KR20200078737A - 마스크부재의 세정 장치 및 마스크부재의 세정 시스템 - Google Patents

마스크부재의 세정 장치 및 마스크부재의 세정 시스템 Download PDF

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Publication number
KR20200078737A
KR20200078737A KR1020180166969A KR20180166969A KR20200078737A KR 20200078737 A KR20200078737 A KR 20200078737A KR 1020180166969 A KR1020180166969 A KR 1020180166969A KR 20180166969 A KR20180166969 A KR 20180166969A KR 20200078737 A KR20200078737 A KR 20200078737A
Authority
KR
South Korea
Prior art keywords
mask member
chamber
cleaning
unit
stored
Prior art date
Application number
KR1020180166969A
Other languages
English (en)
Korean (ko)
Inventor
강혁
강민수
이동학
Original Assignee
삼성디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to KR1020180166969A priority Critical patent/KR20200078737A/ko
Priority to CN201910706425.7A priority patent/CN111346861B/zh
Publication of KR20200078737A publication Critical patent/KR20200078737A/ko
Priority to KR1020240089885A priority patent/KR20240114733A/ko

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H01L51/56—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/022—Cleaning travelling work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/14—Removing waste, e.g. labels, from cleaning liquid; Regenerating cleaning liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H01L51/0018—
    • H01L51/0025—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
    • B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
    • B08B2203/0211—Case coverings

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Details Or Accessories Of Spraying Plant Or Apparatus (AREA)
KR1020180166969A 2018-12-21 2018-12-21 마스크부재의 세정 장치 및 마스크부재의 세정 시스템 KR20200078737A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020180166969A KR20200078737A (ko) 2018-12-21 2018-12-21 마스크부재의 세정 장치 및 마스크부재의 세정 시스템
CN201910706425.7A CN111346861B (zh) 2018-12-21 2019-08-01 掩膜部件的清洗装置以及掩膜部件的清洗系统
KR1020240089885A KR20240114733A (ko) 2018-12-21 2024-07-08 마스크부재의 세정 장치 및 마스크부재의 세정 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020180166969A KR20200078737A (ko) 2018-12-21 2018-12-21 마스크부재의 세정 장치 및 마스크부재의 세정 시스템

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020240089885A Division KR20240114733A (ko) 2018-12-21 2024-07-08 마스크부재의 세정 장치 및 마스크부재의 세정 시스템

Publications (1)

Publication Number Publication Date
KR20200078737A true KR20200078737A (ko) 2020-07-02

Family

ID=71193907

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020180166969A KR20200078737A (ko) 2018-12-21 2018-12-21 마스크부재의 세정 장치 및 마스크부재의 세정 시스템
KR1020240089885A KR20240114733A (ko) 2018-12-21 2024-07-08 마스크부재의 세정 장치 및 마스크부재의 세정 시스템

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020240089885A KR20240114733A (ko) 2018-12-21 2024-07-08 마스크부재의 세정 장치 및 마스크부재의 세정 시스템

Country Status (2)

Country Link
KR (2) KR20200078737A (zh)
CN (1) CN111346861B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102674690B1 (ko) 2023-09-26 2024-06-12 (주) 유피테크 메탈마스크 자동 세정장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10948830B1 (en) 2019-12-23 2021-03-16 Waymo Llc Systems and methods for lithography
CN114995052A (zh) * 2022-05-18 2022-09-02 上海图灵智算量子科技有限公司 光罩版清洁装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07313947A (ja) * 1995-03-09 1995-12-05 Seiko Epson Corp ワーク洗浄方法および洗浄装置
JPH10144650A (ja) * 1996-11-11 1998-05-29 Mitsubishi Electric Corp 半導体材料の洗浄装置
JPH10189526A (ja) * 1996-12-20 1998-07-21 Sony Corp レチクルの洗浄方法及びその装置
KR20040045197A (ko) * 2002-11-22 2004-06-01 어드벤스드 알케미(주) 기판 처리 장치
ITMI20030335A1 (it) * 2003-02-25 2004-08-26 T I S R L Sa Dispositivo di lavaggio per cartucce pieghettate e filtro comprendente tale dispositivo.
JP2009088442A (ja) * 2007-10-03 2009-04-23 Hitachi High-Technologies Corp 基板乾燥装置、フラットパネルディスプレイの製造装置及びフラットパネルディスプレイ
JP2010236088A (ja) * 2009-03-09 2010-10-21 Hitachi High-Technologies Corp マスク部材のクリーニング装置及びクリーニング方法並びに有機ｅｌディスプレイ
CN104275324A (zh) * 2013-07-08 2015-01-14 上海和辉光电有限公司 一种去除遮罩上有机或脏污的装置
KR20150057379A (ko) * 2013-11-19 2015-05-28 삼성디스플레이 주식회사 기판 세정 장치
KR20150094200A (ko) * 2014-02-11 2015-08-19 멤스피아 주식회사 마스크 세정장비
JP2017087700A (ja) * 2015-11-17 2017-05-25 株式会社沖電気コミュニケーションシステムズ 洗浄装置
KR20180089603A (ko) * 2017-01-31 2018-08-09 삼성디스플레이 주식회사 유기물 증착 장치 및 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102674690B1 (ko) 2023-09-26 2024-06-12 (주) 유피테크 메탈마스크 자동 세정장치

Also Published As

Publication number Publication date
CN111346861A (zh) 2020-06-30
CN111346861B (zh) 2023-09-22
KR20240114733A (ko) 2024-07-24

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