TW202347484A - Processing device capable of suppressing machining chips adhering to a cleaning liquid supply nozzle from falling onto a workpiece or a holding table - Google Patents

Abstract

This invention provides a processing device capable of suppressing machining chips adhering to a cleaning liquid supply nozzle from falling onto a workpiece or a holding table. The processing device (1) is equipped with: a holding table (10) that holds a workpiece (200); a cutting unit (20) that has a cutting blade (21) for cutting the workpiece (200) held by the holding table (10); and a processing feed unit (41) for processing and feeding the holding table (10) in the X-axis direction; and a cleaning liquid supply nozzle (70), which has: a main body (73), which is disposed above a moving path for processing and feeding the holding table (10) in the X-axis direction and extends in the Y-axis direction that intersects with the X-axis direction; and one or more ejection ports (74) formed in the main body (73) and supplying the cleaning liquid (71) downward from the ejection ports (74). The main body (73) of the cleaning liquid supply nozzle (70) is provided obliquely from one end in the Y-axis direction to the other end.

Description

Processing equipment

The present invention relates to a processing device having a cleaning liquid supply nozzle.

In the case of a processing device, a cleaning liquid supply nozzle having a rod-shaped body portion extending in the Y-axis direction crossing the X-axis direction may be provided above the movement path of the holding table in the X-axis direction. (For example, refer to Patent Document 1).

This cleaning liquid supply nozzle is used for cleaning the workpiece held by the holding table, the holding table, the processing chamber, etc. [Known technical documents] [Patent Document]

[Patent Document 1] Japanese Patent Application Publication No. 2015-149428

[Problem to be solved by the invention] However, in the processing apparatus shown in Patent Document 1, machining chips are scattered during processing, and therefore the liquid containing the machining chips also adheres to the cleaning liquid supply nozzle. Particularly in the case of a processing device using a liquid for processing, the processing chips are scattered as a spray while being contained in the liquid, and easily adhere to the cleaning liquid supply nozzle.

If the supply of liquid from the cleaning liquid supply nozzle is stopped while the machining chips adhere to the cleaning liquid supply nozzle, the machining chips will adhere to the cleaning liquid supply nozzle. If the supply of the cleaning fluid is restarted while the machining chips are fixed, there is a high risk that the machining chips contained in the cleaning fluid will drip onto the workpiece or the holding table.

Furthermore, even if the cleaning liquid is always supplied from the cleaning liquid supply nozzle, if the machining chips adhere to the space between the nozzles, there is a possibility that the machining chips will fall together with the cleaning liquid at an unexpected time or be included in the cleaning liquid and drip. .

If machining chips drop onto the workpiece, there is a concern that the processing quality of the workpiece will be affected. If they drop onto the holding table, foreign matter will be attached to the holding table, which will cause problems in subsequent processing. Concerns about the deterioration of the processing quality of the processed objects.

Furthermore, even if machining debris does not adhere to the cleaning fluid supply nozzle, if the cleaning fluid stored in the flow path of the cleaning fluid supply nozzle or the cleaning fluid adhered to the periphery of the ejection port with surface tension falls to the workpiece at an unexpected time, , and the formation of traces of liquid called water marks may also affect the processing quality of the processed object or cause an unpleasant appearance.

Furthermore, it is not limited to the cleaning fluid. During the processing of the workpiece, the machining fluid including the machining chips attached to the cleaning fluid supply nozzle falls onto the workpiece or the holding table at an unexpected time. , there is also a concern that the processing quality of the workpiece will be deteriorated.

An object of the present invention is to provide a machining apparatus that can suppress at least 10% of the cleaning liquid adhering to the cleaning liquid supply nozzle, the machining debris contained in the cleaning liquid, the machining fluid adhering to the cleaning liquid supply nozzle, and the machining debris contained in the machining liquid. Either one falls onto the workpiece or the holding table.

[Technical means to solve the problem] In order to solve the above-mentioned problems and achieve the object, a processing device of the present invention is characterized by including: a holding table that holds a workpiece; and a processing unit that has a processing tool for processing the workpiece held by the holding table. ; a processing and feeding unit that processes and feeds the holding table in the X-axis direction; and a cleaning liquid supply nozzle that has: a body portion that is disposed on a movement path that processes and feeds the holding table in the X-axis direction above and extending in the Y-axis direction that intersects with the X-axis direction; and one or more ejection ports, which are formed on the body part, and the cleaning liquid is supplied downward from the ejection port, and the cleaning liquid is supplied to the nozzle, The main body portion is inclined from one end to the other end in the Y-axis direction.

