KR20190089740A - Processing device and manufacturing method of a product - Google Patents

Abstract

The present invention is provided to make processing debris hard to adhere to a washing roller immersed in a washing liquid, and comprises processing devices (6A, 6B) for processing a workpiece (W) and a washing mechanism (8) for washing the processed workpiece (W). The washing mechanism (8) comprises a liquid storage tank (81) for storing the washing liquid and a washing roller (82) which rotates in a state which a part thereof is immersed in the washing liquid inside the liquid storage tank (81), and comes in contact with the processed workpiece (W) located above the liquid storage tank (81). A liquid supply port (83) for supplying the washing liquid into the liquid storage tank (81) and a liquid discharge port (84) for discharging the washing liquid from within the liquid storage tank (81) are disposed with the washing roller (82) interposed therebetween.

Description

TECHNICAL FIELD [0001] The present invention relates to a processing apparatus,

The present invention relates to a processing apparatus and a method of manufacturing an article.

Conventionally, as shown in Patent Document 1, after a workpiece as a workpiece is individually cut, a cleaning roller such as a rotary brush is brought into contact with the cut workpiece to remove processing debris such as cutting chips attached to the workpiece So that cleaning is carried out.

Japanese Patent Application Laid-Open No. 2002-28583

However, during the cleaning process, debris adheres to the cleaning roller, and the debris may not be removed. In this case, the workpiece is cleaned by the cleaning roller having the processed debris, which may lower the cleaning ability.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and its main object is to efficiently remove processed debris adhering to a cleaning roller.

That is, the processing apparatus according to the present invention includes a processing mechanism for performing processing on a workpiece and a cleaning mechanism for cleaning the workpiece to which the processing is applied, wherein the cleaning mechanism includes a reservoir for reserving the cleaning liquid, And a cleaning roller that rotates while partially immersed in the cleaning liquid in the tank and contacts the processed workpiece positioned above the storage tank, And a liquid discharge port for discharging the cleaning liquid from the inside of the cleaning roller is disposed with the cleaning roller interposed therebetween.

According to the present invention constructed as described above, it is possible to efficiently remove the processing debris attached to the cleaning roller.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a plan view schematically showing a configuration of a cutting apparatus according to the present embodiment. FIG.
2 is a plan view schematically showing the configuration of a cleaning mechanism of the same embodiment.
3 is a cross-sectional view schematically showing the configuration of a cleaning mechanism of the same embodiment.
4 is a cross-sectional view schematically showing the configuration of a cleaning mechanism of a modified embodiment.
5 is a cross-sectional view that schematically shows a configuration of a cleaning mechanism of a modified embodiment and a partial plan view of an example of a removal member.

Next, the present invention will be described in more detail by way of example. However, the present invention is not limited to the following description.

The machining apparatus of the present invention includes a machining mechanism for machining a workpiece and a cleaning mechanism for cleaning the machined workpiece, as described above, wherein the cleaning mechanism includes a low- And a cleaning roller which rotates while partially immersed in the cleaning liquid in the low-liquid bath and contacts the workpiece to be processed which is located above the low-liquid bath, and a liquid supply port for supplying the cleaning liquid into the low- And a liquid discharge port for discharging the cleaning liquid from within the low liquid tank is disposed with the cleaning roller interposed therebetween.

In the case of this processing apparatus, the cleaning roller rotates while partially immersed in the cleaning liquid in the low-liquid tank, and is cleaned by contacting with the workpiece, so that the processing debris attached to the cleaning roller is removed by the cleaning liquid.

Here, the processed debris that has been removed from the cleaning roller in the low-liquid tank may remain in the low-liquid tank, and may adhere to the cleaning roller. In the present invention, since the liquid supply port and the liquid discharge port are disposed with the cleaning roller interposed therebetween, a flow of the cleaning liquid is formed in the cleaning roller from the liquid supply port toward the liquid discharge port. As a result, the cleaning liquid is poured into the cleaning roller from one direction, and then the cleaning liquid is discharged to the outside from the liquid outlet, so that the processing debris removed from the cleaning roller in the low liquid tank is discharged together with the cleaning liquid. As a result, it is possible to make it difficult to attach the processing debris in the low-liquid bath to the cleaning roller.

