KR20200081239A - 자기 진단 기능을 구비하는 가공 장치 - Google Patents

자기 진단 기능을 구비하는 가공 장치 Download PDF

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Publication number
KR20200081239A
KR20200081239A KR1020190158480A KR20190158480A KR20200081239A KR 20200081239 A KR20200081239 A KR 20200081239A KR 1020190158480 A KR1020190158480 A KR 1020190158480A KR 20190158480 A KR20190158480 A KR 20190158480A KR 20200081239 A KR20200081239 A KR 20200081239A
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KR
South Korea
Prior art keywords
vibration
frequency
unit
component
self
Prior art date
Application number
KR1020190158480A
Other languages
English (en)
Korean (ko)
Inventor
마사히로 구보
사토시 다카하시
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20200081239A publication Critical patent/KR20200081239A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0952—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining
    • B23Q17/0957—Detection of tool breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0952—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining
    • B23Q17/0971—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool during machining by measuring mechanical vibrations of parts of the machine
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
    • B23Q17/09—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring cutting pressure or for determining cutting-tool condition, e.g. cutting ability, load on tool
    • B23Q17/0995—Tool life management
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M7/00—Vibration-testing of structures; Shock-testing of structures
    • G01M7/02—Vibration-testing by means of a shake table
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Prostheses (AREA)
  • Curing Cements, Concrete, And Artificial Stone (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
KR1020190158480A 2018-12-27 2019-12-02 자기 진단 기능을 구비하는 가공 장치 KR20200081239A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-244899 2018-12-27
JP2018244899A JP7246827B2 (ja) 2018-12-27 2018-12-27 自己診断機能を備える加工装置

Publications (1)

Publication Number Publication Date
KR20200081239A true KR20200081239A (ko) 2020-07-07

Family

ID=71221319

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190158480A KR20200081239A (ko) 2018-12-27 2019-12-02 자기 진단 기능을 구비하는 가공 장치

Country Status (4)

Country Link
JP (1) JP7246827B2 (ja)
KR (1) KR20200081239A (ja)
CN (1) CN111383959A (ja)
TW (1) TWI821491B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116472446A (zh) * 2020-11-27 2023-07-21 发那科株式会社 机床以及诊断方法
CN116568457A (zh) * 2020-12-18 2023-08-08 发那科株式会社 振动诊断辅助装置、振动诊断辅助方法以及机床

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62173147A (ja) 1986-01-24 1987-07-30 Disco Abrasive Sys Ltd 温度変化に起因する誤差が低減された精密装置
JP2012161861A (ja) 2011-02-04 2012-08-30 Disco Corp 加工装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2695366B2 (ja) * 1993-05-14 1997-12-24 川崎製鉄株式会社 低速回転機械の異常診断方法
JPH07270228A (ja) * 1994-03-29 1995-10-20 Kawasaki Steel Corp 低速回転機械の異常診断方法
US5518347A (en) * 1995-05-23 1996-05-21 Design And Manufacturing Solutions, Inc. Tuned damping system for suppressing vibrations during machining
TW286359B (en) * 1996-02-27 1996-09-21 China Steel Co Ltd The vibration diagnosis method for crack & breakdown of roller
JP5318666B2 (ja) * 2009-05-29 2013-10-16 一般財団法人電力中央研究所 常時微動計測に基づく建物の健全性診断法、診断装置及び診断プログラム
JP5904025B2 (ja) 2012-06-14 2016-04-13 日本精工株式会社 ボールねじ装置の異常検出装置及び異常検出方法
JP6198393B2 (ja) 2012-12-28 2017-09-20 キヤノン株式会社 接触式三次元形状測定装置及びプローブ制御方法
WO2017170270A1 (ja) * 2016-03-30 2017-10-05 Ntn株式会社 歯車装置の状態監視システムおよび状態監視方法
JP6735183B2 (ja) 2016-08-19 2020-08-05 オークマ株式会社 回転軸を有する工作機械
TWI609737B (zh) * 2016-12-22 2018-01-01 Hiwin Tech Corp 偵測工具機的線性滑軌預壓值變化的方法
US10393707B2 (en) 2017-05-03 2019-08-27 Hiwin Technologies Corp. Method for estimating a variation in preload applied to linear guideway

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62173147A (ja) 1986-01-24 1987-07-30 Disco Abrasive Sys Ltd 温度変化に起因する誤差が低減された精密装置
JP2012161861A (ja) 2011-02-04 2012-08-30 Disco Corp 加工装置

Also Published As

Publication number Publication date
JP2020106375A (ja) 2020-07-09
JP7246827B2 (ja) 2023-03-28
CN111383959A (zh) 2020-07-07
TWI821491B (zh) 2023-11-11
TW202023752A (zh) 2020-07-01

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