KR20240039073A - 표면 처리 장치 - Google Patents

표면 처리 장치 Download PDF

Info

Publication number
KR20240039073A
KR20240039073A KR1020247008753A KR20247008753A KR20240039073A KR 20240039073 A KR20240039073 A KR 20240039073A KR 1020247008753 A KR1020247008753 A KR 1020247008753A KR 20247008753 A KR20247008753 A KR 20247008753A KR 20240039073 A KR20240039073 A KR 20240039073A
Authority
KR
South Korea
Prior art keywords
surface treatment
unit
chamber
treated
accommodating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247008753A
Other languages
English (en)
Korean (ko)
Inventor
가즈히로 후카다
요시아키 구리하라
다케시 남바
사토시 후쿠야마
미츠노리 고쿠보
Original Assignee
시바우라 기카이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 시바우라 기카이 가부시키가이샤 filed Critical 시바우라 기카이 가부시키가이샤
Publication of KR20240039073A publication Critical patent/KR20240039073A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
KR1020247008753A 2021-09-28 2022-09-20 표면 처리 장치 Pending KR20240039073A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-158047 2021-09-28
JP2021158047 2021-09-28
PCT/JP2022/034899 WO2023054044A1 (ja) 2021-09-28 2022-09-20 表面処理装置

Publications (1)

Publication Number Publication Date
KR20240039073A true KR20240039073A (ko) 2024-03-26

Family

ID=85782513

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247008753A Pending KR20240039073A (ko) 2021-09-28 2022-09-20 표면 처리 장치

Country Status (6)

Country Link
US (1) US20240318303A1 (https=)
JP (1) JPWO2023054044A1 (https=)
KR (1) KR20240039073A (https=)
CN (1) CN117836463A (https=)
TW (1) TWI831391B (https=)
WO (1) WO2023054044A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015098617A (ja) 2013-11-18 2015-05-28 株式会社島津製作所 成膜装置

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
JPS60238134A (ja) * 1984-04-16 1985-11-27 Tokuda Seisakusho Ltd 真空処理装置
US4534314A (en) * 1984-05-10 1985-08-13 Varian Associates, Inc. Load lock pumping mechanism
US4851095A (en) * 1988-02-08 1989-07-25 Optical Coating Laboratory, Inc. Magnetron sputtering apparatus and process
JPH0734922Y2 (ja) * 1989-02-27 1995-08-09 株式会社島津製作所 移動成膜式スパッタリング装置
EP0716160B1 (en) * 1989-11-13 2000-01-26 Optical Coating Laboratory, Inc. Geometries and configurations for magnetron sputtering apparatus
JP2001043530A (ja) * 1999-07-28 2001-02-16 Anelva Corp 情報記録ディスク用保護膜作成方法及び情報記録ディスク用薄膜作成装置
KR101206959B1 (ko) * 2006-11-29 2012-11-30 도쿄엘렉트론가부시키가이샤 기판의 처리 장치
JP4681640B2 (ja) * 2008-09-30 2011-05-11 積水化学工業株式会社 表面処理方法
GB0819474D0 (en) * 2008-10-23 2008-12-03 P2I Ltd Plasma processing apparatus
US20110132755A1 (en) * 2009-12-04 2011-06-09 Kim Woosam In-line system for manufacturing solar cell
JP4761326B2 (ja) * 2010-01-15 2011-08-31 シャープ株式会社 薄膜形成装置システムおよび薄膜形成方法
JP5602005B2 (ja) * 2010-12-22 2014-10-08 キヤノンアネルバ株式会社 真空処理装置、及び、それを用いた処理方法
KR20140116120A (ko) * 2012-01-03 2014-10-01 어플라이드 머티어리얼스, 인코포레이티드 결정질 실리콘 태양 전지들을 패시베이팅하기 위한 진보된 플랫폼
JP5999190B2 (ja) * 2012-10-01 2016-09-28 日産自動車株式会社 インライン式コーティング装置、インライン式コーティング方法、およびセパレータ
JP6026263B2 (ja) * 2012-12-20 2016-11-16 キヤノンアネルバ株式会社 プラズマｃｖｄ装置、真空処理装置
WO2015087505A1 (ja) * 2013-12-12 2015-06-18 株式会社アルバック インライン式成膜装置の成膜準備方法及びインライン式成膜装置並びにキャリア
JP6231399B2 (ja) * 2014-02-17 2017-11-15 キヤノンアネルバ株式会社 処理装置
CN106661722A (zh) * 2014-07-31 2017-05-10 株式会社爱发科 基板处理装置
WO2016208094A1 (ja) * 2015-06-24 2016-12-29 キヤノンアネルバ株式会社 真空アーク成膜装置および成膜方法
DE102015013799A1 (de) * 2015-10-26 2017-04-27 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zum Beschichten überlanger flächenhafter Substrate, insbesondere Glasscheiben, in einer Vakuum-Beschichtungsanlage
JP6240695B2 (ja) * 2016-03-02 2017-11-29 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
JP2018148051A (ja) * 2017-03-06 2018-09-20 株式会社半導体エネルギー研究所 成膜装置、成膜方法、及び半導体装置の作製方法
EA034967B1 (ru) * 2018-05-04 2020-04-13 Общество С Ограниченной Ответственностью "Изовак Технологии" Технологическая линия для формирования тонкопленочных покрытий в вакууме (варианты)
JP7159238B2 (ja) * 2020-03-13 2022-10-24 キヤノントッキ株式会社 基板キャリア、成膜装置、及び成膜方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015098617A (ja) 2013-11-18 2015-05-28 株式会社島津製作所 成膜装置

Also Published As

Publication number Publication date
TWI831391B (zh) 2024-02-01
TW202321488A (zh) 2023-06-01
JPWO2023054044A1 (https=) 2023-04-06
CN117836463A (zh) 2024-04-05
US20240318303A1 (en) 2024-09-26
WO2023054044A1 (ja) 2023-04-06

Similar Documents

Publication Publication Date Title
US20120225207A1 (en) Apparatus and Process for Atomic Layer Deposition
KR100297971B1 (ko) 스퍼터화학증착복합장치
TW202010865A (zh) 空間原子層沈積中的氣體分離控制
TW200931577A (en) Vacuum treatment system, and method for carrying substrate
WO2010035773A1 (ja) 成膜装置及び基板処理装置
CN110295350A (zh) 真空处理装置及托盘
KR102278935B1 (ko) 성막 장치
US20200040455A1 (en) Methods and apparatus for ald processes
EP3126541A1 (en) Vacuum processing system and method for mounting a processing system
KR102349330B1 (ko) 박막 캡슐화 처리 시스템 및 프로세스 키트
CN108690966A (zh) 等离子体处理装置
JP2018174300A (ja) プラズマ処理装置
JP2008069402A (ja) スパッタリング装置及びスパッタリング方法
KR20240039073A (ko) 표면 처리 장치
EP2874180B1 (en) Thin-film vapour deposition method
CN102373423B (zh) 溅镀装置
KR102871792B1 (ko) 표면 처리 장치 및 표면 처리 방법
KR20240118816A (ko) 표면 처리 장치
KR101968256B1 (ko) 진공 성막 장치
TWI822324B (zh) 表面處理裝置及表面處理方法
CN118510935A (zh) 表面处理装置
JP2024089383A (ja) 搬送装置および表面処理装置
JP4392073B2 (ja) 成膜装置
KR100838281B1 (ko) 플라즈마처리장치
WO2023162503A1 (ja) 表面処理装置

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D21 Rejection of application intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000