The aforementioned processing device may further include a processing fluid supply nozzle for supplying the processing fluid to a processing area where the workpiece is processed.

In the aforementioned processing device, the processing tool is a cutting blade, and the cutting blade can also be fixed on a rotatable spindle.

In the aforementioned processing device, the lower end of the main body part may also be positioned outside the holding table.

In the aforementioned processing device, a groove extending along the longitudinal direction of the main body may be formed in at least part of the surface of the main body on which the ejection port is formed.

[Invention effect] The present invention has the effect of preventing machining chips attached to the cleaning fluid supply nozzle from falling onto the workpiece or the holding table.

Modes (embodiments) for implementing the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiments. In addition, the structural elements described below include those that can be easily imagined by a person with ordinary knowledge in the technical field to which the present invention belongs and are substantially the same. In addition, the structures described below can be combined appropriately. In addition, various omissions, substitutions, or changes in the structure may be made without departing from the gist of the present invention.

[Embodiment 1] The processing device according to Embodiment 1 of the present invention will be described based on the drawings. FIG. 1 is a perspective view schematically showing a structural example of a processing device according to Embodiment 1. FIG. 2 is a cross-sectional view schematically showing the main part of the processing device shown in FIG. 1 .

The processing device 1 shown in FIG. 1 of Embodiment 1 is a cutting device that cuts an object 200 to be processed. The object 200 to be processed by the processing apparatus 1 shown in FIG. 1 is a disc-shaped semiconductor wafer or an optical element wafer or other wafer having a substrate 201 of silicon, sapphire, gallium, or the like. The workpiece 200 is provided with a plurality of dividing lines (not shown) that cross each other on the front surface 202 , and components (not shown) are formed in each area divided by the dividing lines on the front surface 202 .

The components are, for example, integrated circuits such as IC (Integrated Circuit) or LSI (Large Scale Integration), CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor). image sensors such as semiconductors), or memories (semiconductor memory devices), etc.

In Embodiment 1, the workpiece 200 is cut along the planned dividing line and divided into individual components.

In addition, in the present invention, the object 200 to be processed is not limited to a wafer. For example, it may also be a packaging substrate, a ceramic plate, or a package substrate in which a plurality of component chips are arranged on a rectangular substrate and the component chips are covered with a sealing resin. Glass plates etc.

(Processing device) The processing device 1 shown in FIG. 1 holds a workpiece 200 with a holding table 10 and cuts the workpiece 200 into individual components with a cutting blade 21 (equivalent to a processing tool) along a planned division line. device.

As shown in FIG. 1 , the processing device 1 is provided with: a holding table 10 that attracts and holds a workpiece 200 with a holding surface 11; and a cutting unit 20 that is a processing unit having a cutting blade 21 that is held on the holding surface 11. The workpiece 200 held on the holding table 10 is cut and processed; the imaging unit 30 (shown in FIG. 2 ) takes a picture of the workpiece 200 held on the holding table 10 ; and the control unit 100 . As shown in FIG. 1 , the processing device is a cutting machine provided with two cutting units 20 , that is, two spindles, and is a so-called opposing dual-spindle type cutting device.

Furthermore, the processing device 1 is provided with the moving unit 40 which relatively moves the holding table 10 and the cutting unit 20. The moving unit 40 at least includes: a processing and feeding unit 41, which processes and feeds the holding table 10 in the X-axis direction parallel to the horizontal direction; and an indexing feeding unit 42, which processes the cutting unit 20 parallel to the horizontal direction and with Indexing feed is performed in the Y-axis direction orthogonal to the The vertical direction in which the directions are orthogonal to the two directions; and the rotational movement unit 44, which rotates the holding table 10 around an axis parallel to the Z-axis direction. That is, the moving unit 40 relatively moves the holding table 10 and the cutting unit 20 in the X-axis direction, the Y-axis direction, the Z-axis direction and around the axis.

