TW202544172A - 環氧樹脂組合物、硬化物、密封材料及接著劑 - Google Patents

環氧樹脂組合物、硬化物、密封材料及接著劑

Info

Publication number
TW202544172A
TW202544172A TW114124064A TW114124064A TW202544172A TW 202544172 A TW202544172 A TW 202544172A TW 114124064 A TW114124064 A TW 114124064A TW 114124064 A TW114124064 A TW 114124064A TW 202544172 A TW202544172 A TW 202544172A
Authority
TW
Taiwan
Prior art keywords
epoxy resin
compound
resin composition
hardener
carbon atoms
Prior art date
Application number
TW114124064A
Other languages
English (en)
Chinese (zh)
Inventor
岡本凌輔
上村直弥
鬼塚賢三
Original Assignee
日商旭化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商旭化成股份有限公司 filed Critical 日商旭化成股份有限公司
Publication of TW202544172A publication Critical patent/TW202544172A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4035—Hydrazines; Hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/506—Amines heterocyclic containing only nitrogen as a heteroatom having one nitrogen atom in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005—Stabilisers against oxidation, heat, light, ozone
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
TW114124064A 2021-12-28 2022-12-27 環氧樹脂組合物、硬化物、密封材料及接著劑 TW202544172A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-213746 2021-12-28
JP2021213746 2021-12-28

Publications (1)

Publication Number Publication Date
TW202544172A true TW202544172A (zh) 2025-11-16

Family

ID=86998985

Family Applications (3)

Application Number Title Priority Date Filing Date
TW114124064A TW202544172A (zh) 2021-12-28 2022-12-27 環氧樹脂組合物、硬化物、密封材料及接著劑
TW111150074A TWI850924B (zh) 2021-12-28 2022-12-27 環氧樹脂組合物、硬化物、密封材料及接著劑
TW112151554A TWI890251B (zh) 2021-12-28 2022-12-27 環氧樹脂組合物、硬化物、密封材料及接著劑

Family Applications After (2)

Application Number Title Priority Date Filing Date
TW111150074A TWI850924B (zh) 2021-12-28 2022-12-27 環氧樹脂組合物、硬化物、密封材料及接著劑
TW112151554A TWI890251B (zh) 2021-12-28 2022-12-27 環氧樹脂組合物、硬化物、密封材料及接著劑

Country Status (6)

Country Link
US (1) US20250034319A1 (https=)
JP (1) JPWO2023127800A1 (https=)
KR (1) KR20240044519A (https=)
CN (1) CN118302470A (https=)
TW (3) TW202544172A (https=)
WO (1) WO2023127800A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024116693A1 (ja) * 2022-11-30 2024-06-06 ナミックス株式会社 樹脂組成物、接着剤、封止材、ダイアタッチ剤、硬化物及び電子デバイス
WO2025028598A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2025028605A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2025028611A1 (ja) * 2023-08-01 2025-02-06 旭化成株式会社 エポキシ樹脂用硬化剤、エポキシ樹脂組成物、硬化物、封止材及び接着剤
WO2026018767A1 (ja) * 2024-07-18 2026-01-22 旭化成株式会社 樹脂組成物、硬化物、構造体、硬化剤、封止材、接着剤、半導体パッケージ、及び半導体パッケージの製造方法
CN119463115B (zh) * 2024-12-09 2026-03-10 中国科学院宁波材料技术与工程研究所 一种可降解环氧树脂组合物、固化物及其应用

