KR20220040366A - 묘화 장치 - Google Patents
묘화 장치 Download PDFInfo
- Publication number
- KR20220040366A KR20220040366A KR1020210090862A KR20210090862A KR20220040366A KR 20220040366 A KR20220040366 A KR 20220040366A KR 1020210090862 A KR1020210090862 A KR 1020210090862A KR 20210090862 A KR20210090862 A KR 20210090862A KR 20220040366 A KR20220040366 A KR 20220040366A
- Authority
- KR
- South Korea
- Prior art keywords
- substrate
- stage
- movement
- weight
- moving
- Prior art date
Links
- 239000000758 substrate Substances 0.000 claims abstract description 302
- 230000007246 mechanism Effects 0.000 claims abstract description 299
- 238000000034 method Methods 0.000 claims description 36
- 230000005484 gravity Effects 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 description 71
- 230000008569 process Effects 0.000 description 28
- 238000010586 diagram Methods 0.000 description 27
- 238000001514 detection method Methods 0.000 description 13
- 230000009466 transformation Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Control And Other Processes For Unpacking Of Materials (AREA)
- Confectionery (AREA)
- Formation And Processing Of Food Products (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2020-158317 | 2020-09-23 | ||
JP2020158317A JP7433181B2 (ja) | 2020-09-23 | 2020-09-23 | 描画装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20220040366A true KR20220040366A (ko) | 2022-03-30 |
KR102689163B1 KR102689163B1 (ko) | 2024-07-26 |
Family
ID=80791367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020210090862A KR102689163B1 (ko) | 2020-09-23 | 2021-07-12 | 묘화 장치 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7433181B2 (ja) |
KR (1) | KR102689163B1 (ja) |
CN (1) | CN114253085B (ja) |
TW (1) | TWI811714B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023249799A1 (en) * | 2022-06-20 | 2023-12-28 | Mrsi Systems Llc | Tunable, dynamic counterbalance |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101256791B1 (ko) * | 2012-08-27 | 2013-04-19 | 주식회사 필옵틱스 | 노광 장치 |
JP2013190505A (ja) * | 2012-03-13 | 2013-09-26 | Dainippon Screen Mfg Co Ltd | 描画装置および描画方法 |
JP2014532298A (ja) * | 2011-09-06 | 2014-12-04 | ケーエルエー−テンカー コーポレイション | 反射電子ビームリソグラフィ用リニアステージ |
KR20190053110A (ko) * | 2017-11-09 | 2019-05-17 | 가부시키가이샤 히타치 하이테크 파인 시스템즈 | 노광 시스템, 노광 방법 및 표시용 패널 기판의 제조방법 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998028665A1 (en) * | 1996-12-24 | 1998-07-02 | Koninklijke Philips Electronics N.V. | Two-dimensionally balanced positioning device with two object holders, and lithographic device provided with such a positioning device |
JP2001308141A (ja) * | 2000-02-18 | 2001-11-02 | Sony Corp | 電子回路装置の製造方法 |
WO2003015139A1 (fr) | 2001-08-08 | 2003-02-20 | Nikon Corporation | Systeme a etage, dispositif d'exposition, et procede de fabrication du dispositif |
JP3920605B2 (ja) * | 2001-09-06 | 2007-05-30 | 株式会社日立ハイテクノロジーズ | 露光装置 |
JP3906753B2 (ja) * | 2002-07-01 | 2007-04-18 | 株式会社日立プラントテクノロジー | 基板組立て装置 |
KR101206671B1 (ko) | 2004-04-09 | 2012-11-29 | 가부시키가이샤 니콘 | 이동체의 구동 방법, 스테이지 장치 및 노광 장치 |
JP2006100689A (ja) | 2004-09-30 | 2006-04-13 | Canon Inc | ステージ装置、露光装置及びデバイス製造方法 |
US7750818B2 (en) * | 2006-11-29 | 2010-07-06 | Adp Engineering Co., Ltd. | System and method for introducing a substrate into a process chamber |
US8144310B2 (en) | 2008-04-14 | 2012-03-27 | Asml Netherlands B.V. | Positioning system, lithographic apparatus and device manufacturing method |