The processing and feeding unit 41 moves the holding table 10 and the rotational movement unit 44 in the processing feeding direction, that is, the X-axis direction, thereby moving the cutting unit 20 and the holding table 10 relatively along the X-axis direction. The indexing feeding unit 42 moves the cutting unit 20 in the indexing feeding direction, that is, the Y-axis direction, so that the cutting unit 20 and the holding table 10 move relatively along the Y-axis direction. The cutting unit 43 moves the cutting unit 20 in the cutting feeding direction, that is, the Z-axis direction, so that the cutting unit 20 and the holding table 10 move relatively along the Z-axis direction. The rotational movement unit 44 is supported by the processing feed unit 41, supports the holding table 10, and is disposed to be movable in the X-axis direction together with the holding table 10.

The machining feed unit 41, the index feed unit 42, and the plunge feed unit 43 are equipped with: a conventional ball screw, which is configured to freely rotate around the axis; and a conventional motor, which rotates the ball screw around the axis. Rotation; and conventional guide rails that support the holding table 10 or the cutting unit 20 to move freely in the X-axis direction, the Y-axis direction, or the Z-axis direction. Furthermore, the rotational movement unit 44 is provided with a motor that rotates the holding base 10 around the axis.

The holding base 10 has a disk shape, and the holding surface 11 for holding the workpiece 200 is formed of porous ceramics or the like. Furthermore, the holding table 10 is provided by the processing feeding unit 41 so as to span the processing area 3 below the cutting unit 20 and the loading and unloading area 4 away from the lower part of the cutting unit 20 and where the workpiece 200 is carried in and out. And move freely. The holding table 10 is rotatably provided around an axis parallel to the Z-axis direction by the rotational movement unit 44 .

In the holding table 10, the holding surface 11 is connected to a suction source (not shown), and is suctioned by the suction source, thereby attracting and holding the workpiece 200 placed on the holding surface 11.

The cutting unit 20 is a processing unit in which the cutting blade 21 is fixed to the spindle 23 and cuts the workpiece 200 held on the holding table 10 . The cutting unit 20 is provided to be movable in the Y-axis direction by the indexing feed unit 42 and is provided so as to be movable in the Y-axis direction by the cutting feed unit 43 with respect to the workpiece 200 held on the holding table 10 . Move freely in the Z-axis direction. The cutting unit 20 is installed on the support frame 5 erected from the device body 2 through the indexing feeding unit 42 and the cutting feeding unit 43 . The cutting unit 20 can position the cutting blade 21 at any position on the holding surface 11 of the holding table 10 by using the indexing feed unit 42 and the cutting feed unit 43 .

The cutting unit 20 includes the following components: a cutting blade 21; a spindle housing 22, which is provided to be movable in the Y-axis direction and the Z-axis direction by an indexing feed unit 42 and a cutting feed unit 43; a spindle 23, It is disposed on the spindle housing 22 so as to be rotatable around the axis, and has a cutting blade 21 fixed at the front end; and a spindle motor (not shown), which rotates the spindle 23 around the axis.

The cutting blade 21 is an extremely thin cutting grindstone having a substantially ring shape. The cutting blade 21 is fixed on the front end of the main shaft 23 . In Embodiment 1, the cutting blade 21 is a so-called hub-type blade, which includes an annular circular base and an annular cutting edge that is arranged on the outer peripheral edge of the circular base and cuts the object. Processed product 200. The cutting edge is composed of abrasive grains such as diamond and CBN (Cubic Boron Nitride) and binding materials (bonding materials) such as metal and resin, and is formed to a predetermined thickness. In addition, in the present invention, the cutting blade 21 may be a so-called washer type blade composed only of a cutting edge.

In addition, the axes of the cutting blade 21 and the main shaft 23 of the cutting unit 20 are set parallel to the Y-axis direction.

The camera unit 30 is fixed to the cutting unit 20 so as to move integrally with the cutting unit 20 . The imaging unit 30 is provided with an imaging element that photographs a region to be divided of the workpiece 200 held on the holding table 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary MOS, complementary metal oxide semiconductor) imaging element. The imaging unit 30 takes a picture of the workpiece 200 held on the holding table 10 to obtain an image for performing alignment, etc., and outputs the obtained image to the control unit 100 . The alignment is performed between the workpiece 200 and the like. Alignment of cutting blade 21.

