KR20220105133A - 프린트 배선판의 제조 방법 - Google Patents

프린트 배선판의 제조 방법 Download PDF

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Publication number
KR20220105133A
KR20220105133A KR1020220005634A KR20220005634A KR20220105133A KR 20220105133 A KR20220105133 A KR 20220105133A KR 1020220005634 A KR1020220005634 A KR 1020220005634A KR 20220005634 A KR20220005634 A KR 20220005634A KR 20220105133 A KR20220105133 A KR 20220105133A
Authority
KR
South Korea
Prior art keywords
protective film
resin
adhesive sheet
resin composition
composition layer
Prior art date
Application number
KR1020220005634A
Other languages
English (en)
Korean (ko)
Inventor
마리코 미요시
이치로 오구라
아케미 야마다
Original Assignee
아지노모토 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아지노모토 가부시키가이샤 filed Critical 아지노모토 가부시키가이샤
Publication of KR20220105133A publication Critical patent/KR20220105133A/ko

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207Heat-activated adhesive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G41/00Supporting frames or bases for conveyors as a whole, e.g. transportable conveyor frames
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00Handling processes for sheets or webs
    • B65H2301/50Auxiliary process performed during handling process
    • B65H2301/51Modifying a characteristic of handled material
    • B65H2301/511Processing surface of handled material upon transport or guiding thereof, e.g. cleaning
    • B65H2301/5112Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface
    • B65H2301/51122Processing surface of handled material upon transport or guiding thereof, e.g. cleaning removing material from outer surface peeling layer of material

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Adhesive Tapes (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020220005634A 2021-01-19 2022-01-14 프린트 배선판의 제조 방법 KR20220105133A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2021-006652 2021-01-19
JP2021006652 2021-01-19

Publications (1)

Publication Number Publication Date
KR20220105133A true KR20220105133A (ko) 2022-07-26

Family

ID=82528174

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020220005634A KR20220105133A (ko) 2021-01-19 2022-01-14 프린트 배선판의 제조 방법

Country Status (4)

Country Link
JP (1) JP2022111097A (ja)
KR (1) KR20220105133A (ja)
CN (1) CN114828411A (ja)
TW (1) TW202239932A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022134809A1 (de) 2021-12-29 2023-06-29 Hyundai Motor Company Getriebehalterung für ein fahrzeug

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140024961A (ko) 2011-06-23 2014-03-03 퀄컴 인코포레이티드 모바일 디바이스를 이용하는 강화된 상점 내 쇼핑 서비스들을 위한 장치 및 방법
JP2016025318A (ja) 2014-07-24 2016-02-08 味の素株式会社 プリント配線板の製造方法及び接着シート仮付け装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140024961A (ko) 2011-06-23 2014-03-03 퀄컴 인코포레이티드 모바일 디바이스를 이용하는 강화된 상점 내 쇼핑 서비스들을 위한 장치 및 방법
JP2016025318A (ja) 2014-07-24 2016-02-08 味の素株式会社 プリント配線板の製造方法及び接着シート仮付け装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022134809A1 (de) 2021-12-29 2023-06-29 Hyundai Motor Company Getriebehalterung für ein fahrzeug

Also Published As

Publication number Publication date
CN114828411A (zh) 2022-07-29
TW202239932A (zh) 2022-10-16
JP2022111097A (ja) 2022-07-29

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