KR20240031943A - 접착제 조성물, 접착 시트, 전자파 실드재, 적층체 및 프린트 배선판 - Google Patents

접착제 조성물, 접착 시트, 전자파 실드재, 적층체 및 프린트 배선판 Download PDF

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KR20240031943A
KR20240031943A KR1020237037222A KR20237037222A KR20240031943A KR 20240031943 A KR20240031943 A KR 20240031943A KR 1020237037222 A KR1020237037222 A KR 1020237037222A KR 20237037222 A KR20237037222 A KR 20237037222A KR 20240031943 A KR20240031943 A KR 20240031943A
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South Korea
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mass
resin
adhesive composition
parts
adhesive
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KR1020237037222A
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English (en)
Korean (ko)
Inventor
료 소노다
하야토 이리사와
데츠오 가와쿠스
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도요보 엠씨 가부시키가이샤
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Publication of KR20240031943A publication Critical patent/KR20240031943A/ko
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
KR1020237037222A 2021-07-09 2022-07-07 접착제 조성물, 접착 시트, 전자파 실드재, 적층체 및 프린트 배선판 Pending KR20240031943A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-113991 2021-07-09
JP2021113991 2021-07-09
PCT/JP2022/026929 WO2023282318A1 (ja) 2021-07-09 2022-07-07 接着剤組成物、接着シート、電磁波シールド材、積層体およびプリント配線板

Publications (1)

Publication Number Publication Date
KR20240031943A true KR20240031943A (ko) 2024-03-08

Family

ID=84800778

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237037222A Pending KR20240031943A (ko) 2021-07-09 2022-07-07 접착제 조성물, 접착 시트, 전자파 실드재, 적층체 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP7409568B2 (https=)
KR (1) KR20240031943A (https=)
CN (1) CN117500895A (https=)
TW (1) TW202309213A (https=)
WO (1) WO2023282318A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025012961A (ja) * 2023-07-14 2025-01-24 株式会社レゾナック 熱硬化性樹脂組成物、硬化物、及びフレキシブルプリント基板
CN117362935A (zh) * 2023-10-30 2024-01-09 广东龙宇新材料有限公司 一种添加氮丙啶交联剂的萘酚酚醛环氧组合物及其应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147903A1 (ja) 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
WO2016047289A1 (ja) 2014-09-24 2016-03-31 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0759691B2 (ja) * 1985-09-09 1995-06-28 日立化成工業株式会社 アデイテイブ印刷配線板用接着剤
JP2013193253A (ja) * 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
JP2016056249A (ja) * 2014-09-08 2016-04-21 三井化学株式会社 ポリイミドワニスおよびそれからなるフィルム
EP3467038B1 (en) * 2016-06-02 2023-09-06 Resonac Corporation Thermosetting resin compositin, prepreg, laminated board, printed wiring board, and high-speed communication-compatible module
CN110072961B (zh) * 2016-12-22 2022-02-08 东亚合成株式会社 粘合剂组合物以及使用其的覆盖膜、粘合片、覆铜层压板和电磁波屏蔽材料
KR102824389B1 (ko) * 2019-01-29 2025-06-23 도요보 엠씨 가부시키가이샤 다이머 디올 공중합 폴리이미드우레탄 수지를 포함하는 접착제 조성물
CN114341301B (zh) * 2019-10-08 2023-09-29 东洋纺Mc株式会社 聚烯烃系粘合剂组合物
JP6919777B1 (ja) * 2019-11-29 2021-08-18 東洋紡株式会社 接着剤組成物、接着シート、積層体およびプリント配線板
CN112980385B (zh) * 2019-12-16 2024-06-18 荒川化学工业株式会社 粘接剂组合物、粘接剂组合物的相关制品及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014147903A1 (ja) 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
WO2016047289A1 (ja) 2014-09-24 2016-03-31 東亞合成株式会社 接着剤組成物及びこれを用いた接着剤層付き積層体

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CN117500895A (zh) 2024-02-02
JP7409568B2 (ja) 2024-01-09
WO2023282318A1 (ja) 2023-01-12
TW202309213A (zh) 2023-03-01
JPWO2023282318A1 (https=) 2023-01-12

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