KR20230164008A - 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법 - Google Patents

분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법 Download PDF

Info

Publication number
KR20230164008A
KR20230164008A KR1020237028419A KR20237028419A KR20230164008A KR 20230164008 A KR20230164008 A KR 20230164008A KR 1020237028419 A KR1020237028419 A KR 1020237028419A KR 20237028419 A KR20237028419 A KR 20237028419A KR 20230164008 A KR20230164008 A KR 20230164008A
Authority
KR
South Korea
Prior art keywords
particles
powder
less
classification
mass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237028419A
Other languages
English (en)
Korean (ko)
Inventor
미키 에가미
마사노부 다니구치
히로타다 아라카네
료 무라구치
Original Assignee
니끼 쇼꾸바이 카세이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 니끼 쇼꾸바이 카세이 가부시키가이샤 filed Critical 니끼 쇼꾸바이 카세이 가부시키가이샤
Publication of KR20230164008A publication Critical patent/KR20230164008A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/187—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
    • C01B33/193—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
KR1020237028419A 2021-03-31 2022-03-30 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법 Pending KR20230164008A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021060589 2021-03-31
JPJP-P-2021-060589 2021-03-31
PCT/JP2022/016129 WO2022210920A1 (ja) 2021-03-31 2022-03-30 粉体及びその製造方法、並びに樹脂組成物の製造方法

Publications (1)

Publication Number Publication Date
KR20230164008A true KR20230164008A (ko) 2023-12-01

Family

ID=83459556

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237028419A Pending KR20230164008A (ko) 2021-03-31 2022-03-30 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법

Country Status (5)

Country Link
JP (1) JP7853955B2 (https=)
KR (1) KR20230164008A (https=)
CN (1) CN116917233A (https=)
TW (1) TW202305050A (https=)
WO (1) WO2022210920A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7396735B1 (ja) 2022-11-25 2023-12-12 三水株式会社 中空粒子の製造方法
WO2026034578A1 (ja) * 2024-08-09 2026-02-12 積水化成品工業株式会社 中空樹脂粒子、およびその用途

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001288227A (ja) 2000-02-04 2001-10-16 Daikin Ind Ltd 高周波電気特性に優れたテトラフルオロエチレン系樹脂成形用材料
JP2006516297A (ja) 2003-01-28 2006-06-29 松下電工株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、積層板
WO2009041137A1 (ja) 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板
JP2017057352A (ja) 2015-09-18 2017-03-23 三菱瓦斯化学株式会社 プリプレグ
JP2019172962A (ja) 2018-03-26 2019-10-10 ダイキン工業株式会社 フッ素樹脂材料、高周波伝送用フッ素樹脂材料および高周波伝送用被覆電線

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454246A (zh) * 2006-06-09 2009-06-10 株式会社德山 干式二氧化硅微粒
CN101490138B (zh) * 2006-08-21 2012-07-18 株式会社日本触媒 微粒、微粒的制备方法、含有该微粒的树脂组合物及光学薄膜
TWI457282B (zh) * 2008-06-20 2014-10-21 電氣化學工業股份有限公司 非晶質矽石質粉末、其製造方法、樹脂組成物、及半導體封止材
CN102471590B (zh) * 2009-07-14 2015-05-20 花王株式会社 低介电树脂组合物
JP5822663B2 (ja) * 2011-11-11 2015-11-24 日揮触媒化成株式会社 耐湿性を備えたシリカ系粒子とその製造方法、該粒子を含む半導体封止用樹脂組成物、および該樹脂組成物により塗膜を形成された基材
WO2013121703A1 (ja) * 2012-02-13 2013-08-22 株式会社トクヤマシルテック 新規な特性プロファイルを有するシリカバルーン材料
JP2018083759A (ja) * 2015-03-24 2018-05-31 旭硝子株式会社 化粧料
JP2017071526A (ja) * 2015-10-06 2017-04-13 株式会社トクヤマシルテック 溶媒に対して良好な懸濁プロファイルを有するシリカバルーン材料。
JP6255053B2 (ja) * 2016-04-20 2017-12-27 花王株式会社 中空シリカ粒子及びその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001288227A (ja) 2000-02-04 2001-10-16 Daikin Ind Ltd 高周波電気特性に優れたテトラフルオロエチレン系樹脂成形用材料
JP2006516297A (ja) 2003-01-28 2006-06-29 松下電工株式会社 ポリフェニレンエーテル樹脂組成物、プリプレグ、積層板
WO2009041137A1 (ja) 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ、金属張積層板、及びプリント配線板
JP2017057352A (ja) 2015-09-18 2017-03-23 三菱瓦斯化学株式会社 プリプレグ
JP2019172962A (ja) 2018-03-26 2019-10-10 ダイキン工業株式会社 フッ素樹脂材料、高周波伝送用フッ素樹脂材料および高周波伝送用被覆電線

Also Published As

Publication number Publication date
JP7853955B2 (ja) 2026-04-30
CN116917233A (zh) 2023-10-20
TW202305050A (zh) 2023-02-01
JPWO2022210920A1 (https=) 2022-10-06
WO2022210920A1 (ja) 2022-10-06

Similar Documents

Publication Publication Date Title
CN116529321B (zh) 空心颗粒及其制造方法以及树脂组合物
JP7853955B2 (ja) 粉体及びその製造方法、並びに樹脂組成物の製造方法
JP7478031B2 (ja) 低誘電シリカ粉体の製造方法
KR20230113158A (ko) 저유전 비정질 실리카 분체 및 그 제조 방법, 그리고 표면처리 저유전 실리카 분체, 실리카 슬러리, 실리카 함유 수지 조성물, 실리카 함유 프리프레그 및 프린트 배선판
WO2022254960A1 (ja) 低誘電損失樹脂組成物、その製造方法、高周波機器用成形体及び高周波機器
KR20240037979A (ko) 구상 실리카 분말 및 구상 실리카 분말의 제조 방법
TW202204486A (zh) 分散液之製造方法
CN119365418A (zh) 球状二氧化硅粉末的制造方法
KR20230161426A (ko) 분체 및 그 제조 방법, 그리고 수지 조성물의 제조 방법
JP2023150838A (ja) 粉体及びその製造方法、並びに樹脂組成物の製造方法
JP2024146810A (ja) 中空粒子を含む粉体、及びその製造方法
JP7598489B2 (ja) 電子材料用フィラー及びその製造方法、電子材料用スラリー、並びに電子材料用樹脂組成物
KR20240147553A (ko) 중공 입자를 포함하는 분체, 및 그 제조 방법
JP2023151180A (ja) シリカ系中空粒子及びその製造方法
JP2025153627A (ja) 粉体及びその製造方法、並びに樹脂組成物
WO2025182883A1 (ja) 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法
KR20220158736A (ko) 복합 입자, 복합 입자의 제조 방법, 액상 조성물, 적층체의 제조 방법 및 필름의 제조 방법
CN118724005A (zh) 含有中空粒子的粉体及其制造方法
EP2213633B1 (en) Process for producing flaky-glass granule, flaky-glass granule, and resin composition containing the same
WO2025182884A1 (ja) 球状シリカ粒子粉体及び球状シリカ粒子粉体の製造方法
US20260070795A1 (en) Spherical silica powder and method for producing spherical silica powder
WO2023218949A1 (ja) シリカ粒子分散液
CN120841531A (zh) 一种低介电球形二氧化硅微粉制备方法

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20230822

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20250326

Comment text: Request for Examination of Application