Furthermore, the processing device 1 is provided with an X-axis direction position detection unit (not shown) for detecting the X-axis direction position of the holding table 10 and a Y-axis direction position detection unit (not shown) for detecting the cutting unit 20 The position of the cutting unit 20 in the Y-axis direction; and a Z-axis position detection unit used to detect the position of the cutting unit 20 in the Z-axis direction. The X-axis direction position detection unit and the Y-axis direction position detection unit can be composed of a linear scale and a read head parallel to the X-axis direction or the Y-axis direction. The Z-axis direction position detection unit detects the Z-axis direction position of the cutting unit 20 using the pulses of the motor. The X-axis direction position detection unit, the Y-axis direction position detection unit, and the Z-axis direction position detection unit output the position in the X-axis direction of the holding table 10 and the Y-axis direction or the Z-axis direction of the lower end of the cutting blade of the cutting unit 20 to the control Unit 100.

Furthermore, in Embodiment 1, the positions of the holding table 10 and the cutting unit 20 of the processing device 1 in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined based on a predetermined reference position (not shown). In Embodiment 1, the position in the X-axis direction, the Y-axis direction, and the Z-axis direction are determined by the distances in the X-axis direction, the Y-axis direction, and the Z-axis direction from the reference position. In Embodiment 1, the XY coordinates represented by the X-axis direction and the Y-axis direction of the processing device 1 (by the distance in the X-axis direction from the reference position indicating the position in the X-axis direction and the distance in the Y-axis direction The position (coordinates represented by the distance in the Y-axis direction from the reference position) may represent an arbitrary position of the workpiece 200 held on the holding surface 11 of the holding table 10 .

Furthermore, the processing device 1 is provided with: a cassette lift 50 that places a cassette (not shown) accommodating a plurality of workpieces 200 before and after cutting processing and moves the cassette in the Z-axis direction; and a transport unit (not shown). (shown in the figure), which allows the workpiece 200 to enter and exit the cassette, and transports the workpiece 200 between the cassette and the holding table 10 . The cassette is a container that can accommodate a plurality of workpieces 200 inside.

Furthermore, as shown in FIG. 2 , the machining apparatus 1 has a machining fluid supply nozzle 60 for supplying a machining fluid 61 . The machining fluid supply nozzle 60 supplies a machining fluid 61 such as pure water to the processing area 3 where the workpiece 200 is cut. In Embodiment 1, the machining fluid supply nozzle 60 includes a shower nozzle 62 and a pair of blade nozzles 63 .

The shower nozzle 62 has a spray port that faces the edge of the cutting edge of the cutting blade 21 in the X-axis direction. The shower nozzle 62 supplies the machining fluid 61 from a machining fluid supply source (not shown). The shower nozzle 62 supplies the processing fluid 61 from the discharge port to the cutting edge of the cutting edge of the cutting blade 21 during the cutting process.

The blade nozzles 63 extend parallel to the X-axis direction and are spaced apart from each other in the Y-axis direction. The blade nozzle 63 positions the lower ends of the cutting edges of the cutting blade 21 between each other, and has an ejection port facing the lower end of the cutting edge of the cutting blade 21 . The blade nozzle 63 supplies the machining fluid 61 from a machining fluid supply source (not shown). The blade nozzle 63 supplies the processing fluid 61 from the discharge port to the lower end of the cutting edge of the cutting blade 21 during the cutting process.

The machining fluid supply nozzle 60 supplies the machining fluid 61 from the nozzles 62 and 63 to the cutting blade 21 during the cutting process, thereby supplying the machining fluid 61 to the workpiece attracted and held by the holding table 10 positioned in the machining area 3 200. The machining fluid 61 supplied during the cutting process is scattered as a spray in the machining area 3 by the rotation of the cutting blade 21 or the like. Furthermore, the machining fluid 61 supplied during the cutting process may contain machining debris generated by the cutting process and adhere to the front surface 202 of the workpiece 200 .