JP5024301B2 (ja) * | 2009-01-20 | 2012-09-12 | パナソニック株式会社 | 圧着装置及び圧着方法 |
JP5415842B2 (ja) * | 2009-06-26 | 2014-02-12 | 大日本スクリーン製造株式会社 | 描画システムおよびパターン形成システム |
CN102741993B (zh) * | 2009-12-16 | 2016-06-22 | 株式会社尼康 | 基板支承构件、基板搬送装置、基板搬送方法、曝光装置及元件制造方法 |
US20120064461A1 (en) * | 2010-09-13 | 2012-03-15 | Nikon Corporation | Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method |
JP2013089278A (ja) * | 2011-10-24 | 2013-05-13 | Sanyo Electric Co Ltd | 光ピックアップ装置 |
CN102393611B (zh) * | 2011-11-12 | 2013-10-16 | 哈尔滨工业大学 | 光刻机工件台磁预紧平衡定位系统 |
JP5701465B2 (ja) * | 2012-12-21 | 2015-04-15 | 株式会社新川 | フリップチップボンダ及びボンディングステージの平坦度並びに変形量補正方法 |
JP2014146011A (ja) * | 2013-01-30 | 2014-08-14 | Hitachi High-Technologies Corp | パターン形成装置及びパターン形成方法 |
US10031427B2 (en) | 2015-09-30 | 2018-07-24 | Applied Materials, Inc. | Methods and apparatus for vibration damping stage |
CN105676597B (zh) * | 2016-04-14 | 2017-11-14 | 清华大学 | 一种掩模台平衡块合质心防飘移运动控制方法 |
CN106092444A (zh) * | 2016-08-02 | 2016-11-09 | 北方民族大学 | 一种双电机驱动的重力平衡装置及调节方法 |
JP6917848B2 (ja) * | 2017-09-26 | 2021-08-11 | 株式会社Screenホールディングス | ステージ駆動装置および描画装置 |
CN110658688B (zh) * | 2018-06-29 | 2020-12-15 | 上海微电子装备(集团)股份有限公司 | 一种工件台系统及光刻设备 |
-
2020
- 2020-09-23 JP JP2020158317A patent/JP7433181B2/ja active Active
-
2021
- 2021-06-25 TW TW110123244A patent/TWI811714B/zh active
- 2021-07-12 KR KR1020210090862A patent/KR102689163B1/ko active IP Right Grant
- 2021-08-26 CN CN202110987294.1A patent/CN114253085B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014532298A (ja) * | 2011-09-06 | 2014-12-04 | ケーエルエー−テンカー コーポレイション | 反射電子ビームリソグラフィ用リニアステージ |
JP2013190505A (ja) * | 2012-03-13 | 2013-09-26 | Dainippon Screen Mfg Co Ltd | 描画装置および描画方法 |
KR101256791B1 (ko) * | 2012-08-27 | 2013-04-19 | 주식회사 필옵틱스 | 노광 장치 |
KR20190053110A (ko) * | 2017-11-09 | 2019-05-17 | 가부시키가이샤 히타치 하이테크 파인 시스템즈 | 노광 시스템, 노광 방법 및 표시용 패널 기판의 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR102689163B1 (ko) | 2024-07-26 |
JP2022052125A (ja) | 2022-04-04 |
CN114253085A (zh) | 2022-03-29 |
CN114253085B (zh) | 2024-05-24 |
TWI811714B (zh) | 2023-08-11 |
TW202213452A (zh) | 2022-04-01 |
JP7433181B2 (ja) | 2024-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5530516A (en) | Large-area projection exposure system | |
KR20220040366A (ko) | 묘화 장치 | |
KR102197572B1 (ko) | 조명 소스로서의 마이크로 led 어레이 | |
JP6306312B2 (ja) | 描画装置及び描画方法 | |
KR20190141579A (ko) | 교시 데이터 작성 시스템 및 교시 데이터 작성 방법 | |
JP7458950B2 (ja) | 描画システム | |
JP2022052111A (ja) | 基板位置検出方法、描画方法、基板位置検出装置および描画装置 | |
JP2009109560A (ja) | パターン描画装置およびパターン描画方法 | |
KR102696052B1 (ko) | 묘화 장치, 묘화 방법, 및 기억 매체에 기록된 프로그램 | |
KR102696053B1 (ko) | 묘화 시스템, 묘화 방법, 및 기억 매체에 기록된 프로그램 | |
JPH02199813A (ja) | 露光装置 | |
TWI845977B (zh) | 描繪裝置以及描繪方法 | |
JP2002341550A (ja) | レーザー露光装置 | |
US20230043353A1 (en) | Multiple camera apparatus for photolithographic processing | |
WO2024180866A1 (ja) | 描画装置および描画方法 | |
JP6308715B2 (ja) | 露光描画装置、移動制御方法およびプログラム | |
JP2024046030A (ja) | テンプレート生成装置、描画システム、テンプレート生成方法およびプログラム | |
TW202417994A (zh) | 基板台、基板搬出方法、曝光裝置及物品之製造方法 | |
JP2000329544A (ja) | 処理装置の基板位置決め装置及びその方法 | |
JP2004354981A (ja) | 画像パターン記録方法 | |
JP2003076029A (ja) | 露光装置 | |
JP2024005837A (ja) | 基板ステージ、基板搬出方法、露光装置及び物品の製造方法 | |
JP2024032060A (ja) | 露光装置および露光方法 | |
JP2024051500A (ja) | 基板ステージ、基板搬送方法、露光装置、及び物品の製造方法 | |
JP2005093490A (ja) | 部品実装方法と装置及びその位置認識方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |