JPS6440515A - Epoxy polymer composition for sealing semiconductor - Google Patents

Epoxy polymer composition for sealing semiconductor

Info

Publication number
JPS6440515A
JPS6440515A JP19866487A JP19866487A JPS6440515A JP S6440515 A JPS6440515 A JP S6440515A JP 19866487 A JP19866487 A JP 19866487A JP 19866487 A JP19866487 A JP 19866487A JP S6440515 A JPS6440515 A JP S6440515A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin
polymer composition
type
epoxy polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19866487A
Other languages
Japanese (ja)
Inventor
Manabu Yamane
Kimihide Fujita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP19866487A priority Critical patent/JPS6440515A/en
Publication of JPS6440515A publication Critical patent/JPS6440515A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To obtain the titled composition having excellent fluidity, water-vapor resistance and thermal shock resistance, containing an epoxy resin of epi-bis type, an epoxy resin of cresol novolak type, a curing agent of phenolic novolak resin, a curing promoter and an inorganic filler. CONSTITUTION:The aimed composition containing (A) 30-95wt.% based on total epoxy resins of an epoxy resin (epoxy resin derived from bisphenol A and epichlorohydrin) of epi-bis type, (B) 5-70wt.% based on total epoxy resins of an epoxy resin of cresol novolak type, (C) a curing agent of phenolic novolak resin, (D) a curing promoter (e.g. 2-ethyl-4-methylimidazole) and (E) an inorganic filler (e.g. silica or alumina).
JP19866487A 1987-08-07 1987-08-07 Epoxy polymer composition for sealing semiconductor Pending JPS6440515A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19866487A JPS6440515A (en) 1987-08-07 1987-08-07 Epoxy polymer composition for sealing semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19866487A JPS6440515A (en) 1987-08-07 1987-08-07 Epoxy polymer composition for sealing semiconductor

Publications (1)

Publication Number Publication Date
JPS6440515A true JPS6440515A (en) 1989-02-10

Family

ID=16394990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19866487A Pending JPS6440515A (en) 1987-08-07 1987-08-07 Epoxy polymer composition for sealing semiconductor

Country Status (1)

Country Link
JP (1) JPS6440515A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993128B2 (en) 2007-02-09 2011-08-09 Sumitomo Heavy Industries, Ltd. Screw and injection apparatus
WO2023127800A1 (en) * 2021-12-28 2023-07-06 旭化成株式会社 Epoxy resin composition, cured product, sealing material, and adhesive

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7993128B2 (en) 2007-02-09 2011-08-09 Sumitomo Heavy Industries, Ltd. Screw and injection apparatus
WO2023127800A1 (en) * 2021-12-28 2023-07-06 旭化成株式会社 Epoxy resin composition, cured product, sealing material, and adhesive

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