Furthermore, as shown in FIG. 1 , the processing device 1 is provided with a cleaning liquid supply nozzle 70 . The cleaning liquid supply nozzle 70 supplies a cleaning liquid 71 such as pure water to the front surface 202 of the workpiece 200 on which the cutting process has been performed, and removes the machining liquid 61 from the front surface 202 of the workpiece 200 . The machining liquid 61 contains adhesion to the workpiece. Processing chips such as the front surface 202 of the workpiece 200. In Embodiment 1, the cleaning liquid supply nozzle 70 is arranged between the processing area 3 and the loading/unloading area 4 .

Next, the cleaning liquid supply nozzle 70 will be described. FIG. 3 is a front view schematically showing a cleaning liquid supply nozzle and the like of the processing apparatus shown in FIG. 1 . FIG. 4 is a top view of the cleaning liquid supply nozzle shown in FIG. 3 viewed from below. Figure 5 is a cross-sectional view along line V-V in Figure 4. Figure 6 is a cross-sectional view along line VI-VI in Figure 4.

As shown in FIG. 3 , the cleaning liquid supply nozzle 70 has: a pair of pillars 72 arranged on both outer sides in the Y-axis direction of the moving path of the holding table 10 that moves in the X-axis direction by the processing feed unit 41; The main body part 73; one or more ejection ports 74 formed in the main body part 73; and grooves 75 formed in the main body part 73. The pillars 72 are respectively erected from the device body 2 and are spaced apart from each other in the Y-axis direction. In addition, in this specification, the movement path of the holding table 10 refers to the movement locus of the holding surface 11 of the holding table 10 which is processed and fed by the processing feed unit 41 .

The main body 73 is provided with an ejection port 74, and the cleaning liquid 71 is supplied downward from the ejection port 74. The main body 73 is formed in a cylindrical shape (cylindrical shape in Embodiment 1) with both ends 731 and 732 closed, and both ends in the longitudinal direction are supported by pillars 72 . The holding table 10 is above the movement path for processing in the X-axis direction. The main body part 73 has a longitudinal direction extending in the Y-axis direction, and the overall length is longer than the outer diameter of the workpiece 200 held on the holding table 10 and the outer diameter of the holding table 10 . The main body 73 supplies cleaning fluid 71 to the inside from a cleaning fluid supply source (not shown).

As shown in FIG. 4 , the main body 73 is formed with at least one ejection port 74 . As shown in FIG. 5 , the discharge port 74 penetrates the lower surface of the outer wall of the main body 73 and opens below the main body 73 . In Embodiment 1, the main body part 73 forms a plurality of ejection ports 74 at intervals (equal intervals in Embodiment 1) in the longitudinal direction. The discharge port 74 discharges the cleaning liquid 71 supplied to the inside of the main body 73 downward. In this manner, the cleaning liquid supply nozzle 70 supplies the cleaning liquid 71 downward from the discharge port 74 .

The groove 75 is formed in a concave shape from the lower surface of the main body 73 where the discharge port 74 is formed, and extends along the longitudinal direction of the main body 73 . The groove 75 guides the cleaning fluid 71 or the machining fluid 61 attached to the main body 73 to flow in the extending direction of the main body 73 . As shown in FIG. 6 , the groove 75 is formed in a concave shape from the lower surface of the main body 73 and does not penetrate the outer wall of the main body 73 . In Embodiment 1, the groove 75 is formed across one end 731 of the main body 73 and the ejection outlet 74 closest to the one end 731 , and is formed across the adjacent ejection outlets 74 of the main body 73 . The other end 732 is formed with the ejection port 74 closest to the other end 732 , and is formed across the two ends 731 and 732 of the main body 73 .

However, in the present invention, the groove 75 may not be formed across the two ends 731 and 732 of the body part 73, but may also reach the other end 732 of the hanging side that is inclined and located on the lower side. Furthermore, the groove 75 may be formed so as to connect the edge of the opening of the adjacent ejection port 74 from the edge of the opening of the ejection port 74 , or may be formed with a gap from the edge of the opening of the ejection port 74 . Furthermore, the groove 75 may be formed only in a region where the cleaning fluid 71 and the machining fluid 61 adhering to the main body 73 are difficult to flow downstream. In this way, the cleaning liquid supply nozzle 70 has the groove 75 extending along the longitudinal direction of the main body 73 in at least a part of the lower surface of the main body 73 where the discharge port 74 is formed.

