KR20220032648A - 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법 - Google Patents

증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법 Download PDF

Info

Publication number
KR20220032648A
KR20220032648A KR1020227007188A KR20227007188A KR20220032648A KR 20220032648 A KR20220032648 A KR 20220032648A KR 1020227007188 A KR1020227007188 A KR 1020227007188A KR 20227007188 A KR20227007188 A KR 20227007188A KR 20220032648 A KR20220032648 A KR 20220032648A
Authority
KR
South Korea
Prior art keywords
frame
deposition mask
resin
mask
deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020227007188A
Other languages
English (en)
Korean (ko)
Inventor
가쓰나리 오바타
야스코 소네
구미코 호카리
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20220032648A publication Critical patent/KR20220032648A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • H01L51/0011—
    • H01L51/56—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
KR1020227007188A 2016-09-30 2017-09-27 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법 Ceased KR20220032648A (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JPJP-P-2016-194252 2016-09-30
JP2016194252 2016-09-30
JPJP-P-2017-119666 2017-06-19
JP2017119666 2017-06-19
PCT/JP2017/035012 WO2018062300A1 (ja) 2016-09-30 2017-09-27 蒸着マスク、フレーム付き蒸着マスク、蒸着マスク準備体、蒸着パターン形成方法、有機半導体素子の製造方法、有機ｅｌディスプレイの製造方法
KR1020197002568A KR102372834B1 (ko) 2016-09-30 2017-09-27 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020197002568A Division KR102372834B1 (ko) 2016-09-30 2017-09-27 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법

Publications (1)

Publication Number Publication Date
KR20220032648A true KR20220032648A (ko) 2022-03-15

Family

ID=61763462

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020197002568A Active KR102372834B1 (ko) 2016-09-30 2017-09-27 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법
KR1020227007188A Ceased KR20220032648A (ko) 2016-09-30 2017-09-27 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR1020197002568A Active KR102372834B1 (ko) 2016-09-30 2017-09-27 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법

Country Status (6)

Country Link
US (2) US10982316B2 (enExample)
JP (4) JP6451902B2 (enExample)
KR (2) KR102372834B1 (enExample)
CN (4) CN113463017A (enExample)
TW (1) TWI772328B (enExample)
WO (1) WO2018062300A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6575730B2 (ja) * 2017-09-15 2019-09-18 凸版印刷株式会社 蒸着マスクの製造方法、および、表示装置の製造方法
CN110838565B (zh) * 2019-11-26 2022-07-29 京东方科技集团股份有限公司 金属掩模版、显示面板和显示装置
JP7359223B2 (ja) * 2019-12-25 2023-10-11 株式会社村田製作所 セラミック電子部品の製造方法およびその製法に用いるマスクプレート
WO2021157755A1 (ko) * 2020-02-05 2021-08-12 주식회사 볼트크리에이션 증착 마스크 모듈 및 그 제조 방법
JP7454988B2 (ja) * 2020-04-01 2024-03-25 株式会社ジャパンディスプレイ 蒸着マスクの製造装置および製造方法
CN113555452B (zh) * 2020-04-26 2024-03-15 隆基绿能科技股份有限公司 一种太阳能电池金属电极及其制备方法
KR20220021994A (ko) * 2020-08-14 2022-02-23 삼성디스플레이 주식회사 마스크, 마스크의 제조방법, 및 표시 패널의 제조방법
KR20220030437A (ko) * 2020-08-31 2022-03-11 삼성디스플레이 주식회사 마스크, 이의 제조 방법, 및 표시 패널 제조 방법
KR20230020035A (ko) * 2021-08-02 2023-02-10 삼성디스플레이 주식회사 증착용 마스크
KR20230024480A (ko) * 2021-08-11 2023-02-21 삼성디스플레이 주식회사 표시 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5288072B2 (ja) 2012-01-12 2013-09-11 大日本印刷株式会社 蒸着マスク、蒸着マスク装置の製造方法、及び有機半導体素子の製造方法
JP5288074B2 (ja) 2012-01-12 2013-09-11 大日本印刷株式会社 多面付け蒸着マスクの製造方法及びこれにより得られる多面付け蒸着マスク並びに有機半導体素子の製造方法
JP5288073B2 (ja) 2012-01-12 2013-09-11 大日本印刷株式会社 蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP2014218735A (ja) 2013-04-12 2014-11-20 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP6163376B2 (ja) 2013-07-30 2017-07-12 株式会社ブイ・テクノロジー 成膜マスクの製造方法及び成膜マスク

