JPWO2023127800A1 - - Google Patents

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Publication number
JPWO2023127800A1
JPWO2023127800A1 JP2023571011A JP2023571011A JPWO2023127800A1 JP WO2023127800 A1 JPWO2023127800 A1 JP WO2023127800A1 JP 2023571011 A JP2023571011 A JP 2023571011A JP 2023571011 A JP2023571011 A JP 2023571011A JP WO2023127800 A1 JPWO2023127800 A1 JP WO2023127800A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023571011A
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Japanese (ja)
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4035—Hydrazines; Hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
JP2023571011A 2021-12-28 2022-12-26 Pending JPWO2023127800A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021213746 2021-12-28
PCT/JP2022/047933 WO2023127800A1 (ja) 2021-12-28 2022-12-26 エポキシ樹脂組成物、硬化物、封止材及び接着剤

Publications (1)

Publication Number Publication Date
JPWO2023127800A1 true JPWO2023127800A1 (https=) 2023-07-06

Family

ID=86998985

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023571011A Pending JPWO2023127800A1 (https=) 2021-12-28 2022-12-26

Country Status (6)

Country Link
US (1) US20250034319A1 (https=)
JP (1) JPWO2023127800A1 (https=)
KR (1) KR20240044519A (https=)
CN (1) CN118302470A (https=)
TW (3) TW202544172A (https=)
WO (1) WO2023127800A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024116693A1 (ja) * 2022-11-30 2024-06-06 ナミックス株式会社 樹脂組成物、接着剤、封止材、ダイアタッチ剤、硬化物及び電子デバイス
WO2025028598A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2025028605A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2025028611A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2026018767A1 (ja) * 2024-07-18 2026-01-22 旭化成株式会社 樹脂組成物、硬化物、構造体、硬化剤、封止材、接着剤、半導体パッケージ、及び半導体パッケージの製造方法
CN119463115B (zh) * 2024-12-09 2026-03-10 中国科学院宁波材料技术与工程研究所 一种可降解环氧树脂组合物、固化物及其应用

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6440515A (en) * 1987-08-07 1989-02-10 Hitachi Chemical Co Ltd Epoxy polymer composition for sealing semiconductor
JPH02145677A (ja) * 1988-11-28 1990-06-05 Unitika Ltd ホツトメルト接着剤組成物
JP2000229927A (ja) * 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
WO2002051905A1 (en) * 2000-12-27 2002-07-04 Hitachi Chemical Co., Ltd. Photobase generators, curable compositions prepared by using the same and process of curing
JP2003026772A (ja) * 2001-07-23 2003-01-29 Hitachi Chem Co Ltd 硬化性組成物及びそれを用いた硬化方法
JP2003055638A (ja) * 2001-08-21 2003-02-26 Three Bond Co Ltd フィルム状接着剤
JP2003096061A (ja) * 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤
JP2008001857A (ja) * 2006-06-26 2008-01-10 Three Bond Co Ltd 活性エネルギー線の照射により活性化するアミンイミド化合物、それを用いた組成物およびその硬化方法
JP2009120683A (ja) * 2007-11-13 2009-06-04 Three Bond Co Ltd 硬化性樹脂組成物および硬化方法
WO2010147161A1 (ja) * 2009-06-17 2010-12-23 株式会社スリーボンド 塩基およびラジカル発生剤、およびそれを用いた組成物およびその硬化方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6282515U (https=) 1985-11-12 1987-05-26
JP5486927B2 (ja) * 2007-12-28 2014-05-07 三井化学株式会社 潜在性硬化剤、それを含むエポキシ樹脂組成物、シール剤および有機ｅｌディスプレイ
JP2019172738A (ja) 2018-03-27 2019-10-10 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2021038314A (ja) * 2019-09-03 2021-03-11 旭化成株式会社 エポキシ樹脂組成物
CN120698950A (zh) * 2020-07-15 2025-09-26 旭化成株式会社 胺酰亚胺化合物、胺酰亚胺组合物、固化剂、环氧树脂组合物、胺酰亚胺化合物的制造方法、密封材料和粘接剂

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6440515A (en) * 1987-08-07 1989-02-10 Hitachi Chemical Co Ltd Epoxy polymer composition for sealing semiconductor
JPH02145677A (ja) * 1988-11-28 1990-06-05 Unitika Ltd ホツトメルト接着剤組成物
JP2000229927A (ja) * 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
WO2002051905A1 (en) * 2000-12-27 2002-07-04 Hitachi Chemical Co., Ltd. Photobase generators, curable compositions prepared by using the same and process of curing
JP2003026772A (ja) * 2001-07-23 2003-01-29 Hitachi Chem Co Ltd 硬化性組成物及びそれを用いた硬化方法
JP2003055638A (ja) * 2001-08-21 2003-02-26 Three Bond Co Ltd フィルム状接着剤
JP2003096061A (ja) * 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤
JP2008001857A (ja) * 2006-06-26 2008-01-10 Three Bond Co Ltd 活性エネルギー線の照射により活性化するアミンイミド化合物、それを用いた組成物およびその硬化方法
JP2009120683A (ja) * 2007-11-13 2009-06-04 Three Bond Co Ltd 硬化性樹脂組成物および硬化方法
WO2010147161A1 (ja) * 2009-06-17 2010-12-23 株式会社スリーボンド 塩基およびラジカル発生剤、およびそれを用いた組成物およびその硬化方法

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
NIINO HIDEKI ET AL.: "Aminimide as hardener/curing promotor for one part epoxy resin composition", JOURNAL OF APPLIED POLYMER SCIENCE, vol. Volume27, Issue7, JPN6023010066, 1982, pages 2361 - 2368, ISSN: 0005712258 *
熊谷 八百三, 卜部 啓, 劔持 潔: "ガラス短繊維-エポキシ系複合材料の回転成形と充てん材の配向", 高分子論文集, vol. 58巻, 1号, JPN6023010065, 2001, JP, pages 50 - 55, ISSN: 0005712257 *

Also Published As

Publication number Publication date
US20250034319A1 (en) 2025-01-30
TWI890251B (zh) 2025-07-11
TW202428763A (zh) 2024-07-16
TW202544172A (zh) 2025-11-16
KR20240044519A (ko) 2024-04-04
TWI850924B (zh) 2024-08-01
CN118302470A (zh) 2024-07-05
TW202334313A (zh) 2023-09-01
WO2023127800A1 (ja) 2023-07-06

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