The heavy processing debris sinks on the bottom of the low-liquid tank and is easy to stay. This settled processed debris may be agitated by the rotation of the cleaning roller and moved to the side of the water surface to be reattached to the cleaning roller.

In order to solve this problem, it is preferable that the liquid outlet is formed at the bottom of the low-temperature tank.

With this configuration, it is possible to efficiently discharge the processed debris settled in the bottom portion of the low-liquid tank, and it is possible to reduce the reattachment to the cleaning roller.

In order to reduce the installation area of the cleaning mechanism, it is preferable that the liquid supply port is formed in the bottom portion of the low liquid bath. In this case, the liquid supply pipe connected to the liquid supply port is connected to the bottom of the low liquid tank. In this configuration, it is preferable that the cleaning mechanism further includes a cover member provided so as to cover the liquid supply port, in order to prevent the cleaning liquid from being blown into the air from the liquid supply port.

In the case where the workpiece is a cut-finished substrate or the like in which the workpiece is a single piece, in order to clean the cut-off substrate at a time, it is preferable that the cleaning roller has a cylindrical shape and rotates about its central axis.

In the case of this configuration, it is preferable that the liquid supply port and the liquid discharge port are disposed with the central axis of the cleaning roller therebetween.

In order to uniformly remove the processing debris adhered to the cleaning roller by making the cleaning liquid flowing through the cleaning roller more uniform, the lower liquid reservoir is provided between the cleaning roller and the liquid supply port, And a partition plate which divides the cleaning liquid into a first low fluid chamber and a second low fluid chamber on the side of the cleaning roller and overflows the cleaning liquid from the first low fluid chamber to the second low fluid chamber. By making the flow of the cleaning liquid more uniform, it is possible to discharge the processed debris stagnated in the low-liquid tank without shifting.

In order to facilitate the flow to the cleaning roller and the liquid discharge port and to allow the processing debris settled in the bottom portion of the low liquid tank to flow easily to the liquid discharge port, the bottom portion of the low liquid tank is moved from the liquid supply port side to the liquid discharge port side And an inclined portion that descends toward the lower surface.

There is a possibility that the processing debris can not be sufficiently removed merely by bringing the cleaning liquid into contact with the cleaning roller. Therefore, it is preferable that the cleaning mechanism further includes a removal member for removing the processing debris attached to the cleaning roller in contact with the cleaning roller above the low-liquid tank.

A manufacturing method of a product according to the present invention includes a processing step of processing a workpiece and a cleaning step of cleaning the processed workpiece, wherein the cleaning step is performed using a cleaning mechanism , And the cleaning mechanism includes a cleaning roller which rotates in a state in which a part of the cleaning liquid in the cleaning tank is immersed in the cleaning tank, a cleaning liquid in contact with the processed workpiece located above the storage tank And a liquid supply port for supplying a cleaning liquid into the low-liquid tank and a liquid discharge port for discharging the cleaning liquid from the low-liquid tank are arranged with the cleaning roller interposed therebetween.

<One embodiment of the present invention>

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of a machining apparatus according to the present invention will be described with reference to the drawings. Further, any of the drawings shown below are drawn schematically so that they are omitted or exaggerated appropriately in order to make them easy to understand. The same components are denoted by the same reference numerals and the description thereof is appropriately omitted.

