JPWO2023054044A1 - - Google Patents

Info

Publication number
JPWO2023054044A1
JPWO2023054044A1 JP2023551334A JP2023551334A JPWO2023054044A1 JP WO2023054044 A1 JPWO2023054044 A1 JP WO2023054044A1 JP 2023551334 A JP2023551334 A JP 2023551334A JP 2023551334 A JP2023551334 A JP 2023551334A JP WO2023054044 A1 JPWO2023054044 A1 JP WO2023054044A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023551334A
Other languages
Japanese (ja)
Other versions
JPWO2023054044A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023054044A1 publication Critical patent/JPWO2023054044A1/ja
Publication of JPWO2023054044A5 publication Critical patent/JPWO2023054044A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
    • C23C14/566—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases using a load-lock chamber
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2023551334A 2021-09-28 2022-09-20 Pending JPWO2023054044A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021158047 2021-09-28
PCT/JP2022/034899 WO2023054044A1 (ja) 2021-09-28 2022-09-20 表面処理装置

Publications (2)

Publication Number Publication Date
JPWO2023054044A1 true JPWO2023054044A1 (https=) 2023-04-06
JPWO2023054044A5 JPWO2023054044A5 (https=) 2024-06-17

Family

ID=85782513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023551334A Pending JPWO2023054044A1 (https=) 2021-09-28 2022-09-20

Country Status (6)

Country Link
US (1) US20240318303A1 (https=)
JP (1) JPWO2023054044A1 (https=)
KR (1) KR20240039073A (https=)
CN (1) CN117836463A (https=)
TW (1) TWI831391B (https=)
WO (1) WO2023054044A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60238134A (ja) * 1984-04-16 1985-11-27 Tokuda Seisakusho Ltd 真空処理装置
JPH024967A (ja) * 1988-02-08 1990-01-09 Optical Coating Lab Inc 薄膜形成装置及び方法
JPH02115562U (https=) * 1989-02-27 1990-09-17
JPH03211275A (ja) * 1989-11-13 1991-09-17 Optical Coating Lab Inc マグネトロンスパッタリング装置及び方法
WO2016017510A1 (ja) * 2014-07-31 2016-02-04 株式会社 アルバック 基板処理装置
JP2018148051A (ja) * 2017-03-06 2018-09-20 株式会社半導体エネルギー研究所 成膜装置、成膜方法、及び半導体装置の作製方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4500407A (en) * 1983-07-19 1985-02-19 Varian Associates, Inc. Disk or wafer handling and coating system
US4534314A (en) * 1984-05-10 1985-08-13 Varian Associates, Inc. Load lock pumping mechanism
JP2001043530A (ja) * 1999-07-28 2001-02-16 Anelva Corp 情報記録ディスク用保護膜作成方法及び情報記録ディスク用薄膜作成装置
KR101206959B1 (ko) * 2006-11-29 2012-11-30 도쿄엘렉트론가부시키가이샤 기판의 처리 장치
JP4681640B2 (ja) * 2008-09-30 2011-05-11 積水化学工業株式会社 表面処理方法
GB0819474D0 (en) * 2008-10-23 2008-12-03 P2I Ltd Plasma processing apparatus
US20110132755A1 (en) * 2009-12-04 2011-06-09 Kim Woosam In-line system for manufacturing solar cell
JP4761326B2 (ja) * 2010-01-15 2011-08-31 シャープ株式会社 薄膜形成装置システムおよび薄膜形成方法
JP5602005B2 (ja) * 2010-12-22 2014-10-08 キヤノンアネルバ株式会社 真空処理装置、及び、それを用いた処理方法
KR20140116120A (ko) * 2012-01-03 2014-10-01 어플라이드 머티어리얼스, 인코포레이티드 결정질 실리콘 태양 전지들을 패시베이팅하기 위한 진보된 플랫폼
JP5999190B2 (ja) * 2012-10-01 2016-09-28 日産自動車株式会社 インライン式コーティング装置、インライン式コーティング方法、およびセパレータ
JP6026263B2 (ja) * 2012-12-20 2016-11-16 キヤノンアネルバ株式会社 プラズマｃｖｄ装置、真空処理装置
JP2015098617A (ja) 2013-11-18 2015-05-28 株式会社島津製作所 成膜装置
WO2015087505A1 (ja) * 2013-12-12 2015-06-18 株式会社アルバック インライン式成膜装置の成膜準備方法及びインライン式成膜装置並びにキャリア
JP6231399B2 (ja) * 2014-02-17 2017-11-15 キヤノンアネルバ株式会社 処理装置
WO2016208094A1 (ja) * 2015-06-24 2016-12-29 キヤノンアネルバ株式会社 真空アーク成膜装置および成膜方法
DE102015013799A1 (de) * 2015-10-26 2017-04-27 Grenzebach Maschinenbau Gmbh Vorrichtung und Verfahren zum Beschichten überlanger flächenhafter Substrate, insbesondere Glasscheiben, in einer Vakuum-Beschichtungsanlage
JP6240695B2 (ja) * 2016-03-02 2017-11-29 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びプログラム
EA034967B1 (ru) * 2018-05-04 2020-04-13 Общество С Ограниченной Ответственностью "Изовак Технологии" Технологическая линия для формирования тонкопленочных покрытий в вакууме (варианты)
JP7159238B2 (ja) * 2020-03-13 2022-10-24 キヤノントッキ株式会社 基板キャリア、成膜装置、及び成膜方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60238134A (ja) * 1984-04-16 1985-11-27 Tokuda Seisakusho Ltd 真空処理装置
JPH024967A (ja) * 1988-02-08 1990-01-09 Optical Coating Lab Inc 薄膜形成装置及び方法
JPH02115562U (https=) * 1989-02-27 1990-09-17
JPH03211275A (ja) * 1989-11-13 1991-09-17 Optical Coating Lab Inc マグネトロンスパッタリング装置及び方法
WO2016017510A1 (ja) * 2014-07-31 2016-02-04 株式会社 アルバック 基板処理装置
JP2018148051A (ja) * 2017-03-06 2018-09-20 株式会社半導体エネルギー研究所 成膜装置、成膜方法、及び半導体装置の作製方法

Also Published As

Publication number Publication date
TWI831391B (zh) 2024-02-01
TW202321488A (zh) 2023-06-01
CN117836463A (zh) 2024-04-05
US20240318303A1 (en) 2024-09-26
KR20240039073A (ko) 2024-03-26
WO2023054044A1 (ja) 2023-04-06

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