JP7394798B2 - 搬送機構、樹脂成形装置及び樹脂成形品の製造方法 - Google Patents

搬送機構、樹脂成形装置及び樹脂成形品の製造方法 Download PDF

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Publication number
JP7394798B2
JP7394798B2 JP2021018748A JP2021018748A JP7394798B2 JP 7394798 B2 JP7394798 B2 JP 7394798B2 JP 2021018748 A JP2021018748 A JP 2021018748A JP 2021018748 A JP2021018748 A JP 2021018748A JP 7394798 B2 JP7394798 B2 JP 7394798B2
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Japan
Prior art keywords
resin
molded product
holding part
section
unloader
Prior art date
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Active
Application number
JP2021018748A
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English (en)
Japanese (ja)
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JP2022121827A (ja
Inventor
周平 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Priority to JP2021018748A priority Critical patent/JP7394798B2/ja
Priority to CN202180076879.6A priority patent/CN116457183A/zh
Priority to TW110147603A priority patent/TWI801041B/zh
Priority to KR1020237015878A priority patent/KR20230085177A/ko
Priority to PCT/JP2021/046928 priority patent/WO2022172592A1/ja
Publication of JP2022121827A publication Critical patent/JP2022121827A/ja
Application granted granted Critical
Publication of JP7394798B2 publication Critical patent/JP7394798B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/40—Removing or ejecting moulded articles
    • B29C45/42—Removing or ejecting moulded articles using means movable from outside the mould between mould parts, e.g. robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
    • Y02W30/00—Technologies for solid waste management
    • Y02W30/50—Reuse, recycling or recovery technologies
    • Y02W30/62—Plastics recycling; Rubber recycling

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Robotics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
JP2021018748A 2021-02-09 2021-02-09 搬送機構、樹脂成形装置及び樹脂成形品の製造方法 Active JP7394798B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2021018748A JP7394798B2 (ja) 2021-02-09 2021-02-09 搬送機構、樹脂成形装置及び樹脂成形品の製造方法
CN202180076879.6A CN116457183A (zh) 2021-02-09 2021-12-20 搬送机构、树脂成形装置及树脂成形品的制造方法
TW110147603A TWI801041B (zh) 2021-02-09 2021-12-20 搬送機構、樹脂成形裝置及樹脂成形品的製造方法
KR1020237015878A KR20230085177A (ko) 2021-02-09 2021-12-20 반송 기구, 수지 성형 장치 및 수지 성형품의 제조 방법
PCT/JP2021/046928 WO2022172592A1 (ja) 2021-02-09 2021-12-20 搬送機構、樹脂成形装置及び樹脂成形品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021018748A JP7394798B2 (ja) 2021-02-09 2021-02-09 搬送機構、樹脂成形装置及び樹脂成形品の製造方法

Publications (2)

Publication Number Publication Date
JP2022121827A JP2022121827A (ja) 2022-08-22
JP7394798B2 true JP7394798B2 (ja) 2023-12-08

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JP2021018748A Active JP7394798B2 (ja) 2021-02-09 2021-02-09 搬送機構、樹脂成形装置及び樹脂成形品の製造方法

Country Status (5)

Country Link
JP (1) JP7394798B2 (zh)
KR (1) KR20230085177A (zh)
CN (1) CN116457183A (zh)
TW (1) TWI801041B (zh)
WO (1) WO2022172592A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020062857A (ja) 2018-10-19 2020-04-23 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07205218A (ja) * 1994-01-17 1995-08-08 Hitachi Ltd 成形品分離装置
JPH0936156A (ja) * 1995-07-25 1997-02-07 Mitsubishi Electric Corp ゲートブレイク装置およびゲートブレイク方法
JP7068094B2 (ja) 2018-08-10 2022-05-16 アピックヤマダ株式会社 ワーク搬送装置、樹脂搬送装置及び樹脂モールド方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020062857A (ja) 2018-10-19 2020-04-23 Ｔｏｗａ株式会社 搬送装置、樹脂成形装置、搬送方法、及び樹脂成形品の製造方法

Also Published As

Publication number Publication date
TWI801041B (zh) 2023-05-01
CN116457183A (zh) 2023-07-18
KR20230085177A (ko) 2023-06-13
WO2022172592A1 (ja) 2022-08-18
TW202233382A (zh) 2022-09-01
JP2022121827A (ja) 2022-08-22

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