<Overall Configuration of Processing Apparatus>

As shown in Fig. 1, the machining apparatus 100 according to the present embodiment is a cutting apparatus that cuts a sealed finished plate-like member W, which is a workpiece, into a plurality of products P (cut pieces) to be. The cutting apparatus 100 includes a plate-shaped member feeding unit A, a plate-shaped member cutting unit B, an inspection unit C, and a receiving unit D as constituent elements. Each of the components (each of the units A to D) is detachable and exchangeable with respect to each of the other components.

Here, the sealed end plate-shaped member W includes a plate-shaped member such as a printed board or a lead frame, which is virtually divided into a plurality of regions in a lattice shape, and chip-shaped elements (for example, ), And then a part or the whole of the plate-like member is resin-sealed. The sealed end plate shaped member W has a surface on the substrate side and a surface on the resin side. The finished product substrate is cut by a cutting mechanism (processing mechanism) using a rotary blade or the like, and the product P is divided into individual regions. In the following, an example of cutting the encapsulated substrate as the encapsulated plate-like member W is shown.

The plate-like member feeding unit A is provided with a plate-like member feeding mechanism 2. The seal-completed substrate W corresponding to the material to be cut is taken out of the plate-like member supply mechanism 2 and transferred to the plate-shaped member cutting unit B by a transfer mechanism (not shown). The encapsulated substrate W may be transported with the substrate side facing up and with the resin side facing up. For example, the seal-completed substrate W of the BGA (Ball Grid Array Package) method is transported with its substrate side facing up. On the other hand, an encapsulated substrate W which is resin-sealed using a transparent resin material such as an LED is often transported with its resin side facing up. 1, a case of cutting a BGA-type sealed substrate W will be described. Thus, the seal-completed substrate W is transported with the substrate-side surface facing up.

The cutting apparatus 100 shown in Fig. 1 is a single-cut table type cutting apparatus. Therefore, the plate-shaped member cutting unit B is provided with one cutting table 3. The cutting table 3 is movable in the Y direction in Fig. 1 by the moving mechanism 4 and is also rotatable in the [theta] direction by the rotating mechanism 5. [ On the cutting table 3, the encapsulated substrate W is placed and adsorbed. Further, in the case of separating a plurality of contact image sensors, a ceramic substrate having a plurality of thermal print heads (thermal print heads), a printed substrate, etc., each having an elongated thermally shaped shape And the rotating mechanism 5 may be omitted.

The plate-shaped member cutting unit B is provided with two spindles 6A and 6B as a cutting mechanism (processing mechanism). The cutting apparatus 100 is a twin spindle cutting apparatus provided with two spindles 6A and 6B. The two spindles 6A and 6B can move independently in the X direction. Rotary blades 61A and 61B are provided on the two spindles 6A and 6B, respectively. These rotary blades 61A and 61B rotate in the plane including the Y direction and the Z direction, respectively, thereby cutting the sealed finished substrate W.

Each of the spindles 6A and 6B is provided with a cutting water supply nozzle (not shown) for spraying the cutting water toward the work point in order to suppress the frictional heat generated by the rotating blades 61A and 61B rotating at high speed, Is provided. The sealing completion substrate W is cut by relatively moving the cutting table 3 and the spindles 6A and 6B. 1 shows a case where the sealed end substrate W is cut by fixing the spindles 6A and 6B and moving the cutting table 3 in the Y direction.

The plate-shaped member cutting unit B is provided with an assembly of a plurality of products P cut out of the sealed finished substrate W, that is, an assembly of the cut-finished substrate W ' A cleaning mechanism 7 for cleaning the surface (the surface on the substrate side in Fig. 1) and a cleaning mechanism 8 for cleaning the other surface (the surface on the resin side in Fig. 1) are provided.

The cleaning mechanism 7 is provided integrally with the spray cleaning mechanism 71 and the drying mechanism 72. The cutting table 3 linearly reciprocates along the Y direction under the cleaning mechanism 7 by the moving mechanism 4. [ The surface of the cut substrate W 'on the substrate side is cleaned by the jet cleaning mechanism 71, and the surface of the substrate W' is cleaned by the jet cleaning mechanism 71. As a result, And is dried by the mechanism (72). The cleaning mechanism 7 having the spray cleaning mechanism 71 and the drying mechanism 72 may be integrally moved or fixed.