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6282515U (https=) 1985-11-12 1987-05-26
JPS6440515A (en) * 1987-08-07 1989-02-10 Hitachi Chemical Co Ltd Epoxy polymer composition for sealing semiconductor
JP2594341B2 (ja) * 1988-11-28 1997-03-26 ユニチカ株式会社 ホツトメルト接着剤組成物
JP2000229927A (ja) * 1999-02-09 2000-08-22 Three Bond Co Ltd アミンイミド化合物およびそれを用いたエポキシ樹脂組成物
KR100566792B1 (ko) * 2000-12-27 2006-04-03 히다치 가세고교 가부시끼가이샤 광염기발생제 및 이것을 이용한 경화성 조성물 및 경화방법
JP2003026772A (ja) * 2001-07-23 2003-01-29 Hitachi Chem Co Ltd 硬化性組成物及びそれを用いた硬化方法
JP2003055638A (ja) * 2001-08-21 2003-02-26 Three Bond Co Ltd フィルム状接着剤
JP2003096061A (ja) * 2001-09-25 2003-04-03 Otsuka Chem Co Ltd アミンイミド化合物及びそれを含有するエポキシ樹脂用硬化剤
JP5057016B2 (ja) * 2006-06-26 2012-10-24 株式会社スリーボンド 活性エネルギー線の照射により活性化するアミンイミド化合物、それを用いた組成物およびその硬化方法
JP4973868B2 (ja) * 2007-11-13 2012-07-11 株式会社スリーボンド 硬化性樹脂組成物および硬化方法
JP5486927B2 (ja) * 2007-12-28 2014-05-07 三井化学株式会社 潜在性硬化剤、それを含むエポキシ樹脂組成物、シール剤および有機ｅｌディスプレイ
CN102803205B (zh) * 2009-06-17 2015-12-16 三键精密化学有限公司 碱和自由基产生剂、使用其的组合物及固化所述组合物的方法
JP2019172738A (ja) 2018-03-27 2019-10-10 信越化学工業株式会社 エポキシ樹脂組成物及び半導体装置
JP2021038314A (ja) * 2019-09-03 2021-03-11 旭化成株式会社 エポキシ樹脂組成物
CN120698950A (zh) * 2020-07-15 2025-09-26 旭化成株式会社 胺酰亚胺化合物、胺酰亚胺组合物、固化剂、环氧树脂组合物、胺酰亚胺化合物的制造方法、密封材料和粘接剂

Also Published As

Publication number Publication date
US20250034319A1 (en) 2025-01-30
TWI890251B (zh) 2025-07-11
JPWO2023127800A1 (https=) 2023-07-06
TW202428763A (zh) 2024-07-16
KR20240044519A (ko) 2024-04-04
TWI850924B (zh) 2024-08-01
CN118302470A (zh) 2024-07-05
TW202334313A (zh) 2023-09-01
WO2023127800A1 (ja) 2023-07-06

Similar Documents

Publication Publication Date Title
TWI890251B (zh) 環氧樹脂組合物、硬化物、密封材料及接著劑
KR101888703B1 (ko) 무용제 일액형 시안산에스테르-에폭시 복합 수지 조성물
JP5415947B2 (ja) 一液型シアネート−エポキシ複合樹脂組成物
TWI836648B (zh) 胺化醯亞胺化合物、胺化醯亞胺組合物、硬化劑、環氧樹脂組合物、胺化醯亞胺化合物之製造方法、密封材、及接著劑
CN105073820B (zh) 热固性树脂组合物
JP2024051882A (ja) エポキシ樹脂組成物、硬化物、及び半導体装置
WO2008020594A1 (fr) Résine époxy liquide modifiée, composition de résine époxy contenant celle-ci et produit cuit dérivé
TWI910752B (zh) 環氧樹脂用硬化劑、環氧樹脂組合物、硬化物、密封材料及接著劑
JP2024074518A (ja) エポキシ樹脂組成物
WO2018164042A1 (ja) 硬化性樹脂組成物、その硬化物及び硬化性樹脂組成物の製造方法
TWI910751B (zh) 硬化劑、環氧樹脂組合物、硬化物、密封材料及接著劑
JP4435342B2 (ja) エポキシ樹脂組成物及び半導体封止用エポキシ樹脂組成物
JP6043602B2 (ja) 樹脂組成物
TWI911823B (zh) 環氧樹脂用硬化劑、環氧樹脂組合物、硬化物、密封材料及接著劑
JPH04304227A (ja) エポキシ樹脂組成物および電子部品封止用材料
JP3118763B2 (ja) エポキシ樹脂組成物及び半導体封止材料
JP2025501570A (ja) 再成形できる熱硬化性樹脂材料の調製プロセス
JP2014162854A (ja) 樹脂組成物及び硬化物
KR20250089395A (ko) 이소프탈로일 유닛 및 알콕시실릴기를 갖는 신규한 화합물, 이의 제조방법, 이를 포함하는 에폭시 조성물, 경화물 및 물품
TW202248276A (zh) 酚樹脂混合物、硬化性樹脂組成物及其硬化物
JPH1017643A (ja) エポキシ樹脂混合物、エポキシ樹脂組成物及びその硬化物
JPH08311167A (ja) エポキシ樹脂組成物およびその硬化物