Furthermore, as shown in FIG. 3 , in the cleaning liquid supply nozzle 70 , the main body 73 is provided inclined with respect to the horizontal direction (Y-axis direction) from one end 731 in the Y-axis direction to the other end 732 . In the cleaning liquid supply nozzle 70 , since the two ends 731 and 732 of the main body 73 are supported by the pair of pillars 72 , the lower end of the main body 73 , that is, the other end 732 and the first end 731 are positioned closer to Y on the movement path than the holding table 10 The outside (outside) of the axis direction.

Furthermore, in Embodiment 1, at least the lower surface of the main body 73 of the cleaning liquid supply nozzle 70 where the discharge port 74 is provided is covered with a fluororesin. Furthermore, in the present invention, slight irregularities may be formed on the lower surface of the main body 73 where at least the ejection port 74 is provided. In the present invention, at least the lower surface of the main body portion 73 is coated with fluororesin or has slight unevenness to improve water repellency. Therefore, in the cleaning liquid supply nozzle 70 , liquids such as the cleaning liquid 71 and the machining liquid 61 do not fall on the way from the one end 731 to the other end 732 of the main body 73 , and can easily flow downstream from one end to the other end.

Furthermore, as shown in FIG. 2 , the processing device 1 includes a processing chamber 80 . The processing chamber 80 is disposed on the device body 2 and surrounds the holding table 10 and the cutting unit 20 . The processing chamber 80 is provided on the apparatus body 2 and surrounds the holding table 10 across the loading and unloading area 4 and the processing area 3 . As shown in FIG. 2 , the processing chamber 80 is provided with: a plurality of side plates 81 erected from the device body 2 and connected to each other; and a partition plate 82 that divides the processing chamber 80 into a loading and unloading area 4 and a processing area 3 ; And the top plate 83 is connected to the upper end of the side plate 81.

The control unit 100 also controls each component of the processing device 1 respectively and causes the processing device 1 to perform processing operations on the workpiece 200 . In addition, the control unit 100 is a computer, and the computer has: a processing device, which has a microprocessor like a CPU (central processing unit, central processing unit); a memory device, which has a ROM (read only memory, read-only memory). Memory) or RAM (random access memory, random access memory)-like memory; and input and output interface devices. The arithmetic processing device of the control unit 100 performs arithmetic processing in accordance with the computer program stored in the memory device, and outputs control signals for controlling the processing device 1 to each component of the processing device 1 through the input/output interface device.

The control unit 100 is connected to a display unit composed of a liquid crystal display device that displays the status of the processing operation, images, etc., and an input unit used when the operator registers processing conditions and the like. The input unit is composed of a touch panel provided on the display unit.

In addition, the imaging unit 30 and the processing chamber 80 are omitted in FIG. 1 , and the cleaning liquid supply nozzle 70 is omitted in FIG. 2 .

(processing action) Next, the processing operation of the processing device 1 will be described. In the processing device 1 having the above-mentioned structure, the processing conditions are set in the control unit 100, and the cassette that has accommodated the workpiece 200 is installed in the cassette lift 50. When the control unit 100 receives an instruction to start a processing operation from an operator or the like, the processing device 1 starts a processing operation. When the machining operation is started, the control unit 100 of the machining device 1 controls the cutting unit 20 to rotate the main shaft 23, that is, the cutting blade 21, and supplies the machining fluid 61 from the machining fluid supply source to the nozzles 62 and 63. The machining fluid 61 is ejected from the ejection port, and the cleaning fluid 71 is supplied from the cleaning fluid supply source to the main body 73 of the cleaning liquid supply nozzle 70 and the cleaning fluid 71 is ejected from the ejection port 74 .

During the processing operation, the control unit 100 of the processing device 1 controls the transport unit to take out one piece of workpiece 200 from the cassette, and place the workpiece 200 on the holding surface 11 of the holding table 10 . During the processing operation, the processing device 1 attracts and holds the workpiece 200 on the holding surface 11 .

The control unit 100 of the processing device 1 controls the moving unit 40 to move the holding table 10 toward the processing area 3 and below the imaging unit 30, and uses the imaging unit 30 to take a picture of the workpiece 200 attracted and held on the holding table 10. , while performing alignment. During the processing operation, the control unit 100 of the processing device 1 controls the moving unit 40 and the like based on the processing conditions, and causes the cutting blade 21 to cut into the workpiece while relatively moving the cutting blade 21 and the workpiece 200 along the planned dividing line. The object 200 is cut along the planned dividing lines.