The cleaning mechanism 8 is provided with a cleaning roller 82 rotatable in the Y direction as a rotation axis. A cut-off substrate W 'is disposed above the cleaning mechanism 8 for cleaning the resin-side surface. The substrate-side surface of the cut-off substrate W 'is sucked and fixed by the transport mechanism 9. In other words, the cut-off substrate W 'is fixed to the transport mechanism 9 with its resin-side surface facing downward. The transport mechanism 9 is movable in the X and Z directions. As the transport mechanism 9 descends and reciprocates in the X direction, the resin-side surface of the cut-off substrate W 'is cleaned by the cleaning roller 82. The drying unit for drying the resin-side surface of the cut-off substrate W 'after cleaning may be provided in the cleaning mechanism 8, or may be provided outside the cleaning mechanism. The drying unit may be an air blow or the like.

An inspection stage (10) is provided in the inspection unit (C). The cut substrate W 'is transferred to the inspection stage 10. The inspection stage 10 is movable in the X direction and is configured to be able to rotate about the Y direction as an axis. In the plurality of separated products P, the side of the resin side and the side of the substrate side are inspected by the inspection camera 11, and are sorted into good and defective products. The finished cut substrate W 'is transferred to the index table 12. The inspection unit C is provided with a plurality of feed mechanisms 13 for feeding a plurality of products P arranged on the index table 12 to the tray.

The receiving unit (D) is provided with a good tray (14) for storing good items and a tray (15) for storing bad articles. The product (P) sorted into the good product and the defective product is accommodated in each tray (14, 15) by the feed mechanism (13). 1, only one tray 14, 15 is shown, but each tray 14, 15 is provided in a plurality of receiving units D. The receiving unit D is provided with a good tray accommodating portion for accommodating the good tray 14 that has received good goods and a defective tray accommodating portion for storing the defective tray 15 that has received the defective product therein , And an empty tray (tray for receiving) supply unit for supplying empty trays before storage may be provided.

In the present embodiment, a control unit CTL for setting and controlling the operation of the cutting apparatus 100, cutting conditions, cleaning conditions, and the like is provided in the plate-like member feeding unit A. The present invention is not limited to this, and the control unit CTL may be provided in the other units B to D.

<Specific Configuration of Cleaning Mechanism 8>

Next, the specific configuration of the cleaning mechanism 8 will be described.

2 and 3, the cleaning mechanism 8 includes a reservoir 81 for reserving water as a cleaning liquid, a resin (not shown) of the cut-off substrate W 'located above the reservoir 81, And a cleaning roller 82 that contacts the surface of the cleaning roller 82.

The low liquid tank 81 has a box shape having an opening 81H on its upper surface and stores water for cleaning the cleaning roller 82. [ The liquid reservoir 81 of the present embodiment has a substantially rectangular bottom portion 81a having a flat plate shape and a side wall portion 81b provided on each side of the bottom portion 81a. In this liquid tank 81, a part of the cleaning roller 82 is provided so as to be immersed in water from the opening 81H on the upper surface.

The liquid reservoir 81 is provided with a liquid supply port 83 for supplying water into the reservoir 81 and a liquid discharge port 84 for discharging water from the reservoir. The liquid supply port 83 is connected to a supply pipe 85 for supplying water from the outside to the low liquid tank 81. The amount of water (amount of water) supplied from the supply pipe 85 is adjusted by a flow rate adjusting mechanism (not shown) so that the level of the water level in the low-liquid bath 81 becomes substantially constant. In addition, the water discharged from the liquid discharge port 84 is contained in a waste water container (not shown) provided below. Further, a discharge pipe may be connected to the liquid discharge port 84.

