CN116917233A - 粉体及其制造方法、以及树脂组合物的制造方法 - Google Patents

粉体及其制造方法、以及树脂组合物的制造方法 Download PDF

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Publication number
CN116917233A
CN116917233A CN202280016384.9A CN202280016384A CN116917233A CN 116917233 A CN116917233 A CN 116917233A CN 202280016384 A CN202280016384 A CN 202280016384A CN 116917233 A CN116917233 A CN 116917233A
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China
Prior art keywords
particles
powder
less
mass
classification
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Pending
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CN202280016384.9A
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English (en)
Chinese (zh)
Inventor
江上美纪
谷口正展
荒金宏忠
村口良
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JGC Catalysts and Chemicals Ltd
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JGC Catalysts and Chemicals Ltd
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Publication of CN116917233A publication Critical patent/CN116917233A/zh
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
    • C08K7/24Expanded, porous or hollow particles inorganic
    • C08K7/26Silicon- containing compounds
    • CCHEMISTRY; METALLURGY
    • C01INORGANIC CHEMISTRY
    • C01BNON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00Silicon; Compounds thereof
    • C01B33/113Silicon oxides; Hydrates thereof
    • C01B33/12Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/187Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
    • C01B33/193Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
CN202280016384.9A 2021-03-31 2022-03-30 粉体及其制造方法、以及树脂组合物的制造方法 Pending CN116917233A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-060589 2021-03-31
JP2021060589 2021-03-31
PCT/JP2022/016129 WO2022210920A1 (ja) 2021-03-31 2022-03-30 粉体及びその製造方法、並びに樹脂組成物の製造方法

Publications (1)

Publication Number Publication Date
CN116917233A true CN116917233A (zh) 2023-10-20

Family

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CN202280016384.9A Pending CN116917233A (zh) 2021-03-31 2022-03-30 粉体及其制造方法、以及树脂组合物的制造方法

Country Status (5)

Country Link
JP (1) JP7853955B2 (https=)
KR (1) KR20230164008A (https=)
CN (1) CN116917233A (https=)
TW (1) TW202305050A (https=)
WO (1) WO2022210920A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7396735B1 (ja) 2022-11-25 2023-12-12 三水株式会社 中空粒子の製造方法
WO2026034578A1 (ja) * 2024-08-09 2026-02-12 積水化成品工業株式会社 中空樹脂粒子、およびその用途

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454246A (zh) * 2006-06-09 2009-06-10 株式会社德山 干式二氧化硅微粒
CN101490138A (zh) * 2006-08-21 2009-07-22 株式会社日本触媒 微粒、微粒的制备方法、含有该微粒的树脂组合物及光学薄膜
CN102066254A (zh) * 2008-06-20 2011-05-18 电气化学工业株式会社 无定形二氧化硅粉末、其制造方法、树脂组合物及半导体密封材料
CN102471590A (zh) * 2009-07-14 2012-05-23 花王株式会社 低介电树脂组合物
JP2013103850A (ja) * 2011-11-11 2013-05-30 Jgc Catalysts & Chemicals Ltd 耐湿性を備えたシリカ系粒子とその製造方法、該粒子を含む半導体封止用樹脂組成物、および該樹脂組成物により塗膜を形成された基材
JP2017071526A (ja) * 2015-10-06 2017-04-13 株式会社トクヤマシルテック 溶媒に対して良好な懸濁プロファイルを有するシリカバルーン材料。

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001288227A (ja) 2000-02-04 2001-10-16 Daikin Ind Ltd 高周波電気特性に優れたテトラフルオロエチレン系樹脂成形用材料
US7413791B2 (en) 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
WO2009040921A1 (ja) 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
WO2013121703A1 (ja) * 2012-02-13 2013-08-22 株式会社トクヤマシルテック 新規な特性プロファイルを有するシリカバルーン材料
JP2018083759A (ja) * 2015-03-24 2018-05-31 旭硝子株式会社 化粧料
JP6623640B2 (ja) 2015-09-18 2019-12-25 三菱瓦斯化学株式会社 プリプレグ
JP6255053B2 (ja) * 2016-04-20 2017-12-27 花王株式会社 中空シリカ粒子及びその製造方法
US11926753B2 (en) 2018-03-26 2024-03-12 Daikin Industries, Ltd. Fluororesin material, fluororesin material for high frequency transmission, and covered electric wire for high-frequency transmission

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101454246A (zh) * 2006-06-09 2009-06-10 株式会社德山 干式二氧化硅微粒
CN101490138A (zh) * 2006-08-21 2009-07-22 株式会社日本触媒 微粒、微粒的制备方法、含有该微粒的树脂组合物及光学薄膜
CN102066254A (zh) * 2008-06-20 2011-05-18 电气化学工业株式会社 无定形二氧化硅粉末、其制造方法、树脂组合物及半导体密封材料
CN102471590A (zh) * 2009-07-14 2012-05-23 花王株式会社 低介电树脂组合物
JP2013103850A (ja) * 2011-11-11 2013-05-30 Jgc Catalysts & Chemicals Ltd 耐湿性を備えたシリカ系粒子とその製造方法、該粒子を含む半導体封止用樹脂組成物、および該樹脂組成物により塗膜を形成された基材
JP2017071526A (ja) * 2015-10-06 2017-04-13 株式会社トクヤマシルテック 溶媒に対して良好な懸濁プロファイルを有するシリカバルーン材料。

Also Published As

Publication number Publication date
JP7853955B2 (ja) 2026-04-30
KR20230164008A (ko) 2023-12-01
TW202305050A (zh) 2023-02-01
JPWO2022210920A1 (https=) 2022-10-06
WO2022210920A1 (ja) 2022-10-06

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