KR20230085177A - 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법 - Google Patents

반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법 Download PDF

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Publication number
KR20230085177A
KR20230085177A KR1020237015878A KR20237015878A KR20230085177A KR 20230085177 A KR20230085177 A KR 20230085177A KR 1020237015878 A KR1020237015878 A KR 1020237015878A KR 20237015878 A KR20237015878 A KR 20237015878A KR 20230085177 A KR20230085177 A KR 20230085177A
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KR
South Korea
Prior art keywords
resin
holding portion
holding
unloader
molded product
Prior art date
Application number
KR1020237015878A
Other languages
English (en)
Korean (ko)
Inventor
슈헤이 요시다
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20230085177A publication Critical patent/KR20230085177A/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
KR1020237015878A 2021-02-09 2021-12-20 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법 KR20230085177A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-018748 2021-02-09
JP2021018748A JP7394798B2 (ja) 2021-02-09 2021-02-09 搬送機構、樹脂成形装置及び樹脂成形品の製造方法
PCT/JP2021/046928 WO2022172592A1 (ja) 2021-02-09 2021-12-20 搬送機構、樹脂成形装置及び樹脂成形品の製造方法

Publications (1)

Publication Number Publication Date
KR20230085177A true KR20230085177A (ko) 2023-06-13

Family

ID=82838673

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237015878A KR20230085177A (ko) 2021-02-09 2021-12-20 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법

Country Status (5)

Country Link
JP (1) JP7394798B2 (ja)
KR (1) KR20230085177A (ja)
CN (1) CN116457183A (ja)
TW (1) TWI801041B (ja)
WO (1) WO2022172592A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020026088A (ja) 2018-08-10 2020-02-20 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07205218A (ja) * 1994-01-17 1995-08-08 Hitachi Ltd 成形品分離装置
JPH0936156A (ja) * 1995-07-25 1997-02-07 Mitsubishi Electric Corp ゲートブレイク装置およびゲートブレイク方法
JP6655150B1 (ja) * 2018-10-19 2020-02-26 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020026088A (ja) 2018-08-10 2020-02-20 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド装置

Also Published As

Publication number Publication date
CN116457183A (zh) 2023-07-18
TWI801041B (zh) 2023-05-01
JP7394798B2 (ja) 2023-12-08
WO2022172592A1 (ja) 2022-08-18
TW202233382A (zh) 2022-09-01
JP2022121827A (ja) 2022-08-22

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