KR20240011679A - 촬상 장치 및 전자 기기 - Google Patents

촬상 장치 및 전자 기기 Download PDF

Info

Publication number
KR20240011679A
KR20240011679A KR1020237037998A KR20237037998A KR20240011679A KR 20240011679 A KR20240011679 A KR 20240011679A KR 1020237037998 A KR1020237037998 A KR 1020237037998A KR 20237037998 A KR20237037998 A KR 20237037998A KR 20240011679 A KR20240011679 A KR 20240011679A
Authority
KR
South Korea
Prior art keywords
area
photoelectric conversion
unit
conversion unit
pixel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237037998A
Other languages
English (en)
Korean (ko)
Inventor
하루히사 나가노카와
겐고 우메다
Original Assignee
소니 세미컨덕터 솔루션즈 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 세미컨덕터 솔루션즈 가부시키가이샤 filed Critical 소니 세미컨덕터 솔루션즈 가부시키가이샤
Publication of KR20240011679A publication Critical patent/KR20240011679A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H01L27/14612—
    • H01L27/14636—
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/778—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising amplifiers shared between a plurality of pixels, i.e. at least one part of the amplifier must be on the sensor array itself
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8037—Pixels having integrated switching, control, storage or amplification elements the integrated elements comprising a transistor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K39/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic radiation-sensitive element covered by group H10K30/00
    • H10K39/30—Devices controlled by radiation
    • H10K39/32—Organic image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
KR1020237037998A 2021-05-25 2022-03-29 촬상 장치 및 전자 기기 Pending KR20240011679A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021087988 2021-05-25
JPJP-P-2021-087988 2021-05-25
PCT/JP2022/015276 WO2022249731A1 (ja) 2021-05-25 2022-03-29 撮像装置及び電子機器

Publications (1)

Publication Number Publication Date
KR20240011679A true KR20240011679A (ko) 2024-01-26

Family

ID=84228757

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237037998A Pending KR20240011679A (ko) 2021-05-25 2022-03-29 촬상 장치 및 전자 기기

Country Status (7)

Country Link
US (1) US20240187759A1 (https=)
EP (1) EP4351127A4 (https=)
JP (1) JPWO2022249731A1 (https=)
KR (1) KR20240011679A (https=)
CN (1) CN117337579A (https=)
TW (1) TW202247639A (https=)
WO (1) WO2022249731A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018148528A (ja) 2017-03-09 2018-09-20 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5458869B2 (ja) * 2009-12-21 2014-04-02 ソニー株式会社 固体撮像装置およびその駆動方法、カメラ
US20150287766A1 (en) * 2014-04-02 2015-10-08 Tae-Chan Kim Unit pixel of an image sensor and image sensor including the same
KR102549621B1 (ko) * 2016-09-02 2023-06-28 삼성전자주식회사 반도체 장치
JP7080660B2 (ja) * 2018-02-09 2022-06-06 キヤノン株式会社 光電変換装置、撮像システム、および、移動体
JP2019216379A (ja) * 2018-06-14 2019-12-19 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
JP2021184510A (ja) * 2018-08-31 2021-12-02 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその駆動方法、並びに電子機器
JP2020096225A (ja) * 2018-12-10 2020-06-18 ソニーセミコンダクタソリューションズ株式会社 撮像装置及び電子機器

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018148528A (ja) 2017-03-09 2018-09-20 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器

Also Published As

Publication number Publication date
US20240187759A1 (en) 2024-06-06
JPWO2022249731A1 (https=) 2022-12-01
TW202247639A (zh) 2022-12-01
WO2022249731A1 (ja) 2022-12-01
EP4351127A4 (en) 2025-06-25
EP4351127A1 (en) 2024-04-10
CN117337579A (zh) 2024-01-02

Similar Documents

Publication Publication Date Title
US11895422B2 (en) Solid-state imaging device
JP7611147B2 (ja) 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
US20210385402A1 (en) Solid-state image sensor
CN114303367A (zh) 具有共享电路元件的固态摄像装置和摄像装置
CN121728847A (zh) 成像装置和电子设备
JP7645260B2 (ja) 固体撮像装置及び撮像装置
JP7787185B2 (ja) 撮像装置及び電子機器
JP2020088481A (ja) 固体撮像素子、および、撮像装置
KR20230028422A (ko) 고체 촬상 장치
US20230262362A1 (en) Imaging apparatus and imaging method
US12581211B2 (en) Imaging circuit and imaging device
CN113875226B (zh) 固态摄像元件、摄像装置和固态摄像元件的控制方法
JP7751602B2 (ja) 固体撮像素子
US12267609B2 (en) Solid-state imaging device
KR20240011679A (ko) 촬상 장치 및 전자 기기
US12452561B2 (en) Image capturing apparatus and electronic device
US12133008B2 (en) Solid-state imaging element and imaging device
JP2025005287A (ja) 光検出装置
WO2025004802A1 (ja) 撮像装置
WO2025248978A1 (ja) イメージセンサ、および、イメージセンサの制御方法
WO2023026576A1 (ja) 撮像装置及び電子機器
WO2024095630A1 (ja) 撮像装置
WO2024157605A1 (ja) 撮像装置および電子機器

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20231103

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250207

Comment text: Request for Examination of Application