The cleaning roller 82 has a cylindrical shape and rotates about its central axis 82x. The cleaning roller 82 is provided horizontally along the Y direction with its central axis 82x on the upper side of the reservoir 81. The cleaning roller 82 of the present embodiment is a cylindrical rotary brush in which a bristles 82b are radially provided on the outer peripheral surface of the shaft portion 82a.

The cleaning roller 82 is configured to rotate in a state in which a part (specifically, a part of the brush bristles 82b in the circumferential direction) is immersed in water in the low liquid tank 81. Concretely, the cleaning roller 82 is rotatably driven by a motor (not shown) connected to one end portion in the axial direction, with both end portions in the axial direction of the shaft portion 82a being rotatably supported by the support body 80. [ The support 80 is provided separately from the low-level tank 81, but may be constructed using the side wall 81b of the low-

The cleaning mechanism 8 is provided with a water removal member 86 for removing water contained in the cleaning roller 82. The water removing member 86 is in the form of a rod provided along the central axis 82x of the cleaning roller 82 and contacts the cleaning roller 82 rotating during cleaning. The water removing member 86 comes into contact with the brush bristles 82b that are directed from the water to the cut-off substrate W ', and drain water.

In the cleaning mechanism 8 of the present embodiment, the liquid supply port 83 and the liquid discharge port 84 formed in the low liquid tank 81 are disposed with the cleaning roller 82 therebetween. The liquid supply port 83 and the liquid discharge port 84 are both formed in the bottom portion 81a of the low liquid bath 81. [

The liquid supply port 83 of this embodiment is formed at two locations. It is preferable that the two liquid supply ports 83 are provided at substantially equidistant positions from the center axis 82x of the cleaning roller 82, that is, at positions aligned in the Y direction. In addition, the two liquid supply ports 83 is preferably arranged in substantially symmetrical positions in the Y direction in the bottom portion (81a) of the bottom liquid tank (81). The number of the liquid supply ports 83 is not limited to two, but may be one or three or more. When three or more liquid supply ports 83 are formed, it is preferable that they are provided at substantially equal intervals in the Y direction in order to equalize the flow of the water.

On the other hand, the liquid outlet 84 has a straight slit shape extending in the Y direction. It is preferable that the liquid discharge port 84 is provided in a direction substantially parallel to the central axis 82x of the cleaning roller 82, that is, along the Y direction. Also, a plurality of liquid discharge ports 84 may be formed in the same manner as the liquid supply port 83.

The lower tank 81 further includes a partition plate (not shown) for partitioning the inside of the tank 81 into a first low fluid chamber S1 on the side of the liquid supply port 83 and a second low fluid chamber S2 on the side of the cleaning roller 82 87).

The partition plate 87 is provided between the cleaning roller 82 and the liquid supply port 83 so as to be substantially parallel to the central axis 82x of the cleaning roller 82. [ The height dimension of the partition plate 87 is substantially the same in the long hand direction in plan view. Further, the height dimension of the partition plate 87 is set to be lower than the height of the side wall portion 81b of the low liquid tank 81. This prevents the water from overflowing from the side wall portion 81b of the low liquid tank 81. [

A liquid supply port 83 is located on the side of the first low fluid chamber S1 in the bottom portion 81a of the low liquid tank 81 and a liquid discharge port 84 is located on the side of the second low fluid chamber S2. The water stored in the first low fluid chamber S1 from the liquid supply port 83 overflows the partition plate 87 and flows into the second low fluid chamber S2. Here, the water flowing into the first low fluid chamber S1 from the liquid supply port 83 is stored in the first low fluid chamber S1 so that the flow velocity in the width direction (Y direction in Fig. 2) (Plaques) are alleviated. In addition, the water flowing into the second low fluid chamber S2 from the first low fluid chamber S1 overflows the partition plate 87, so that the flow velocity in the width direction becomes more uniform. As a result, the flow of water flowing toward the cleaning roller 82 in the second low fluid chamber S2 becomes more uniform in the axial direction of the cleaning roller 82. [

In the present embodiment, the rotating direction of the cleaning roller 82 is opposite to the flow direction of the water (see FIG. 3). As a result, the moving direction of the brush bristles 82b of the cleaning roller 82 in the water and the flow direction of the water are opposite to each other, so that the immersion area (bristles 82b) The force received from the water increases at the time of contact, and the processing debris attached to the cleaning roller 82 is easily removed.

