KR20210091241A - 배선 기판 및 배선 기판의 제조 방법 - Google Patents

배선 기판 및 배선 기판의 제조 방법 Download PDF

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Publication number
KR20210091241A
KR20210091241A KR1020217017804A KR20217017804A KR20210091241A KR 20210091241 A KR20210091241 A KR 20210091241A KR 1020217017804 A KR1020217017804 A KR 1020217017804A KR 20217017804 A KR20217017804 A KR 20217017804A KR 20210091241 A KR20210091241 A KR 20210091241A
Authority
KR
South Korea
Prior art keywords
wiring board
wiring
amount
substrate
base material
Prior art date
Application number
KR1020217017804A
Other languages
English (en)
Korean (ko)
Inventor
나오코 오키모토
겐이치 오가와
미츠타카 나가에
마키코 사카타
도루 미요시
Original Assignee
다이니폰 인사츠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이니폰 인사츠 가부시키가이샤 filed Critical 다이니폰 인사츠 가부시키가이샤
Publication of KR20210091241A publication Critical patent/KR20210091241A/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0145—Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09281—Layout details of a single conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1333—Deposition techniques, e.g. coating
    • H05K2203/1338—Chemical vapour deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
KR1020217017804A 2018-11-16 2019-10-31 배선 기판 및 배선 기판의 제조 방법 KR20210091241A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-215931 2018-11-16
JP2018215931 2018-11-16
PCT/JP2019/042925 WO2020100625A1 (ja) 2018-11-16 2019-10-31 配線基板及び配線基板の製造方法

Publications (1)

Publication Number Publication Date
KR20210091241A true KR20210091241A (ko) 2021-07-21

Family

ID=70731587

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020217017804A KR20210091241A (ko) 2018-11-16 2019-10-31 배선 기판 및 배선 기판의 제조 방법

Country Status (4)

Country Link
EP (1) EP3883352A4 (de)
KR (1) KR20210091241A (de)
CN (1) CN113016237A (de)
WO (1) WO2020100625A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202022103747U1 (de) 2021-07-12 2022-10-17 Hyundai Mobis Co., Ltd. Led Module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114521044A (zh) * 2020-11-20 2022-05-20 深南电路股份有限公司 电路板及其电器装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281406A (ja) 2006-04-07 2007-10-25 Board Of Trustees Of The Univ Of Illinois ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン
JP2013187308A (ja) 2012-03-07 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
JP2014236103A (ja) * 2013-06-03 2014-12-15 隆夫 染谷 伸縮性回路基板、その製造方法、及びそれによって製造された伸縮性回路基板
EP2928271A1 (de) * 2014-04-04 2015-10-07 Clothing Plus MBU Oy Dehnbare Vorrichtung zur Signalübertragung
JP6377147B2 (ja) * 2014-05-16 2018-08-22 国立研究開発法人産業技術総合研究所 ストレッチャブル導電回路及びその製造方法
CN107205677B (zh) * 2015-01-14 2020-12-25 东洋纺株式会社 伸缩性电极片、生物体信息计测用接触面
KR20170036221A (ko) * 2015-09-24 2017-04-03 성균관대학교산학협력단 전기 저항 변화가 최소화된 신장성 전기 전도체 및 이의 제조 방법
JP6813896B2 (ja) * 2015-10-16 2021-01-13 国立研究開発法人科学技術振興機構 配線フィルム、デバイス転写シート及びテキスタイル型デバイス
JP6759689B2 (ja) * 2016-05-10 2020-09-23 ヤマハ株式会社 歪みセンサユニット
JP6358405B2 (ja) * 2016-07-08 2018-07-18 住友ベークライト株式会社 封止用フィルム、電子部品搭載基板の封止方法および封止用フィルム被覆電子部品搭載基板
JP6721829B2 (ja) * 2016-07-26 2020-07-15 富士通株式会社 配線基板及び電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007281406A (ja) 2006-04-07 2007-10-25 Board Of Trustees Of The Univ Of Illinois ゴム基板上での高パフォーマンスエレクトロニクスのための伸縮性単結晶シリコン
JP2013187308A (ja) 2012-03-07 2013-09-19 Nippon Mektron Ltd 伸縮性フレキシブル回路基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202022103747U1 (de) 2021-07-12 2022-10-17 Hyundai Mobis Co., Ltd. Led Module

Also Published As

Publication number Publication date
EP3883352A4 (de) 2022-08-31
WO2020100625A1 (ja) 2020-05-22
CN113016237A (zh) 2021-06-22
EP3883352A1 (de) 2021-09-22

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