The processing device 1 cuts the planned division line of the workpiece 200 along the processing conditions, and divides the workpiece 200 into individual components. When the cleaning liquid supply nozzle 70 processes the workpiece 200 , the machining liquid 61 , machining chips, machining chips contained in the machining liquid 61 , etc. may adhere to the main body 73 . The attached machining fluid 61 is maintained attached to the main body 73 by surface tension, and may fall due to vibration of the machining device 1 .

When all the planned dividing lines of the workpiece 200 are cut, the control unit 100 of the processing device 1 controls the moving unit 40 to move the holding table 10 from the processing area 3 toward the loading/unloading area 4 . At this time, when the holding table 10 passes under the main body part 73 of the cleaning liquid supply nozzle 70 , the front surface 202 of the workpiece 200 held on the holding table 10 is cleaned by the cleaning liquid 71 . In addition, when the cleaning liquid supply nozzle 70 cleans the front surface 202 and the like of the workpiece 200 , the cleaning liquid 71 including machining debris may adhere to the main body 73 . The attached cleaning fluid 71 is maintained attached to the main body 73 by surface tension, and may fall due to vibration of the processing device 1 .

During the processing operation, the processing device 1 stops the movement of the holding table 10 in the loading and unloading area 4 and stops the suction and holding of the workpiece 200 on the holding table 10 . During the processing operation, the control unit 100 of the processing device 1 controls the transport unit to transport the workpiece 200 from the holding surface 11 of the holding table 10 into the cassette. If the processing device 1 cuts all the workpieces 200 in the cassette, the processing operation ends.

Furthermore, in the processing device 1 , the cleaning liquid 71 adhering to the main body 73 of the cleaning liquid supply nozzle 70 moves toward the other end 732 , which is the lower end of the main body 73 . In the processing device 1 , the cleaning liquid 71 attached to the main body 73 of the cleaning liquid supply nozzle 70 falls downward from the other end 732 , which is the lower end of the main body 73 , as shown in FIG. 3 . Therefore, the processing apparatus 1 can prevent the cleaning liquid 71 falling from the main body part 73 of the cleaning liquid supply nozzle 70 from adhering to the holding table 10 or the workpiece 200 held on the holding table 10 .

In the cleaning liquid supply nozzle 70 of the conventional processing device 1 shown in FIG. 7 , since the main body 73 is arranged along the horizontal direction (Y-axis direction), the cleaning liquid 71 falling from the main body 73 may sometimes It falls from the main body 73 toward the holding table 10 or the workpiece 200 held by the holding table 10 . In addition, FIG. 7 is a front view schematically showing the cleaning liquid supply nozzle and the like of the processing apparatus of the comparative example. In FIG. 7 , the same parts as those in Embodiment 1 are denoted by the same reference numerals, and description thereof is omitted.

When the cleaning liquid supply nozzle 70 of the conventionally used processing device 1 shown in FIG. 7 transports the workpiece 200 before cutting to the holding table 10, the cleaning liquid 71 may fall from the main body 73 and adhere. on the workpiece 200 or the holding surface 11 of the holding table 10 . Furthermore, in the cleaning liquid supply nozzle 70 of the conventionally used processing device 1 shown in FIG. 7 , after the workpiece 200 before cutting is carried out from the holding table 10 , the cleaning liquid 71 may fall from the main body 73 , and the cleaning liquid 71 may fall from the main body 73 . Attached to the exposed holding surface 11 of the holding platform 10 . Furthermore, when the cleaning liquid supply nozzle 70 of the conventionally used processing device 1 shown in FIG. 7 moves the holding table 10 without holding the workpiece 200, the cleaning liquid 71 may fall from the main body 73. And attached to the holding surface 11 of the holding base 10 . The machining chips contained in the adhering cleaning fluid 71 are difficult to remove if they adhere.

