TWI801041B - 搬送機構、樹脂成形裝置及樹脂成形品的製造方法 - Google Patents
搬送機構、樹脂成形裝置及樹脂成形品的製造方法 Download PDFInfo
- Publication number
- TWI801041B TWI801041B TW110147603A TW110147603A TWI801041B TW I801041 B TWI801041 B TW I801041B TW 110147603 A TW110147603 A TW 110147603A TW 110147603 A TW110147603 A TW 110147603A TW I801041 B TWI801041 B TW I801041B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- molded product
- conveying mechanism
- molding device
- resin
- Prior art date
Links
- 239000011347 resin Substances 0.000 title 2
- 229920005989 resin Polymers 0.000 title 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000465 moulding Methods 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
- B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/62—Plastics recycling; Rubber recycling
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Robotics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021-018748 | 2021-02-09 | ||
| JP2021018748A JP7394798B2 (ja) | 2021-02-09 | 2021-02-09 | 搬送機構、樹脂成形装置及び樹脂成形品の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW202233382A TW202233382A (zh) | 2022-09-01 |
| TWI801041B true TWI801041B (zh) | 2023-05-01 |
Family
ID=82838673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW110147603A TWI801041B (zh) | 2021-02-09 | 2021-12-20 | 搬送機構、樹脂成形裝置及樹脂成形品的製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7394798B2 (zh) |
| KR (1) | KR20230085177A (zh) |
| CN (1) | CN116457183A (zh) |
| TW (1) | TWI801041B (zh) |
| WO (1) | WO2022172592A1 (zh) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936156A (ja) * | 1995-07-25 | 1997-02-07 | Mitsubishi Electric Corp | ゲートブレイク装置およびゲートブレイク方法 |
| TW202015877A (zh) * | 2018-10-19 | 2020-05-01 | 日商Ｔｏｗａ股份有限公司 | 搬運裝置、樹脂成形裝置、搬運方法及樹脂成形品的製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07205218A (ja) * | 1994-01-17 | 1995-08-08 | Hitachi Ltd | 成形品分離装置 |
| JP7068094B2 (ja) | 2018-08-10 | 2022-05-16 | アピックヤマダ株式会社 | ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法 |
-
2021
- 2021-02-09 JP JP2021018748A patent/JP7394798B2/ja active Active
- 2021-12-20 CN CN202180076879.6A patent/CN116457183A/zh active Pending
- 2021-12-20 KR KR1020237015878A patent/KR20230085177A/ko unknown
- 2021-12-20 WO PCT/JP2021/046928 patent/WO2022172592A1/ja active Application Filing
- 2021-12-20 TW TW110147603A patent/TWI801041B/zh active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0936156A (ja) * | 1995-07-25 | 1997-02-07 | Mitsubishi Electric Corp | ゲートブレイク装置およびゲートブレイク方法 |
| TW202015877A (zh) * | 2018-10-19 | 2020-05-01 | 日商Ｔｏｗａ股份有限公司 | 搬運裝置、樹脂成形裝置、搬運方法及樹脂成形品的製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7394798B2 (ja) | 2023-12-08 |
| WO2022172592A1 (ja) | 2022-08-18 |
| KR20230085177A (ko) | 2023-06-13 |
| JP2022121827A (ja) | 2022-08-22 |
| TW202233382A (zh) | 2022-09-01 |
| CN116457183A (zh) | 2023-07-18 |
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