JPS6440515A - Epoxy polymer composition for sealing semiconductor - Google Patents
Epoxy polymer composition for sealing semiconductorInfo
- Publication number
- JPS6440515A JPS6440515A JP19866487A JP19866487A JPS6440515A JP S6440515 A JPS6440515 A JP S6440515A JP 19866487 A JP19866487 A JP 19866487A JP 19866487 A JP19866487 A JP 19866487A JP S6440515 A JPS6440515 A JP S6440515A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin
- polymer composition
- type
- epoxy polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
PURPOSE:To obtain the titled composition having excellent fluidity, water-vapor resistance and thermal shock resistance, containing an epoxy resin of epi-bis type, an epoxy resin of cresol novolak type, a curing agent of phenolic novolak resin, a curing promoter and an inorganic filler. CONSTITUTION:The aimed composition containing (A) 30-95wt.% based on total epoxy resins of an epoxy resin (epoxy resin derived from bisphenol A and epichlorohydrin) of epi-bis type, (B) 5-70wt.% based on total epoxy resins of an epoxy resin of cresol novolak type, (C) a curing agent of phenolic novolak resin, (D) a curing promoter (e.g. 2-ethyl-4-methylimidazole) and (E) an inorganic filler (e.g. silica or alumina).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19866487A JPS6440515A (en) | 1987-08-07 | 1987-08-07 | Epoxy polymer composition for sealing semiconductor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19866487A JPS6440515A (en) | 1987-08-07 | 1987-08-07 | Epoxy polymer composition for sealing semiconductor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6440515A true JPS6440515A (en) | 1989-02-10 |
Family
ID=16394990
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19866487A Pending JPS6440515A (en) | 1987-08-07 | 1987-08-07 | Epoxy polymer composition for sealing semiconductor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6440515A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7993128B2 (en) | 2007-02-09 | 2011-08-09 | Sumitomo Heavy Industries, Ltd. | Screw and injection apparatus |
WO2023127800A1 (en) * | 2021-12-28 | 2023-07-06 | 旭化成株式会社 | Epoxy resin composition, cured product, sealing material, and adhesive |
-
1987
- 1987-08-07 JP JP19866487A patent/JPS6440515A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7993128B2 (en) | 2007-02-09 | 2011-08-09 | Sumitomo Heavy Industries, Ltd. | Screw and injection apparatus |
WO2023127800A1 (en) * | 2021-12-28 | 2023-07-06 | 旭化成株式会社 | Epoxy resin composition, cured product, sealing material, and adhesive |
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