CN117500895A - 粘接剂组合物、粘接片、电磁波屏蔽材料、层叠体以及印刷线路板 - Google Patents

粘接剂组合物、粘接片、电磁波屏蔽材料、层叠体以及印刷线路板 Download PDF

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Publication number
CN117500895A
CN117500895A CN202280042697.1A CN202280042697A CN117500895A CN 117500895 A CN117500895 A CN 117500895A CN 202280042697 A CN202280042697 A CN 202280042697A CN 117500895 A CN117500895 A CN 117500895A
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CN
China
Prior art keywords
mass
adhesive composition
resin
parts
adhesive
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Pending
Application number
CN202280042697.1A
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English (en)
Chinese (zh)
Inventor
园田辽
入泽隼人
川楠哲生
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Dongyang Textile Mc Co ltd
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Dongyang Textile Mc Co ltd
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Application filed by Dongyang Textile Mc Co ltd filed Critical Dongyang Textile Mc Co ltd
Publication of CN117500895A publication Critical patent/CN117500895A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
CN202280042697.1A 2021-07-09 2022-07-07 粘接剂组合物、粘接片、电磁波屏蔽材料、层叠体以及印刷线路板 Pending CN117500895A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021113991 2021-07-09
JP2021-113991 2021-07-09
PCT/JP2022/026929 WO2023282318A1 (ja) 2021-07-09 2022-07-07 接着剤組成物、接着シート、電磁波シールド材、積層体およびプリント配線板

Publications (1)

Publication Number Publication Date
CN117500895A true CN117500895A (zh) 2024-02-02

Family

ID=84800778

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280042697.1A Pending CN117500895A (zh) 2021-07-09 2022-07-07 粘接剂组合物、粘接片、电磁波屏蔽材料、层叠体以及印刷线路板

Country Status (5)

Country Link
JP (1) JP7409568B2 (https=)
KR (1) KR20240031943A (https=)
CN (1) CN117500895A (https=)
TW (1) TW202309213A (https=)
WO (1) WO2023282318A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117362935A (zh) * 2023-10-30 2024-01-09 广东龙宇新材料有限公司 一种添加氮丙啶交联剂的萘酚酚醛环氧组合物及其应用

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025012961A (ja) * 2023-07-14 2025-01-24 株式会社レゾナック 熱硬化性樹脂組成物、硬化物、及びフレキシブルプリント基板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0759691B2 (ja) * 1985-09-09 1995-06-28 日立化成工業株式会社 アデイテイブ印刷配線板用接着剤
JP2013193253A (ja) * 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
JPWO2014147903A1 (ja) 2013-03-22 2017-02-16 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP2016056249A (ja) * 2014-09-08 2016-04-21 三井化学株式会社 ポリイミドワニスおよびそれからなるフィルム
CN107075335B (zh) 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体
US10876000B2 (en) * 2016-06-02 2020-12-29 Showa Denko Materials Co., Ltd. Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module
US11624009B2 (en) * 2016-12-22 2023-04-11 Toagosei Co., Ltd. Adhesive composition, and coverlay film, bonding sheet, copper-clad laminate and electromagnetic shielding material, each using said adhesive composition
TWI827786B (zh) * 2019-01-29 2024-01-01 日商東洋紡Ｍｃ股份有限公司 含有二聚物二醇共聚聚醯亞胺胺甲酸酯樹脂之黏接劑組成物
CN114341301B (zh) * 2019-10-08 2023-09-29 东洋纺Mc株式会社 聚烯烃系粘合剂组合物
JP6919777B1 (ja) * 2019-11-29 2021-08-18 東洋紡株式会社 接着剤組成物、接着シート、積層体およびプリント配線板
KR102754554B1 (ko) * 2019-12-16 2025-01-14 아라까와 가가꾸 고교 가부시끼가이샤 접착제 조성물, 필름상 접착제, 접착층, 접착시트, 수지가 부착된 동박, 동박 적층판, 프린트 배선판, 및 다층 배선판과 그 제조방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117362935A (zh) * 2023-10-30 2024-01-09 广东龙宇新材料有限公司 一种添加氮丙啶交联剂的萘酚酚醛环氧组合物及其应用

Also Published As

Publication number Publication date
KR20240031943A (ko) 2024-03-08
JPWO2023282318A1 (https=) 2023-01-12
WO2023282318A1 (ja) 2023-01-12
JP7409568B2 (ja) 2024-01-09
TW202309213A (zh) 2023-03-01

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