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5288072A (en) 1976-01-17 1977-07-22 Citizen Watch Co Ltd Electronic watch with leghting
JPS5288073A (en) 1976-01-17 1977-07-22 Citizen Watch Co Ltd Electronic watch with illumination
JPS5288074A (en) 1976-01-19 1977-07-22 Seiko Instr & Electronics Ltd Electronic alarm watch
JPS6163376A (ja) 1984-09-04 1986-04-01 Nippon Kokan Kk <Nkk> 自動溶接フラツクス回収装置
TW200526794A (en) * 2004-02-09 2005-08-16 Geniray Opto Electronic Technology Co Ltd Manufacturing method of photomask and vapor deposition mask
JP5228586B2 (ja) * 2008-04-09 2013-07-03 株式会社Ｓｕｍｃｏ 蒸着用マスク、ならびにそれを用いる蒸着パターン作製方法、半導体ウェーハ評価用試料の作製方法、半導体ウェーハの評価方法および半導体ウェーハの製造方法
JP5862238B2 (ja) * 2011-05-27 2016-02-16 東洋紡株式会社 積層体とその製造方法及びそれを用いたデバイス構造体の製造方法
JP2013173968A (ja) * 2012-02-24 2013-09-05 V Technology Co Ltd 蒸着マスク及び蒸着マスクの製造方法
CN103797149B (zh) 2011-09-16 2017-05-24 株式会社V技术 蒸镀掩膜、蒸镀掩膜的制造方法及薄膜图案形成方法
JP5935179B2 (ja) * 2011-12-13 2016-06-15 株式会社ブイ・テクノロジー 蒸着マスク及び蒸着マスクの製造方法
JP2013245392A (ja) * 2012-05-29 2013-12-09 V Technology Co Ltd 蒸着マスク及び蒸着マスクの製造方法
CN102766844B (zh) * 2012-08-10 2014-10-22 深圳市华星光电技术有限公司 有机电致发光二极管有机材料蒸镀用掩模装置
CN103668051A (zh) * 2012-09-07 2014-03-26 昆山允升吉光电科技有限公司 一种掩模框架及其对应的蒸镀用掩模组件
JP6123301B2 (ja) 2013-01-11 2017-05-10 大日本印刷株式会社 蒸着マスクの製造方法、金属マスク付き樹脂層、及び有機半導体素子の製造方法
CN103938153A (zh) * 2013-01-22 2014-07-23 昆山允升吉光电科技有限公司 一种蒸镀用掩模组件及相应的掩模板安装方法
JP6142196B2 (ja) * 2013-03-15 2017-06-07 株式会社ブイ・テクノロジー 蒸着マスクの製造方法
JP6078818B2 (ja) * 2013-07-02 2017-02-15 株式会社ブイ・テクノロジー 成膜マスク及び成膜マスクの製造方法
JP6168944B2 (ja) * 2013-09-20 2017-07-26 株式会社ブイ・テクノロジー 成膜マスク
JP6394877B2 (ja) * 2013-09-30 2018-09-26 大日本印刷株式会社 蒸着マスク、蒸着マスクの製造方法、蒸着マスク準備体、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
JP2015074826A (ja) * 2013-10-11 2015-04-20 株式会社ブイ・テクノロジー 成膜マスク及びその製造方法
JP6288497B2 (ja) * 2013-12-13 2018-03-07 株式会社ブイ・テクノロジー マスク及びその製造方法
JP6357777B2 (ja) 2014-01-08 2018-07-18 大日本印刷株式会社 積層マスクの製造方法
JP6240960B2 (ja) * 2014-02-03 2017-12-06 株式会社ブイ・テクノロジー 成膜マスクの製造方法及び成膜マスク
JP6326885B2 (ja) * 2014-03-19 2018-05-23 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、及び有機半導体素子の製造方法
JP6269264B2 (ja) * 2014-03-31 2018-01-31 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、多面付け蒸着マスク、有機半導体素子の製造方法
JP6394879B2 (ja) * 2014-09-30 2018-09-26 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、フレーム付き蒸着マスク、及び有機半導体素子の製造方法
US10090467B2 (en) 2014-10-15 2018-10-02 Sharp Kabushiki Kaisha Deposition mask, deposition device, deposition method, and deposition mask manufacturing method
WO2016088632A1 (ja) * 2014-12-03 2016-06-09 シャープ株式会社 蒸着マスク、蒸着装置、蒸着マスクの製造方法、および蒸着方法
TWI756930B (zh) * 2015-02-03 2022-03-01 日商大日本印刷股份有限公司 雷射用遮罩、蒸鍍遮罩之製造方法、蒸鍍遮罩製造裝置及有機半導體元件之製造方法
JP2017150017A (ja) 2016-02-23 2017-08-31 株式会社ジャパンディスプレイ 蒸着マスクの製造方法及び有機ｅｌディスプレイの製造方法
JP6191712B2 (ja) * 2016-03-02 2017-09-06 大日本印刷株式会社 蒸着マスクの製造方法、及び蒸着マスク装置の製造方法
JP6304425B2 (ja) * 2017-04-06 2018-04-04 大日本印刷株式会社 蒸着マスクの製造方法、金属マスク付き樹脂層、及び有機半導体素子の製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5288072B2 (ja) 2012-01-12 2013-09-11 大日本印刷株式会社 蒸着マスク、蒸着マスク装置の製造方法、及び有機半導体素子の製造方法
JP5288074B2 (ja) 2012-01-12 2013-09-11 大日本印刷株式会社 多面付け蒸着マスクの製造方法及びこれにより得られる多面付け蒸着マスク並びに有機半導体素子の製造方法
JP5288073B2 (ja) 2012-01-12 2013-09-11 大日本印刷株式会社 蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP2014218735A (ja) 2013-04-12 2014-11-20 大日本印刷株式会社 蒸着マスク、蒸着マスク準備体、蒸着マスクの製造方法、及び有機半導体素子の製造方法
JP6163376B2 (ja) 2013-07-30 2017-07-12 株式会社ブイ・テクノロジー 成膜マスクの製造方法及び成膜マスク

