KR20200108280A - 펠리클 프레임 파지 장치 및 펠리클 프레임 파지 방법 - Google Patents

펠리클 프레임 파지 장치 및 펠리클 프레임 파지 방법 Download PDF

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Publication number
KR20200108280A
KR20200108280A KR1020207019887A KR20207019887A KR20200108280A KR 20200108280 A KR20200108280 A KR 20200108280A KR 1020207019887 A KR1020207019887 A KR 1020207019887A KR 20207019887 A KR20207019887 A KR 20207019887A KR 20200108280 A KR20200108280 A KR 20200108280A
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KR
South Korea
Prior art keywords
pellicle
frame
mask
distance
measurement unit
Prior art date
Application number
KR1020207019887A
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English (en)
Korean (ko)
Inventor
마코토 요네자와
타카유키 사토
타카시 오이카와
Original Assignee
브이 테크놀로지 씨오. 엘티디
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 브이 테크놀로지 씨오. 엘티디 filed Critical 브이 테크놀로지 씨오. 엘티디
Publication of KR20200108280A publication Critical patent/KR20200108280A/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020207019887A 2018-01-25 2019-01-21 펠리클 프레임 파지 장치 및 펠리클 프레임 파지 방법 KR20200108280A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-010999 2018-01-25
JP2018010999A JP6921412B2 (ja) 2018-01-25 2018-01-25 ペリクルフレーム把持装置及びペリクルフレーム把持方法
PCT/JP2019/001668 WO2019146547A1 (ja) 2018-01-25 2019-01-21 ペリクルフレーム把持装置及びペリクルフレーム把持方法

Publications (1)

Publication Number Publication Date
KR20200108280A true KR20200108280A (ko) 2020-09-17

Family

ID=67394622

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207019887A KR20200108280A (ko) 2018-01-25 2019-01-21 펠리클 프레임 파지 장치 및 펠리클 프레임 파지 방법

Country Status (5)

Country Link
JP (1) JP6921412B2 (ja)
KR (1) KR20200108280A (ja)
CN (1) CN111630453B (ja)
TW (1) TWI798327B (ja)
WO (1) WO2019146547A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022101135A (ja) 2020-12-24 2022-07-06 株式会社ブイ・テクノロジー ペリクルフレーム把持装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016133054A1 (ja) 2015-02-19 2016-08-25 株式会社ブイ・テクノロジー ペリクルフレーム把持装置及びペリクルフレーム把持方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05281710A (ja) * 1992-04-03 1993-10-29 Tosoh Corp ペリクルの製造方法
JPH0683041A (ja) * 1992-09-03 1994-03-25 Fujitsu Ltd ペリクルの貼付状態の検査方法とその装置
JP2007510937A (ja) * 2003-10-06 2007-04-26 トッパン、フォウタマスクス、インク フォトマスク上にペリクル・アセンブリを自動的に装着するシステムおよび方法。
JP4478557B2 (ja) * 2004-12-08 2010-06-09 大日本印刷株式会社 大型ペリクル、ペリクル搬送方法、ペリクルケース及びペリクル移載装置
NL2015796A (en) * 2014-11-17 2016-09-06 Asml Netherlands Bv Apparatus.
JP6376601B2 (ja) * 2015-05-18 2018-08-22 信越化学工業株式会社 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016133054A1 (ja) 2015-02-19 2016-08-25 株式会社ブイ・テクノロジー ペリクルフレーム把持装置及びペリクルフレーム把持方法

Also Published As

Publication number Publication date
TWI798327B (zh) 2023-04-11
JP2019128501A (ja) 2019-08-01
CN111630453A (zh) 2020-09-04
WO2019146547A1 (ja) 2019-08-01
JP6921412B2 (ja) 2021-08-18
CN111630453B (zh) 2023-08-25
TW201933512A (zh) 2019-08-16

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