂混合物、硬化性樹脂組成物、およびその硬化物
KR101910134B1 (ko) 변성 에폭시 수지 및 그 제조방법
KR20250089395A (ko) 이소프탈로일 유닛 및 알콕시실릴기를 갖는 신규한 화합물, 이의 제조방법, 이를 포함하는 에폭시 조성물, 경화물 및 물품
JP2025501570A (ja) 再成形できる熱硬化性樹脂材料の調製プロセス
CN121443667A (zh) 环氧树脂用固化剂、环氧树脂组合物、固化物、封装材料和粘接剂

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

E13 Pre-grant limitation requested

Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000