The cleaning mechanism 8 further includes a cover member 88 provided to cover the liquid supply port 83. The liquid supply port 83 of the present embodiment is formed on the bottom portion 81a of the liquid reservoir 81 so that the cover member 88 is also provided on the bottom portion 81a of the liquid reservoir 81. [ In addition, a cover member 88 is provided for each liquid supply port 83.

The cover member 88 is provided above the liquid supply port 83 in the low liquid tank 81 (specifically, in the first low liquid chamber S1), and in this embodiment, And the water flowing in the upward direction from the supply port 83 is dispersed in the lateral direction (Y direction). In Fig. 2, it is configured to be dispersed in two directions along the Y direction. The cover member 88 may be configured to cover the entire liquid supply port 83 as shown in FIG. 2, or may cover a part of the liquid supply port 83. In addition, the cover member 88 is not limited to a shape having a downwardly inverted U-shaped cross section, but may cover any or all of the liquid supply port 83.

The cover member 88 is provided so as to cover the liquid supply port 83 so that the water introduced from the liquid supply port 83 is dispersed by the cover member 88 and is discharged into the first low- It is possible to further alleviate the non-uniformity of the flow velocity in the fluid.

&Lt; Effect of the present embodiment &

According to the cutting apparatus 100 of the present embodiment, the cleaning roller 82 rotates while partially immersed in water in the low liquid tank 81, and contacts the cut substrate W ' The processing debris adhered to the processing chamber 82 is removed by water.

Particularly, in this embodiment, since the liquid supply port 83 and the liquid discharge port 84 are disposed with the cleaning roller 82 therebetween, the liquid discharge port 84 A flow of water is formed. As a result, the water is poured into the cleaning roller 82 from one direction, and then the water is discharged from the liquid discharge port 84 to the outside, so that the water is removed from the cleaning roller 82 in the low- The processed debris is discharged together with the water. As a result, it is possible to make it difficult for the processing debris in the low-liquid bath 81 to adhere to the cleaning roller 82.

In this embodiment, since the liquid outlet port 84 is formed in the bottom portion 81a of the low liquid tank 81, it is possible to efficiently discharge the processed debris settled in the bottom portion 81a of the low liquid tank 81 Therefore, reattachment to the cleaning roller 82 can be reduced.

In the present embodiment, since the cover member 88 covering the liquid supply port 83 is provided, water can be prevented from being blown from the liquid supply port 83 into the air, It is possible to disperse one water, and the flow velocity of the water flowing through the cleaning roller 82 can be made even more uniform.

The inside of the low liquid chamber 81 is partitioned into a first low fluid chamber S1 and a second low fluid chamber S2 by a partition plate 87 so that water is supplied from the first low fluid chamber S1 to the second low fluid chamber S2 so that the water flowing in the cleaning roller 82 becomes more uniform, it is possible to remove the processing debris adhering to the cleaning roller 82 evenly.

<Other Modified Embodiments>

The present invention is not limited to the above-described embodiments.

For example, the position of the liquid supply port 83 and the liquid discharge port 84 may be the side wall portion 81b of the low liquid bath 81. [ In this case, it is preferable that the liquid discharge port 84 is as close as possible to the bottom portion 81a in order to easily discharge the settled processed debris.