Also Published As

Publication number Publication date
US20190211437A1 (en) 2019-07-11
KR20190058450A (ko) 2019-05-29
JP7247085B2 (ja) 2023-03-28
CN109689922A (zh) 2019-04-26
WO2018062300A1 (ja) 2018-04-05
TWI772328B (zh) 2022-08-01
US10982316B2 (en) 2021-04-20
CN113463029A (zh) 2021-10-01
JP2020073726A (ja) 2020-05-14
CN113463018A (zh) 2021-10-01
JP6642691B2 (ja) 2020-02-12
JP2022116127A (ja) 2022-08-09
CN113463017A (zh) 2021-10-01
JPWO2018062300A1 (ja) 2018-09-27
CN109689922B (zh) 2021-06-15
KR102372834B1 (ko) 2022-03-08
JP6451902B2 (ja) 2019-01-16
JP2019073800A (ja) 2019-05-16
TW201833349A (zh) 2018-09-16
US20210222283A1 (en) 2021-07-22

Similar Documents

Publication Publication Date Title
KR102372834B1 (ko) 증착 마스크, 프레임 부착 증착 마스크, 증착 마스크 준비체, 증착 패턴 형성 방법, 유기 반도체 소자의 제조 방법, 유기 el 디스플레이의 제조 방법
JP7024837B2 (ja) 蒸着マスクの製造方法、蒸着マスク準備体、フレーム付き蒸着マスク準備体、蒸着マスク、保護シート付き蒸着マスク、フレーム一体型の保護シート付き蒸着マスク、有機半導体素子の製造方法、及び有機ｅｌディスプレイの製造方法
CN112267091B (zh) 制造蒸镀掩模、有机半导体元件和有机el显示器的方法、蒸镀掩模准备体、及蒸镀掩模
JP7110776B2 (ja) 蒸着マスク、蒸着マスクの製造方法および有機ｅｌ表示装置の製造方法
JP6926435B2 (ja) 蒸着マスクの製造方法、及び有機半導体素子の製造方法、並びに有機ｅｌディスプレイの製造方法

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20220303

Application number text: 1020197002568

Filing date: 20190125

PA0201 Request for examination
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20220315

Patent event code: PE09021S01D

PG1501 Laying open of application
PE0601 Decision on rejection of patent

Patent event date: 20220921

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20220315

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I