KR20210088551A - 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스 - Google Patents

폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스 Download PDF

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Publication number
KR20210088551A
KR20210088551A KR1020217012151A KR20217012151A KR20210088551A KR 20210088551 A KR20210088551 A KR 20210088551A KR 1020217012151 A KR1020217012151 A KR 1020217012151A KR 20217012151 A KR20217012151 A KR 20217012151A KR 20210088551 A KR20210088551 A KR 20210088551A
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KR
South Korea
Prior art keywords
polyimide
general formula
group
resin film
less
Prior art date
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Ceased
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KR1020217012151A
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English (en)
Korean (ko)
Inventor
아키노리 사에키
다쿠야 미야우치
다이치 미야자키
Original Assignee
도레이 카부시키가이샤
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Application filed by 도레이 카부시키가이샤 filed Critical 도레이 카부시키가이샤
Publication of KR20210088551A publication Critical patent/KR20210088551A/ko
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/106—Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/38—Polysiloxanes modified by chemical after-treatment
    • C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
    • C08G77/385—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing halogens
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/42—Block-or graft-polymers containing polysiloxane sequences
    • C08G77/452—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences
    • C08G77/455—Block-or graft-polymers containing polysiloxane sequences containing nitrogen-containing sequences containing polyamide, polyesteramide or polyimide sequences
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020217012151A 2018-11-09 2019-10-24 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스 Ceased KR20210088551A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018211149 2018-11-09
JPJP-P-2018-211149 2018-11-09
PCT/JP2019/041645 WO2020095693A1 (ja) 2018-11-09 2019-10-24 ポリイミド前駆体、ポリイミド、ポリイミド樹脂膜、およびフレキシブルデバイス

Publications (1)

Publication Number Publication Date
KR20210088551A true KR20210088551A (ko) 2021-07-14

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Family Applications (1)

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KR1020217012151A Ceased KR20210088551A (ko) 2018-11-09 2019-10-24 폴리이미드 전구체, 폴리이미드, 폴리이미드 수지막 및 플렉시블 디바이스

Country Status (5)

Country Link
JP (1) JP7384037B2 (https=)
KR (1) KR20210088551A (https=)
CN (1) CN113166409B (https=)
TW (1) TW202030226A (https=)
WO (1) WO2020095693A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111704719B (zh) * 2020-06-24 2021-07-20 中国科学院化学研究所 一种热固性聚酰亚胺树脂、预聚物、制备方法与应用
CN116134071B (zh) * 2020-07-21 2025-07-08 三菱瓦斯化学株式会社 聚酰亚胺树脂、聚酰亚胺清漆及聚酰亚胺薄膜
KR20250076526A (ko) 2022-09-27 2025-05-29 도레이 카부시키가이샤 수지 조성물, 경화물 및 유기 el 표시 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013024849A1 (ja) 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
WO2018084067A1 (ja) 2016-11-01 2018-05-11 東レ株式会社 タッチパネル、タッチパネルの製造方法

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JP2760520B2 (ja) * 1988-09-29 1998-06-04 新日鐵化学株式会社 ポリイミド共重合体及びその製造方法
JP2597215B2 (ja) * 1990-06-01 1997-04-02 宇部興産株式会社 ポリイミドシロキサン組成物および固化膜
KR20090087515A (ko) * 2005-02-01 2009-08-17 국립대학법인 나고야공업대학 실록산 변성 다분기 폴리이미드
JP5296493B2 (ja) * 2008-10-29 2013-09-25 三菱電線工業株式会社 絶縁部材
JP5256018B2 (ja) * 2008-12-26 2013-08-07 旭化成イーマテリアルズ株式会社 組成物、組成物からなる塗膜、塗膜を含む積層体、及び積層体を組み込んだ電子機器
JP2010254947A (ja) * 2009-03-31 2010-11-11 Jsr Corp ポリイミド系材料、フィルム及び組成物、並びにその製造方法
KR101946092B1 (ko) * 2011-09-29 2019-02-08 제이에스알 가부시끼가이샤 수지 조성물 및 그것을 이용한 막 형성 방법
JP5891693B2 (ja) * 2011-10-05 2016-03-23 Jsr株式会社 基板の製造方法および基板
JPWO2014148441A1 (ja) * 2013-03-18 2017-02-16 旭化成株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
JP5733355B2 (ja) * 2013-07-26 2015-06-10 東レ株式会社 ポリイミド系樹脂水溶液
SG11201601946XA (en) * 2013-09-27 2016-04-28 Toray Industries Polyimide precursor, polyimide resin film produced from said polyimide precursor, display element, optical element, light-receiving element, touch panel and circuit board each equipped with said polyimide resin film, organic el display, and methods respectively for producing organic el element and color filter
JP6462983B2 (ja) * 2014-01-28 2019-01-30 太陽インキ製造株式会社 感光性熱硬化性樹脂組成物およびフレキシブルプリント配線板
JP6420064B2 (ja) * 2014-06-03 2018-11-07 旭化成株式会社 ポリイミド前駆体組成物及びポリイミドフィルム
JP6599620B2 (ja) * 2015-03-05 2019-10-30 旭化成株式会社 ポリイミドを貼り合わせ接着層とする光学部材
CN105461923B (zh) * 2015-12-25 2018-01-05 南京理工大学 一种聚酰亚胺薄膜及其制备方法
JP6292351B1 (ja) * 2016-06-24 2018-03-14 東レ株式会社 ポリイミド樹脂、ポリイミド樹脂組成物、それを用いたタッチパネルおよびその製造方法、カラーフィルタおよびその製造方法、液晶素子およびその製造方法、有機ｅｌ素子およびその製造方法
JP6458099B2 (ja) * 2016-09-16 2019-01-23 旭化成株式会社 ポリイミド前駆体、樹脂組成物、樹脂フィルム及びその製造方法
JP6944784B2 (ja) * 2017-02-03 2021-10-06 東京応化工業株式会社 積層体、フレキシブルデバイスおよび積層体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013024849A1 (ja) 2011-08-18 2013-02-21 東レ株式会社 ポリアミド酸樹脂組成物、ポリイミド樹脂組成物およびポリイミドオキサゾール樹脂組成物ならびにそれらを含有するフレキシブル基板
WO2018084067A1 (ja) 2016-11-01 2018-05-11 東レ株式会社 タッチパネル、タッチパネルの製造方法

Also Published As

Publication number Publication date
CN113166409B (zh) 2023-07-28
WO2020095693A1 (ja) 2020-05-14
TW202030226A (zh) 2020-08-16
JPWO2020095693A1 (ja) 2021-09-30
JP7384037B2 (ja) 2023-11-21
CN113166409A (zh) 2021-07-23

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