4, the liquid supply port 83 and the liquid discharge port 84 are not provided in the bottom portion or the side wall portion 81b of the low liquid tank 81, It may be constituted by the supply pipe 8A and the liquid discharge pipe 8B. In this case, the opening of the liquid supply pipe 8A on the side of the liquid level tank 81 serves as the liquid supply port 83 and the opening of the liquid discharge pipe 8B on the side of the liquid level tank 81 is connected to the liquid discharge port 84 ). In this case, the liquid outlet 84 is desirably disposed as close as possible to the bottom 81a of the liquid tank 81. In addition, a suction pump (not shown) is provided in the liquid discharge pipe 8B, and water in the low-liquid bath 81 is sucked.

In addition, the height dimension of the partition plate 87 may not be substantially the same, and the height dimension may be different in the longitudinal direction in plan view. For example, by making the height of the central portion of the partition plate 87 lower than both ends, the flow of the cleaning liquid at the central portion can be made faster or the opposite structure can be obtained, I can do it fast. It is also conceivable to set the height dimension in accordance with the positional relationship with the liquid supply port 83. For example, it is conceivable that the height of the portion near the liquid supply port 83 is made higher and the height of the portion far from the liquid supply port 83 is made lower, thereby making the flow uniform.

5, even when the bottom portion 81a of the low liquid tank 81 has the inclined portion 81a1 that descends from the liquid supply port 83 side toward the liquid discharge port 84 side good. 5 has a partition plate 87 and the inclined portion 81a1 is configured to descend from the partition plate 87 toward the liquid outlet 84 side. The inclined portion 81a1 is not limited to a flat shape (straight line), but may be curved in the center in the width direction and may form a flow of the cleaning liquid toward the liquid outlet 84. The inclined portion 81a1 allows the processed debris to be efficiently discharged from the liquid discharge port 84. [

5, the cleaning mechanism 8 is provided with a removing member 89 (not shown) for removing the processing debris that is attached to the cleaning roller 82 in contact with the cleaning roller 82 at the upper side of the lower liquid tank 81, May be further provided. As shown in Fig. 5, the removing member 89 has a rod-like shape provided along the central axis 82x of the cleaning roller 82 and contacts the cleaning roller 82 which rotates at the time of cleaning. In the case where the cleaning roller 82 is a rotary brush, it is conceivable that the cleaning roller 82 has a comb shape having a plurality of projections 89a in order to facilitate removal of the processing debris entrained into the brush bristles. The removing member 89 also functions to remove the water contained in the cleaning roller 82 in addition to the function of removing the processing debris attached to the cleaning roller 82. The removing member 89 is provided on the way of the cleaning roller 82 coming out of the cleaning liquid toward the cut-off substrate W ', but it may be provided on the way from the cut-off substrate W' to the cleaning liquid.

In the above embodiment, when the resin-encapsulated encapsulated substrate W is cut, the encapsulated substrate W is transferred with its resin-side surface facing up. At this time, the cleaning mechanism 7 cleans the resin-side surface of the cut-off substrate W ', and the cleaning mechanism 8 cleans the surface of the cut-off substrate W' do.

The cleaning roller may be made of a material having a water property such as a sponge shape in addition to the rotary brush.

Furthermore, in the above embodiment, a cutting apparatus that is a twin spindle configuration is described as a single-cut table system. However, the present invention is not limited to this. The cutting apparatus of the single- A cutting device that is a constituent, a twin cut table type, and a cutting device that is a twin spindle configuration.

In addition to this, the machining apparatus of the present invention may be a machining other than the cutting, for example, other machining such as cutting or grinding.

In addition, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention.

