KR20230053616A - 반도체 장치의 제작 방법 - Google Patents
반도체 장치의 제작 방법 Download PDFInfo
- Publication number
- KR20230053616A KR20230053616A KR1020237006652A KR20237006652A KR20230053616A KR 20230053616 A KR20230053616 A KR 20230053616A KR 1020237006652 A KR1020237006652 A KR 1020237006652A KR 20237006652 A KR20237006652 A KR 20237006652A KR 20230053616 A KR20230053616 A KR 20230053616A
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- Prior art keywords
- insulator
- oxide
- film
- conductor
- oxygen
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- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6938—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides
- H10P14/6939—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal
- H10P14/69392—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses the material containing at least one metal element, e.g. metal oxides, metal oxynitrides or metal oxycarbides characterised by the metal the material containing hafnium, e.g. HfO2
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0272—Deposition of sub-layers, e.g. to promote the adhesion of the main coating
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
- C23C16/405—Oxides of refractory metals or yttrium
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45523—Pulsed gas flow or change of composition over time
- C23C16/45525—Atomic layer deposition [ALD]
- C23C16/45527—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations
- C23C16/45529—Atomic layer deposition [ALD] characterized by the ALD cycle, e.g. different flows or temperatures during half-reactions, unusual pulsing sequence, use of precursor mixtures or auxiliary reactants or activations specially adapted for making a layer stack of alternating different compositions or gradient compositions
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/56—After-treatment
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- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
- H10D30/6733—Multi-gate TFTs
- H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
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- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
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- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
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- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
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- H10P14/6328—Deposition from the gas or vapour phase
- H10P14/6334—Deposition from the gas or vapour phase using decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
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- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
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- H10D30/6757—Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2020-139814 | 2020-08-21 | ||
| JP2020139814 | 2020-08-21 | ||
| JP2020195884 | 2020-11-26 | ||
| JPJP-P-2020-195884 | 2020-11-26 | ||
| PCT/IB2021/057249 WO2022038456A1 (ja) | 2020-08-21 | 2021-08-06 | 半導体装置の作製方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230053616A true KR20230053616A (ko) | 2023-04-21 |
Family
ID=80323452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237006652A Pending KR20230053616A (ko) | 2020-08-21 | 2021-08-06 | 반도체 장치의 제작 방법 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US12575348B2 (https=) |
| JP (2) | JP7805298B2 (https=) |
| KR (1) | KR20230053616A (https=) |
| CN (1) | CN115917038A (https=) |
| WO (1) | WO2022038456A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024225740A1 (ko) * | 2023-04-24 | 2024-10-31 | 솔브레인 주식회사 | 저온 증착막 형성 방법, 이로부터 제조된 반도체 기판 및 반도체 소자 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12295163B2 (en) | 2021-12-16 | 2025-05-06 | Asm Ip Holding B.V. | Formation of gate stacks comprising a threshold voltage tuning layer |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011151383A (ja) | 2009-12-25 | 2011-08-04 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2012257187A (ja) | 2010-08-06 | 2012-12-27 | Semiconductor Energy Lab Co Ltd | 半導体集積回路 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6780704B1 (en) * | 1999-12-03 | 2004-08-24 | Asm International Nv | Conformal thin films over textured capacitor electrodes |
| JP3863391B2 (ja) | 2001-06-13 | 2006-12-27 | Necエレクトロニクス株式会社 | 半導体装置 |
| JP2009170439A (ja) | 2008-01-10 | 2009-07-30 | Panasonic Corp | ゲート絶縁膜の形成方法 |
| WO2011078398A1 (en) | 2009-12-25 | 2011-06-30 | Ricoh Company, Ltd. | Field-effect transistor, semiconductor memory, display element, image display device, and system |
| KR20120064966A (ko) | 2010-12-10 | 2012-06-20 | 에스케이하이닉스 주식회사 | 반도체 장치 제조 방법 |
| WO2013150920A1 (ja) | 2012-04-05 | 2013-10-10 | 東京エレクトロン株式会社 | 半導体デバイスの製造方法及び基板処理システム |
| US10242989B2 (en) | 2014-05-20 | 2019-03-26 | Micron Technology, Inc. | Polar, chiral, and non-centro-symmetric ferroelectric materials, memory cells including such materials, and related devices and methods |
| US9685542B2 (en) | 2014-12-30 | 2017-06-20 | Qualcomm Incorporated | Atomic layer deposition of P-type oxide semiconductor thin films |
| JP2016157881A (ja) | 2015-02-26 | 2016-09-01 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| JP6736321B2 (ja) | 2015-03-27 | 2020-08-05 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| JP6725357B2 (ja) | 2015-08-03 | 2020-07-15 | 株式会社半導体エネルギー研究所 | 半導体装置、半導体装置の作製方法 |
| KR102523344B1 (ko) | 2015-11-25 | 2023-04-20 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
| JP2018078227A (ja) | 2016-11-11 | 2018-05-17 | 株式会社半導体エネルギー研究所 | 半導体装置、および半導体装置の作製方法 |
| CN109087674A (zh) | 2017-06-14 | 2018-12-25 | 萨摩亚商费洛储存科技股份有限公司 | 铁电内存及其数据读取、写入与制造方法和电容结构 |
| JP7066585B2 (ja) | 2018-09-19 | 2022-05-13 | キオクシア株式会社 | 記憶装置 |
| US10978563B2 (en) | 2018-12-21 | 2021-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| US11211461B2 (en) | 2018-12-28 | 2021-12-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and memory device |
| US11289475B2 (en) | 2019-01-25 | 2022-03-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method of semiconductor device |
| JP7512255B2 (ja) | 2019-03-29 | 2024-07-08 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| US12082390B2 (en) | 2019-03-29 | 2024-09-03 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| WO2020240332A1 (ja) | 2019-05-31 | 2020-12-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| CN116157903A (zh) | 2020-08-27 | 2023-05-23 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
| TW202210653A (zh) | 2020-09-07 | 2022-03-16 | 日商半導體能源研究所股份有限公司 | 金屬氧化物膜、半導體裝置以及其製造方法 |
-
2021
- 2021-08-06 CN CN202180051208.4A patent/CN115917038A/zh active Pending
- 2021-08-06 WO PCT/IB2021/057249 patent/WO2022038456A1/ja not_active Ceased
- 2021-08-06 KR KR1020237006652A patent/KR20230053616A/ko active Pending
- 2021-08-06 JP JP2022543813A patent/JP7805298B2/ja active Active
- 2021-08-06 US US18/041,726 patent/US12575348B2/en active Active
-
2026
- 2026-01-13 JP JP2026003842A patent/JP2026050481A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011151383A (ja) | 2009-12-25 | 2011-08-04 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
| JP2012257187A (ja) | 2010-08-06 | 2012-12-27 | Semiconductor Energy Lab Co Ltd | 半導体集積回路 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2024225740A1 (ko) * | 2023-04-24 | 2024-10-31 | 솔브레인 주식회사 | 저온 증착막 형성 방법, 이로부터 제조된 반도체 기판 및 반도체 소자 |
Also Published As
| Publication number | Publication date |
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| CN115917038A (zh) | 2023-04-04 |
| JP7805298B2 (ja) | 2026-01-23 |
| JP2026050481A (ja) | 2026-03-19 |
| US20230402279A1 (en) | 2023-12-14 |
| US12575348B2 (en) | 2026-03-10 |
| WO2022038456A1 (ja) | 2022-02-24 |
| JPWO2022038456A1 (https=) | 2022-02-24 |
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