JP7409568B2 - 接着剤組成物、接着シート、電磁波シールド材、積層体およびプリント配線板 - Google Patents

接着剤組成物、接着シート、電磁波シールド材、積層体およびプリント配線板 Download PDF

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JP7409568B2
JP7409568B2 JP2023533183A JP2023533183A JP7409568B2 JP 7409568 B2 JP7409568 B2 JP 7409568B2 JP 2023533183 A JP2023533183 A JP 2023533183A JP 2023533183 A JP2023533183 A JP 2023533183A JP 7409568 B2 JP7409568 B2 JP 7409568B2
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mass
resin
parts
acid
adhesive
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JPWO2023282318A5 (https=
JPWO2023282318A1 (https=
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遼 薗田
隼人 入澤
哲生 川楠
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Toyobo MC Corp
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Toyobo MC Corp
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C09J123/30—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by oxidation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
JP2023533183A 2021-07-09 2022-07-07 接着剤組成物、接着シート、電磁波シールド材、積層体およびプリント配線板 Active JP7409568B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021113991 2021-07-09
JP2021113991 2021-07-09
PCT/JP2022/026929 WO2023282318A1 (ja) 2021-07-09 2022-07-07 接着剤組成物、接着シート、電磁波シールド材、積層体およびプリント配線板

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JPWO2023282318A1 JPWO2023282318A1 (https=) 2023-01-12
JPWO2023282318A5 JPWO2023282318A5 (https=) 2023-08-30
JP7409568B2 true JP7409568B2 (ja) 2024-01-09

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Country Status (5)

Country Link
JP (1) JP7409568B2 (https=)
KR (1) KR20240031943A (https=)
CN (1) CN117500895A (https=)
TW (1) TW202309213A (https=)
WO (1) WO2023282318A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025012961A (ja) * 2023-07-14 2025-01-24 株式会社レゾナック 熱硬化性樹脂組成物、硬化物、及びフレキシブルプリント基板
CN117362935A (zh) * 2023-10-30 2024-01-09 广东龙宇新材料有限公司 一种添加氮丙啶交联剂的萘酚酚醛环氧组合物及其应用

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013193253A (ja) 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
WO2017209108A1 (ja) 2016-06-02 2017-12-07 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
WO2018116967A1 (ja) 2016-12-22 2018-06-28 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム、ボンディングシート、銅張積層板及び電磁波シールド材
WO2020158360A1 (ja) 2019-01-29 2020-08-06 東洋紡株式会社 ダイマージオール共重合ポリイミドウレタン樹脂を含む接着剤組成物
WO2021070606A1 (ja) 2019-10-08 2021-04-15 東洋紡株式会社 ポリオレフィン系接着剤組成物
WO2021106848A1 (ja) 2019-11-29 2021-06-03 東洋紡株式会社 接着剤組成物、接着シート、積層体およびプリント配線板
JP2021095570A (ja) 2019-12-16 2021-06-24 荒川化学工業株式会社 接着剤組成物、フィルム状接着剤、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0759691B2 (ja) * 1985-09-09 1995-06-28 日立化成工業株式会社 アデイテイブ印刷配線板用接着剤
WO2014147903A1 (ja) 2013-03-22 2014-09-25 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP2016056249A (ja) * 2014-09-08 2016-04-21 三井化学株式会社 ポリイミドワニスおよびそれからなるフィルム
CN107075335B (zh) 2014-09-24 2020-02-14 东亚合成株式会社 粘接剂组合物和使用了其的带有粘接剂层的层叠体

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013193253A (ja) 2012-03-16 2013-09-30 Yamaichi Electronics Co Ltd 電磁シールド性カバーレイフィルム、フレキシブル配線板およびその製造方法
WO2017209108A1 (ja) 2016-06-02 2017-12-07 日立化成株式会社 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール
WO2018116967A1 (ja) 2016-12-22 2018-06-28 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム、ボンディングシート、銅張積層板及び電磁波シールド材
WO2020158360A1 (ja) 2019-01-29 2020-08-06 東洋紡株式会社 ダイマージオール共重合ポリイミドウレタン樹脂を含む接着剤組成物
WO2021070606A1 (ja) 2019-10-08 2021-04-15 東洋紡株式会社 ポリオレフィン系接着剤組成物
WO2021106848A1 (ja) 2019-11-29 2021-06-03 東洋紡株式会社 接着剤組成物、接着シート、積層体およびプリント配線板
JP2021095570A (ja) 2019-12-16 2021-06-24 荒川化学工業株式会社 接着剤組成物、フィルム状接着剤、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法

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CN117500895A (zh) 2024-02-02
WO2023282318A1 (ja) 2023-01-12
TW202309213A (zh) 2023-03-01
KR20240031943A (ko) 2024-03-08
JPWO2023282318A1 (https=) 2023-01-12

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