Therefore, in the processing device 1 of Embodiment 1 described above, the main body 73 of the cleaning liquid supply nozzle 70 is inclined with respect to the horizontal direction, so that the cleaning liquid 71 attached to the main body 73 is tilted toward the lower end, that is, the other end. One end 732 flows. Therefore, in the processing device 1 of Embodiment 1, the cleaning fluid 71 containing processing chips stays on the main body 73 due to surface tension, and falls from the other end 732 when it falls, so it can be suppressed from dripping to the workpiece. 200 or keep the table on 10.

As a result, the processing device 1 of Embodiment 1 exhibits the effect of suppressing the cleaning liquid 71 adhering to the cleaning liquid supply nozzle 70, the machining debris contained in the cleaning liquid 71, the machining liquid 61 adhering to the cleaning liquid supply nozzle 70, and At least any of the machining chips contained in the machining fluid 61 falls onto the workpiece 200 or the holding table 10 .

Furthermore, in the processing apparatus 1 of Embodiment 1, the overall length of the main body 73 of the cleaning liquid supply nozzle 70 in the Y-axis direction is set to be longer than the outer diameter of the holding table 10 and the outer diameter of the workpiece 200 held on the holding table 10 . It is long and supports both ends 731 and 732 of the main body 73 with a pair of pillars 72 arranged on both outer sides of the movement path of the holding table 10 in the Y-axis direction. Therefore, the processing device 1 of Embodiment 1 positions both ends 731 and 732 of the main body 73 at a position away from the holding table 10 and the workpiece 200 held by the holding table 10 in the Y-axis direction. As a result, in the processing device 1 of Embodiment 1, the cleaning liquid 71 containing processing chips dropped from the lower end, that is, the other end 732 , drops to a position away from the holding table 10 and the workpiece 200 held on the holding table 10 .

In addition, the present invention is not limited to the above-described embodiment. That is, various modifications and implementations can be made without departing from the gist of the present invention.

1: Processing device 3: Processing area 10:Keeping platform 20: Cutting unit (processing unit) 21: Cutting blade (processing tool) 23:Spindle 41: Processing feed unit 60:Machining fluid supply nozzle 61: Processing fluid 70: Cleaning fluid supply nozzle 71:Cleaning fluid 73: Ontology part 74:Spout 75:Slot 200: Processed object 731:One end 732:The other end (lower end)

FIG. 1 is a perspective view schematically showing a structural example of a processing device according to Embodiment 1. FIG. 2 is a cross-sectional view schematically showing the main part of the processing device shown in FIG. 1 . FIG. 3 is a front view schematically showing a cleaning liquid supply nozzle and the like of the processing apparatus shown in FIG. 1 . FIG. 4 is a top view of the cleaning liquid supply nozzle shown in FIG. 3 viewed from below. Figure 5 is a cross-sectional view along line V-V in Figure 4. Figure 6 is a cross-sectional view along line VI-VI in Figure 4. FIG. 7 is a front view schematically showing a cleaning liquid supply nozzle and the like of the processing apparatus of the comparative example.

1: Processing device

2:Device body

10:Keeping platform

11: Keep the surface

70: Cleaning fluid supply nozzle

71:Cleaning fluid

72:Pillar

73: Ontology part

74:Spout

75:Slot

200: Processed object

201:Substrate

202:front

731:One end

732:The other end

Claims (5)

A processing device, characterized by having: Holding table, which holds the workpiece; A processing unit having a processing tool for processing the workpiece held on the holding table; a processing and feeding unit that processes and feeds the holding table in the X-axis direction; and A cleaning liquid supply nozzle having: a body portion disposed above a moving path for processing and feeding the holding table in the X-axis direction, and extending in the Y-axis direction intersecting the X-axis direction; and one or more a discharge port formed in the main body part, and supplying cleaning liquid downward from the discharge port, In the cleaning liquid supply nozzle, the main body portion is inclined from one end to the other end in the Y-axis direction. The processing device according to claim 1, further comprising: a processing fluid supply nozzle that supplies the processing fluid to a processing area where the workpiece is processed. The processing device of claim 1, wherein the processing tool is a cutting blade, The cutting blade is fixed to a rotatable spindle. The processing device of claim 1, wherein the lower end of the body part is positioned further outside than the holding platform. The processing device of claim 1, wherein a groove extending along the longitudinal direction of the body is formed on at least a portion of the surface of the body where the ejection port is formed.