100 Cutting device (processing device)
W Bond Completed Substrate (Completed plate-like member, workpiece)
W 'Cutting completion board (cut-out plate-shaped member)
P Products
A-shaped member feeding unit
B plate shape member cutting unit
C inspection unit
D receiving unit
CTL control section
2-plate shaped member supply mechanism
3 Cutting table
4 Moving mechanism
5 rotation mechanism
6A spindle (machining mechanism)
61A rotary blade
6B spindle (machining mechanism)
61B Rotating blade
7 cleaning mechanism
71 injection cleaning mechanism
72 Drying equipment
8 cleaning mechanism
9 conveying mechanism
10 Inspection Stage
11 Camera
12 Index table
13 Feed mechanism
14 Good-quality tray
15 Trays for defective products
80 support
81 Low-liquid tank
81H opening
81a bottom portion
81b side wall portion
82 Cleaning roller
82a shaft portion
82b Brush Mo
82x center axis
83 fluid supply port
84 liquid outlet
85 suppliers
87 partition plate
S1 1st low fluid chamber
S2 2nd low fluid chamber
88 cover member
8A fluid supply pipe
8B liquid discharge pipe
81a1 inclined portion
86 moisture removal member
89 removal member

Claims (12)

A processing mechanism for processing the workpiece; and a cleaning mechanism for cleaning the processed workpiece,
Wherein the cleaning mechanism includes a cleaning tank for holding the cleaning liquid and a cleaning roller which rotates while partially immersed in the cleaning liquid in the storage tank and contacts the processed workpiece positioned above the storage tank,
Wherein a liquid supply port for supplying the cleaning liquid into the low liquid tank and a liquid discharge port for discharging the cleaning liquid from the low liquid tank are arranged with the cleaning roller interposed therebetween. The method according to claim 1,
And said liquid outlet is formed in a bottom portion of said low liquid tank. The method according to claim 1,
Wherein the liquid supply port is formed in a bottom portion of the low-
Wherein the cleaning mechanism further comprises a cover member provided to cover the liquid supply port. The method according to claim 1,
The cleaning roller has a cylindrical shape and rotates around its central axis,
Wherein the liquid supply port and the liquid discharge port are disposed with the central axis interposed therebetween. The method according to claim 1,
Wherein the low liquid reservoir is provided between the cleaning roller and the liquid supply port and is divided into a first low liquid chamber on the side of the liquid supply port and a second low liquid chamber on the side of the cleaning roller, 2 low-fluid chamber. The method according to claim 1,
Wherein the bottom portion of the low-liquid bath includes an inclined portion that descends from the liquid supply port side toward the liquid discharge port side. 7. The method according to any one of claims 1 to 6,
Wherein the cleaning mechanism further comprises a removing member for removing the processing debris attached to the cleaning roller in contact with the cleaning roller above the storage tank. A machining step of machining the workpiece,
And a cleaning step of cleaning the processed workpiece,
The cleaning step is carried out using a cleaning mechanism,
Wherein the cleaning mechanism includes a cleaning tank for holding the cleaning liquid and a cleaning roller which rotates while partially immersed in the cleaning liquid in the storage tank and contacts the processed workpiece positioned above the storage tank,
Wherein a liquid supply port for supplying the cleaning liquid into the low liquid tank and a liquid discharge port for discharging the cleaning liquid from the low liquid tank are arranged with the cleaning roller interposed therebetween. 9. The method of claim 8,
Wherein the liquid supply port is formed in a bottom portion of the low-
Wherein the cleaning mechanism further comprises a cover member provided to cover the liquid supply port. 9. The method of claim 8,
Wherein the low liquid reservoir is provided between the cleaning roller and the liquid supply port and is divided into a first low liquid chamber on the side of the liquid supply port and a second low liquid chamber on the side of the cleaning roller, 2. A product manufacturing method, comprising a partition plate overflowing into a low-fluid chamber. 9. The method of claim 8,
Wherein the bottom portion of the low-liquid bath includes an inclined portion descending from the liquid supply port side toward the liquid discharge port side. The method according to any one of claims 8 to 11,
Wherein the cleaning mechanism further comprises a removing member for removing the processing debris adhering to the cleaning roller in contact with the cleaning roller above the storage tank.

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