JP7550238B2 - 配線基板及びプローブカード - Google Patents

配線基板及びプローブカード Download PDF

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Publication number
JP7550238B2
JP7550238B2 JP2022565418A JP2022565418A JP7550238B2 JP 7550238 B2 JP7550238 B2 JP 7550238B2 JP 2022565418 A JP2022565418 A JP 2022565418A JP 2022565418 A JP2022565418 A JP 2022565418A JP 7550238 B2 JP7550238 B2 JP 7550238B2
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JP
Japan
Prior art keywords
conductor
wiring
wiring board
wiring layer
linear
Prior art date
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Active
Application number
JP2022565418A
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English (en)
Japanese (ja)
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JPWO2022114078A1 (https=
Inventor
芳宏 戸田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Publication of JPWO2022114078A1 publication Critical patent/JPWO2022114078A1/ja
Application granted granted Critical
Publication of JP7550238B2 publication Critical patent/JP7550238B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0416—Connectors, terminals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
JP2022565418A 2020-11-27 2021-11-25 配線基板及びプローブカード Active JP7550238B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020196678 2020-11-27
JP2020196678 2020-11-27
PCT/JP2021/043263 WO2022114078A1 (ja) 2020-11-27 2021-11-25 配線基板及びプローブカード

Publications (2)

Publication Number Publication Date
JPWO2022114078A1 JPWO2022114078A1 (https=) 2022-06-02
JP7550238B2 true JP7550238B2 (ja) 2024-09-12

Family

ID=81754317

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022565418A Active JP7550238B2 (ja) 2020-11-27 2021-11-25 配線基板及びプローブカード

Country Status (4)

Country Link
US (1) US20240027493A1 (https=)
JP (1) JP7550238B2 (https=)
KR (1) KR20230096042A (https=)
WO (1) WO2022114078A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171351A (ja) 2008-12-25 2010-08-05 Kyocera Corp 配線基板及び配線基板の製造方法並びにプローブカード
JP2010232579A (ja) 2009-03-30 2010-10-14 Oki Networks Co Ltd プリント配線板の製造方法
JP2012243836A (ja) 2011-05-17 2012-12-10 Hitachi Cable Ltd フレキシブル配線基板およびその製造方法
CN104427789A (zh) 2013-08-22 2015-03-18 富葵精密组件(深圳)有限公司 多层电路板及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0249742Y2 (https=) * 1985-12-09 1990-12-27
JPS63224392A (ja) * 1987-03-13 1988-09-19 日本メクトロン株式会社 多層プリント配線板およびその加工法
NL9100103A (nl) * 1991-01-23 1992-08-17 Philips Nv Halfgeleiderdiodelaser met monitordiode.
JP3008146B2 (ja) * 1992-10-26 2000-02-14 株式会社住友金属エレクトロデバイス 半導体素子収納用セラミックパッケージとその製造方法
BE1007282A3 (nl) * 1993-07-12 1995-05-09 Philips Electronics Nv Opto-electronische halfgeleiderinrichting met een array van halfgeleiderdiodelasers en werkwijze ter vervaardiging daarvan.
JPH11163500A (ja) * 1997-11-25 1999-06-18 Sumitomo Metal Smi Electron Devices Inc セラミック配線基板の洗浄方法
FI20095110A0 (fi) * 2009-02-06 2009-02-06 Imbera Electronics Oy Elektroniikkamoduuli, jossa on EMI-suoja
WO2020218335A1 (ja) * 2019-04-22 2020-10-29 京セラ株式会社 電子部品収納用パッケージ、電子装置、および電子モジュール
CN118043959A (zh) * 2021-09-30 2024-05-14 京瓷株式会社 半导体元件安装用基板以及半导体装置
EP4391733A4 (en) * 2021-10-20 2024-12-25 Samsung Electronics Co., Ltd. PRINTED CIRCUIT BOARD HAVING INCREASED DURABILITY IN CURVED AREA AND ELECTRONIC DEVICE COMPRISING SAME
EP4352822A4 (en) * 2021-12-02 2024-10-23 Samsung Electronics Co., Ltd. INTEGRATED CIRCUIT BOARD ANTENNA FOR TRANSMITTING/RECEIVING DATA
US20250151200A1 (en) * 2022-01-28 2025-05-08 Kyocera Corporation Wiring board, electronic component mounting package using wiring board, and electronic module
KR20240021481A (ko) * 2022-08-10 2024-02-19 삼성전기주식회사 인쇄회로기판 및 그 제조방법
EP4622399A1 (en) * 2024-03-21 2025-09-24 ZF CV Systems Global GmbH Printed circuit board, electrical circuit assembly and methods of producing a printed circuit board and an electrical circuit assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010171351A (ja) 2008-12-25 2010-08-05 Kyocera Corp 配線基板及び配線基板の製造方法並びにプローブカード
JP2010232579A (ja) 2009-03-30 2010-10-14 Oki Networks Co Ltd プリント配線板の製造方法
JP2012243836A (ja) 2011-05-17 2012-12-10 Hitachi Cable Ltd フレキシブル配線基板およびその製造方法
CN104427789A (zh) 2013-08-22 2015-03-18 富葵精密组件(深圳)有限公司 多层电路板及其制作方法

Also Published As

Publication number Publication date
US20240027493A1 (en) 2024-01-25
JPWO2022114078A1 (https=) 2022-06-02
WO2022114078A1 (ja) 2022-06-02
KR20230096042A (ko) 2023-06-29

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