KR20210148086A - 경화성 수지 조성물 - Google Patents

경화성 수지 조성물 Download PDF

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Publication number
KR20210148086A
KR20210148086A KR1020217026486A KR20217026486A KR20210148086A KR 20210148086 A KR20210148086 A KR 20210148086A KR 1020217026486 A KR1020217026486 A KR 1020217026486A KR 20217026486 A KR20217026486 A KR 20217026486A KR 20210148086 A KR20210148086 A KR 20210148086A
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KR
South Korea
Prior art keywords
group
resin composition
curable resin
compound
curing agent
Prior art date
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Ceased
Application number
KR1020217026486A
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English (en)
Korean (ko)
Inventor
쇼타 코바야시
켄이치 타마소
료 오가와
타모츠 나가마츠
Original Assignee
가부시키가이샤 아데카
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Publication of KR20210148086A publication Critical patent/KR20210148086A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/26—Di-epoxy compounds heterocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4028—Isocyanates; Thioisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4064—Curing agents not provided for by the groups C08G59/42 - C08G59/66 sulfur containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/08—Heat treatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/123—Treatment by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G2170/00—Compositions for adhesives

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Epoxy Resins (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Sealing Material Composition (AREA)
KR1020217026486A 2019-03-27 2020-03-27 경화성 수지 조성물 Ceased KR20210148086A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019060745 2019-03-27
JPJP-P-2019-060745 2019-03-27
PCT/JP2020/013956 WO2020196819A1 (ja) 2019-03-27 2020-03-27 硬化性樹脂組成物

Publications (1)

Publication Number Publication Date
KR20210148086A true KR20210148086A (ko) 2021-12-07

Family

ID=72611580

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217026486A Ceased KR20210148086A (ko) 2019-03-27 2020-03-27 경화성 수지 조성물

Country Status (8)

Country Link
US (1) US12269917B2 (https=)
EP (1) EP3950761B1 (https=)
JP (1) JPWO2020196819A1 (https=)
KR (1) KR20210148086A (https=)
CN (1) CN113544183B (https=)
PH (1) PH12021552113A1 (https=)
TW (1) TWI894142B (https=)
WO (1) WO2020196819A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220077099A1 (en) * 2020-09-09 2022-03-10 Electronics And Telecommunications Research Institute Composition for conductive adhesive, semiconductor package comprising cured product thereof, and method of manufacturing semiconductor package using the same
KR102594982B1 (ko) * 2021-10-01 2023-10-30 주식회사 이엔에프테크놀로지 경화형 수지 조성물 및 이의 경화물
US20250376556A1 (en) * 2022-06-28 2025-12-11 Huntsman Advanced Materials Americas Llc Curable Epoxy Resin Compositions with High Glass Transition Tempature
CN115948101B (zh) * 2023-01-06 2023-09-26 深圳市金川防水防腐装饰工程有限公司 一种耐水防腐的环氧树脂涂料及其制备方法
TWI856730B (zh) * 2023-07-07 2024-09-21 南亞塑膠工業股份有限公司 改質萘酚樹脂及其製備方法
EP4491652A1 (en) * 2023-07-14 2025-01-15 Henkel AG & Co. KGaA Method for curing a cationically polymerizable epoxy resin composition

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
US20090076180A1 (en) 2007-09-03 2009-03-19 Kazuki Iwaya Epoxy resin composition using latent curing agent and curable by photo and heat in combination
WO2018181421A1 (ja) 2017-03-29 2018-10-04 味の素株式会社 硬化性組成物および構造物

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2901685A1 (de) * 1978-01-20 1979-07-26 Ciba Geigy Ag Epoxidhaltige massen und deren polymerisation
KR950005314B1 (ko) * 1989-09-11 1995-05-23 신에쓰 가가꾸 고오교 가부시끼가이샤 열경화성 수지 조성물
JP4257442B2 (ja) 2007-08-27 2009-04-22 株式会社ファンケル 皮膚洗浄料及びこれに用いるｎ−アシルグルタミン酸塩
TW201013311A (en) * 2008-06-10 2010-04-01 Nippon Kayaku Kk A photosensitive resin composition for cavity packaging, a cured product thereof, and a laminated body and a micro device using the resin composition
JP5411723B2 (ja) * 2010-01-25 2014-02-12 日東電工株式会社 光導波路形成用液状樹脂組成物およびそれを用いた光導波路、ならびにその光導波路の製法
US10421261B2 (en) * 2015-01-29 2019-09-24 Adeka Corporation Flame-retardant epoxy resin composition, prepreg and laminated plate using the same
TWI679242B (zh) * 2015-03-23 2019-12-11 日商Ａｄｅｋａ股份有限公司 環氧樹脂組成物
US10233387B2 (en) * 2015-04-16 2019-03-19 3M Innovative Properties Company Quantum dot article with thiol-alkene-epoxy matrix
JP6978829B2 (ja) * 2016-09-14 2021-12-08 株式会社Adeka 難燃性エポキシ樹脂組成物、並びにそれを用いてなるプリプレグ及び積層板
JP2018168329A (ja) * 2017-03-30 2018-11-01 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物、プリント配線板、および、カルボキシル基含有樹脂の製造方法
JP7066268B2 (ja) * 2017-08-23 2022-05-13 株式会社Adeka 難燃性エポキシ樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
US20090076180A1 (en) 2007-09-03 2009-03-19 Kazuki Iwaya Epoxy resin composition using latent curing agent and curable by photo and heat in combination
WO2018181421A1 (ja) 2017-03-29 2018-10-04 味の素株式会社 硬化性組成物および構造物

Also Published As

Publication number Publication date
EP3950761A1 (en) 2022-02-09
US20220185946A1 (en) 2022-06-16
TW202102565A (zh) 2021-01-16
US12269917B2 (en) 2025-04-08
EP3950761B1 (en) 2023-11-01
CN113544183B (zh) 2024-07-02
WO2020196819A1 (ja) 2020-10-01
CN113544183A (zh) 2021-10-22
TWI894142B (zh) 2025-08-21
EP3950761A4 (en) 2022-09-21
JPWO2020196819A1 (https=) 2020-10-01
PH12021552113A1 (en) 2022-06-06

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