KR20240016994A - 기판 처리 방법 - Google Patents

기판 처리 방법 Download PDF

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Publication number
KR20240016994A
KR20240016994A KR1020237044085A KR20237044085A KR20240016994A KR 20240016994 A KR20240016994 A KR 20240016994A KR 1020237044085 A KR1020237044085 A KR 1020237044085A KR 20237044085 A KR20237044085 A KR 20237044085A KR 20240016994 A KR20240016994 A KR 20240016994A
Authority
KR
South Korea
Prior art keywords
substrate
layer
absorption layer
laser light
chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237044085A
Other languages
English (en)
Korean (ko)
Inventor
요시히사 마츠바라
요시히로 츠츠미
요헤이 야마시타
Original Assignee
도쿄엘렉트론가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도쿄엘렉트론가부시키가이샤 filed Critical 도쿄엘렉트론가부시키가이샤
Publication of KR20240016994A publication Critical patent/KR20240016994A/ko
Pending legal-status Critical Current

Links

Classifications

    • H01L25/50—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • H01L21/6835—
    • H01L23/544—
    • H01L24/98—
    • H01L25/0655—
    • H01L25/18—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H01L2221/68318—
    • H01L2221/68381—
    • H01L2223/54426—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing & Machinery (AREA)
KR1020237044085A 2021-06-03 2022-05-25 기판 처리 방법 Pending KR20240016994A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021093400 2021-06-03
JPJP-P-2021-093400 2021-06-03
PCT/JP2022/021409 WO2022255189A1 (ja) 2021-06-03 2022-05-25 基板処理方法

Publications (1)

Publication Number Publication Date
KR20240016994A true KR20240016994A (ko) 2024-02-06

Family

ID=84323136

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237044085A Pending KR20240016994A (ko) 2021-06-03 2022-05-25 기판 처리 방법

Country Status (5)

Country Link
US (1) US20240250064A1 (https=)
JP (1) JP7636087B2 (https=)
KR (1) KR20240016994A (https=)
CN (1) CN117397001A (https=)
WO (1) WO2022255189A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125929A (ja) 1996-08-27 1998-05-15 Seiko Epson Corp 剥離方法
JP2014049698A (ja) 2012-09-03 2014-03-17 Tokyo Ohka Kogyo Co Ltd 剥離方法および剥離装置
JP2015513211A (ja) 2012-01-30 2015-04-30 スリーエム イノベイティブ プロパティズ カンパニー 一時的な基板支持のための装置、複合積層体、方法、及び材料

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
US7195813B2 (en) * 2004-05-21 2007-03-27 Eastman Kodak Company Mixed absorber layer for displays
JP6149277B2 (ja) * 2011-03-30 2017-06-21 ボンドテック株式会社 電子部品実装方法、電子部品実装システムおよび基板
EP4481811A3 (en) * 2016-12-23 2025-02-26 Board Of Regents, The University Of Texas System Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place
US10217637B1 (en) * 2017-09-20 2019-02-26 International Business Machines Corporation Chip handling and electronic component integration
CN110824599B (zh) * 2018-08-14 2021-09-03 白金科技股份有限公司 一种红外带通滤波器
WO2020111146A1 (ja) * 2018-11-29 2020-06-04 日立化成株式会社 半導体装置の製造方法及び仮固定材用積層フィルム
EP3995518A4 (en) * 2019-07-02 2022-09-07 Asahi Kasei Kabushiki Kaisha MICROWAVE FILM FOR BIOASSAY, LIGHT SENSITIVE RESIN COMPOSITION FOR THE PREPARATION OF MICROWAVE FILM FOR BIOASSAY AND METHOD OF PREPARATION OF MICROWAVE FILM FOR BIOASSAY
TWI874441B (zh) * 2019-10-29 2025-03-01 日商東京威力科創股份有限公司 附有晶片之基板的製造方法及基板處理裝置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10125929A (ja) 1996-08-27 1998-05-15 Seiko Epson Corp 剥離方法
JP2015513211A (ja) 2012-01-30 2015-04-30 スリーエム イノベイティブ プロパティズ カンパニー 一時的な基板支持のための装置、複合積層体、方法、及び材料
JP2014049698A (ja) 2012-09-03 2014-03-17 Tokyo Ohka Kogyo Co Ltd 剥離方法および剥離装置

Also Published As

Publication number Publication date
CN117397001A (zh) 2024-01-12
JPWO2022255189A1 (https=) 2022-12-08
US20240250064A1 (en) 2024-07-25
JP7636087B2 (ja) 2025-02-26
WO2022255189A1 (ja) 2022-12-08

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