KR20230096042A - 배선 기판 및 프로브 카드 - Google Patents

배선 기판 및 프로브 카드 Download PDF

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Publication number
KR20230096042A
KR20230096042A KR1020237017636A KR20237017636A KR20230096042A KR 20230096042 A KR20230096042 A KR 20230096042A KR 1020237017636 A KR1020237017636 A KR 1020237017636A KR 20237017636 A KR20237017636 A KR 20237017636A KR 20230096042 A KR20230096042 A KR 20230096042A
Authority
KR
South Korea
Prior art keywords
conductor
wiring
wiring board
wiring layer
linear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237017636A
Other languages
English (en)
Korean (ko)
Inventor
요시히로 토다
Original Assignee
교세라 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 교세라 가부시키가이샤 filed Critical 교세라 가부시키가이샤
Publication of KR20230096042A publication Critical patent/KR20230096042A/ko
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
KR1020237017636A 2020-11-27 2021-11-25 배선 기판 및 프로브 카드 Pending KR20230096042A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020196678 2020-11-27
JPJP-P-2020-196678 2020-11-27
PCT/JP2021/043263 WO2022114078A1 (ja) 2020-11-27 2021-11-25 配線基板及びプローブカード

Publications (1)

Publication Number Publication Date
KR20230096042A true KR20230096042A (ko) 2023-06-29

Family

ID=81754317

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237017636A Pending KR20230096042A (ko) 2020-11-27 2021-11-25 배선 기판 및 프로브 카드

Country Status (4)

Country Link
US (1) US20240027493A1 (https=)
JP (1) JP7550238B2 (https=)
KR (1) KR20230096042A (https=)
WO (1) WO2022114078A1 (https=)

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249742Y2 (https=) * 1985-12-09 1990-12-27
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
NL9100103A (nl) * 1991-01-23 1992-08-17 Philips Nv Halfgeleiderdiodelaser met monitordiode.
JP3008146B2 (ja) * 1992-10-26 2000-02-14 株式会社住友金属エレクトロデバイス 半導体素子収納用セラミックパッケージとその製造方法
BE1007282A3 (nl) * 1993-07-12 1995-05-09 Philips Electronics Nv Opto-electronische halfgeleiderinrichting met een array van halfgeleiderdiodelasers en werkwijze ter vervaardiging daarvan.
JPH11163500A (ja) * 1997-11-25 1999-06-18 Sumitomo Metal Smi Electron Devices Inc セラミック配線基板の洗浄方法
JP5334607B2 (ja) 2008-12-25 2013-11-06 京セラ株式会社 配線基板及び配線基板の製造方法並びにプローブカード
FI20095110A0 (fi) * 2009-02-06 2009-02-06 Imbera Electronics Oy Elektroniikkamoduuli, jossa on EMI-suoja
JP2010232579A (ja) 2009-03-30 2010-10-14 Oki Networks Co Ltd プリント配線板の製造方法
JP2012243836A (ja) 2011-05-17 2012-12-10 Hitachi Cable Ltd フレキシブル配線基板およびその製造方法
CN104427789B (zh) 2013-08-22 2017-09-12 鹏鼎控股(深圳)股份有限公司 多层电路板及其制作方法
WO2020218335A1 (ja) * 2019-04-22 2020-10-29 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール
WO2023054419A1 (ja) * 2021-09-30 2023-04-06 京セラ株式会社 半導体素子実装用基板及び半導体装置
EP4391733A4 (en) * 2021-10-20 2024-12-25 Samsung Electronics Co., Ltd. PRINTED CIRCUIT BOARD HAVING INCREASED DURABILITY IN CURVED AREA AND ELECTRONIC DEVICE COMPRISING SAME
EP4352822A4 (en) * 2021-12-02 2024-10-23 Samsung Electronics Co., Ltd. INTEGRATED CIRCUIT BOARD ANTENNA FOR TRANSMITTING/RECEIVING DATA
CN118613907A (zh) * 2022-01-28 2024-09-06 京瓷株式会社 布线基板、使用了布线基板的电子部件安装用封装体及电子模块
KR20240021481A (ko) * 2022-08-10 2024-02-19 삼성전기주식회사 인쇄회로기판 및 그 제조방법
EP4622399A1 (en) * 2024-03-21 2025-09-24 ZF CV Systems Global GmbH Printed circuit board, electrical circuit assembly and methods of producing a printed circuit board and an electrical circuit assembly

Also Published As

Publication number Publication date
WO2022114078A1 (ja) 2022-06-02
US20240027493A1 (en) 2024-01-25
JPWO2022114078A1 (https=) 2022-06-02
JP7550238B2 (ja) 2024-09-12

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