TW202305050A - 粉體及其製造方法、以及樹脂組合物的製造方法 - Google Patents

粉體及其製造方法、以及樹脂組合物的製造方法 Download PDF

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Publication number
TW202305050A
TW202305050A TW111112560A TW111112560A TW202305050A TW 202305050 A TW202305050 A TW 202305050A TW 111112560 A TW111112560 A TW 111112560A TW 111112560 A TW111112560 A TW 111112560A TW 202305050 A TW202305050 A TW 202305050A
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TW
Taiwan
Prior art keywords
particles
powder
mass
less
classification
Prior art date
Application number
TW111112560A
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English (en)
Chinese (zh)
Inventor
江上美紀
谷口正展
荒金宏忠
村口良
Original Assignee
日商日揮觸媒化成股份有限公司
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Application filed by 日商日揮觸媒化成股份有限公司 filed Critical 日商日揮觸媒化成股份有限公司
Publication of TW202305050A publication Critical patent/TW202305050A/zh

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/187—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates
    • C01B33/193—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by acidic treatment of silicates of aqueous solutions of silicates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
TW111112560A 2021-03-31 2022-03-31 粉體及其製造方法、以及樹脂組合物的製造方法 TW202305050A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021-060589 2021-03-31
JP2021060589 2021-03-31

Publications (1)

Publication Number Publication Date
TW202305050A true TW202305050A (zh) 2023-02-01

Family

ID=83459556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111112560A TW202305050A (zh) 2021-03-31 2022-03-31 粉體及其製造方法、以及樹脂組合物的製造方法

Country Status (5)

Country Link
JP (1) JP7853955B2 (https=)
KR (1) KR20230164008A (https=)
CN (1) CN116917233A (https=)
TW (1) TW202305050A (https=)
WO (1) WO2022210920A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7396735B1 (ja) 2022-11-25 2023-12-12 三水株式会社 中空粒子の製造方法
WO2026034578A1 (ja) * 2024-08-09 2026-02-12 積水化成品工業株式会社 中空樹脂粒子、およびその用途

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001288227A (ja) 2000-02-04 2001-10-16 Daikin Ind Ltd 高周波電気特性に優れたテトラフルオロエチレン系樹脂成形用材料
US7413791B2 (en) 2003-01-28 2008-08-19 Matsushita Electric Works, Ltd. Poly (phenylene ether) resin composition, prepreg, and laminated sheet
CN101454246A (zh) * 2006-06-09 2009-06-10 株式会社德山 干式二氧化硅微粒
CN101490138B (zh) * 2006-08-21 2012-07-18 株式会社日本触媒 微粒、微粒的制备方法、含有该微粒的树脂组合物及光学薄膜
WO2009040921A1 (ja) 2007-09-27 2009-04-02 Panasonic Electric Works Co., Ltd. エポキシ樹脂組成物、そのエポキシ樹脂組成物を用いたプリプレグ及び金属張積層板
TWI457282B (zh) * 2008-06-20 2014-10-21 電氣化學工業股份有限公司 非晶質矽石質粉末、其製造方法、樹脂組成物、及半導體封止材
CN102471590B (zh) * 2009-07-14 2015-05-20 花王株式会社 低介电树脂组合物
JP5822663B2 (ja) * 2011-11-11 2015-11-24 日揮触媒化成株式会社 耐湿性を備えたシリカ系粒子とその製造方法、該粒子を含む半導体封止用樹脂組成物、および該樹脂組成物により塗膜を形成された基材
WO2013121703A1 (ja) * 2012-02-13 2013-08-22 株式会社トクヤマシルテック 新規な特性プロファイルを有するシリカバルーン材料
JP2018083759A (ja) * 2015-03-24 2018-05-31 旭硝子株式会社 化粧料
JP6623640B2 (ja) 2015-09-18 2019-12-25 三菱瓦斯化学株式会社 プリプレグ
JP2017071526A (ja) * 2015-10-06 2017-04-13 株式会社トクヤマシルテック 溶媒に対して良好な懸濁プロファイルを有するシリカバルーン材料。
JP6255053B2 (ja) * 2016-04-20 2017-12-27 花王株式会社 中空シリカ粒子及びその製造方法
US11926753B2 (en) 2018-03-26 2024-03-12 Daikin Industries, Ltd. Fluororesin material, fluororesin material for high frequency transmission, and covered electric wire for high-frequency transmission

Also Published As

Publication number Publication date
JP7853955B2 (ja) 2026-04-30
CN116917233A (zh) 2023-10-20
KR20230164008A (ko) 2023-12-01
JPWO2022210920A1 (https=) 2022-10-06
WO2022210920A1 (ja) 2022-10-06

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